June 4th-6th, 2025; Harvard University

This symposium, co-organized by LAB14 Group, aims to bring together leading researchers, industry experts, and innovators from Harvard and around the world, along with a select group of vendors showcasing their cutting-edge research, state-of-the-art fabrication and advanced packaging technologies.

The symposium will feature a diverse range of invited talks, company presentations, poster sessions, and workshops covering key topics such as 3D lithography, advanced photolithography, e-beam writing, SPM-lithography, resist materials & processing, simulation & optimization, and advanced packaging integration. This event provides a unique opportunity to engage with top researchers and participate in discussions that will shape the future of direct writing and integration technologies.

To register, please visit:
https://secure.touchnet.net/C20832_ustores/web/store_main.jsp?STOREID=185&SINGLESTORE=true

Event Venues:

• Talks: Geological Lecture Hall, 24 Oxford Street, Cambridge, MA 02138
• Workshops & Afternoon Events: LISE Building, 11 Oxford Street, Cambridge, MA 02138

Invited Speakers Include:

• Prof. Ahmed Busaina (Northeastern University, nanoOps)
• Prof. Marko Lončar (Harvard University)
• Prof. Jia Liu (Harvard University)
• Dr. Bart Machielse (CTO, Lightsynq)
• Dr. Tianyang Ye (CTO, Axoft)
• Dr. Mian Zhang (CEO, Hyperlight)

Participating Vendors: Heidelberg Instruments, Nanoscribe, Vanguard Automation, Notion, Nanosurf, NanoFrazor, Osiris, Elionix, Microresist, GenISys, Hitachi, and Applied Microengineering Ltd.