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| Training: Zeiss SEM Part 1: Online training - Harvard Training Portal | | Trainer: Tim Cavanaugh | The SEM Part 1 training is available in an online format. You must pass this online training before taking the hands-on SEM training for our field emission Zeiss SEMs (FESEMs) or the EVO SEM. There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000007001
PLEASE NOTE THAT THIS TRAINING IS ONLY FOR FULLY ENROLLED CNS USERS. IF YOU ARE LOOKING FOR THE FREE CNS IMAGING GROUP MASTERCLASS WEBINARS, PLEASE SEE FURTHER BELOW
Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
| | | | Training: B15A online safety training - Harvard Training Portal | | Trainer: Jules Gardener | CNS users who wish to use the instruments inside room B15A must complete the B15A safety training before gaining access to this room. The LISE B15A room safety training is available in an online format from https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/app/shared;spf-url=common%2Fledetail%2Fcours000000000008101
Please copy this URL into your browser to take the training. We recommend using Chrome, Safari or Internet Explorer.
You must pass this online training before room access can be granted. There is no sign-up required for our online trainings and these can be taken by CNS users at any time.
Any CNS User with a HU Key is eligible to take this training. | | | | Training: HAR-053 sputter coater training (online) - Harvard Training Portal | | Trainer: Jules Gardener | This training is for the EMS sputter coaters located in the CNS Imaging sample preparation room (LISE B15A). These tools are optimized for coating SEM samples with a thin conductive layer. These coaters cannot be used for coating thick (>20nm) films. Pt/Pd and Au coatings are available.
Sputter coater training is available in an online format for these tools. You must pass this online training, and have completed the B15A room safety training (also available online), before access to the sputter coaters can be granted. Once you have completed these requirements, you will have access to both sputter coaters. There is no sign-up required for our online trainings and these can be taken by CNS users at any time. You can access the sputter coater training course at https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/leclassview/dowbt000000000004421
Please copy this URL into your browser to take the training. We recommend using Chrome, Safari or Internet Explorer.
Any CNS User with a HU Key is eligible to take this training | | | | Training: Online TEM training course - Harvard Training Portal | | Trainer: Jules Gardener | This is a new online training which is required as the first step of TEM training for the JEOL 2100 and Hitachi 7800 instruments. This training will provide an introduction to TEM concepts and background about our TEMs. You must pass the assessment at the end of this online course before attending an in-person TEM training on the JEOL 2100 or Hitachi 7800 instruments. There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000010142
Any CNS User with a HU Key is eligible to take this training. | | | | Training: SEC - AFM Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Bruker JPK NanoWizard 4 XP atomic force microscope, including mechanical and fluorescence-correlated measurements. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - DLS/Zetasizer Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Malvern Zetasizer Pro for dynamic light scattering and zeta potential measurements. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - DMA Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Mettler Toledo DMA 1 dynamic mechanical analyzer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - DSC Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the TA Discover DSC 250 differential scanning calorimeter. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - FTIR Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Nicolet iS50 infrared spectrometer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - Nanoindenter Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Bruker Hysitron TS 77 nanoindenter. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - NMR Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Magritek Spinsolve 80 nuclear magnetic resonance spectrometer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - Optical Profilometer Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Bruker ContourX optical profilometer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - Rheometer Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the TA Discovery HR 20 Rheometer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - TGA Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the TA Discovery TGA 550 thermogravimetric analyzer. Email colella@fas.harvard.edu to schedule. | | |
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| Training: Sharon TE-3, 4, and 5 Thermal Evaporator Training - LISE G07 (CNS Cleanroom), PVD Bay | | Trainer: Ed Macomber | | Training on TE-3, 4 and 5 for thermal evaporation of metals is covered. We meet at the system in the CNS cleanroom PVD bay. Training takes about 2 hours. Venting, loading a sample, pumping and evaporation are performed and explained. For these TE systems, users supply their own deposition materials and boats (sources). CNS supplies the materials for training. After this training you will have access to all 3 systems, which are collectively capable of depositing: Ti, Cr, Cu, Ag, Au, Al, Ni, etc. Check the links in the confirmation email for important attachments including the S.O.P. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:30 pm - 5:00 pm
(Please review document links in email confirmation) | 3 | FULL | Registration Closed | | |
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| Training: AJA SP-2 Sputtering System Training - LISE G07 (CNS Cleanroom) | | Trainer: Ed Macomber | The SP-2 system is a 6-gun magnetron sputtering machine with (3) RF guns and (3) DC guns to cover a range of metals, semi-conductors, and dielectric materials, including Au, Pt, and magnetics. Sputtering materials are loaded into the system every other week on an "as-requested" basis. This means you may wait up to four weeks (or more) for your material depending on system demand at the time. Substrate pre-cleaning, heating, co-sputtering, and reactive sputtering are all available on this system.
Be sure to read the SOP BEFORE the training. It will be linked in the training confirmation email.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 2:30 pm
Look in the confirmation email for important attachments including the S.O.P. | 2 | FULL | Registration Closed | | | | Training: ALD - Savannah ALD Training - IN PERSON - INSIDE CLEANROOM - Inside cleanroom, at the ALD systems (Wet process bay) | | Trainer: Mac Hathaway | | Training for ALD-1 and ALD-4, Oxide ALD | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
| 5 | 5 | Register! | | | | Training: ALD-3 PdR ALD System Training - PVD Bay (last bay in cleanroom); small red and white instrument on far wall | | Trainer: Mughees Khan | | This training provides users the protocols needed to operate the ALD-3 benchtop thermal ALD system. This system is primarily used for depositing Al2O3, SiO2 and Pt thin films on 4" substrates or 3D objects up to 8mm in height. The tool is capable of 40C deposition of Al2O3 and down to 100C for SiO2 and 125C for Pt. Both the SiO2 and Pt processes utilize Ozone as the counter reactant. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
prerequisite: Introduction to Thin Film Growth and Processing | 2 | FULL | Registration Closed | | | | Training: FIB-6 Zeiss Crossbeam Basic Training - B15E | | Trainer: Stephan Kraemer | | Introductions into the basic operation of the Zeiss Crossbeam 550 Focused Ion Beam microscope, including general workflow, beam-assisted deposition, basics of ion-material interaction, preparation of cross sections and high-resolution imaging. More advanced tasks, such as TEM sample preparation, 3D serial sectioning or cryo-FIB, will build on the introduced concepts. | | Time | Max Attendees | Available | CNS Users ONLY |
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9:00 am - 1:00 pm
SEM training recommended but not necessary | 4 | 4 | Register! | | | | Training: Introduction to Thin Film Processes - Outside Cleanroom (at the CNS Pedagogical Area!) | | Trainer: Mac Hathaway | All About Thin Films, with an emphasis on Practical Uses and Important Process Variables
Prerequisite for ALL Thin Film Equipment training | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:30 am - 12:00 pm
| 10 | 5 | Register! | | | | Training: LPCVD and APCVD Training (CVD 5,6,7,9,10,11) - Cleanroom Dry Processing Bay | | Trainer: Mughees Khan | Introduction to Thin Film Growth and Processing is required before you can sign up for this training.
This is a general training for all of the LPCVD and APCVD furnaces. These Tystar furnaces can accommodate anything from a single 1cm substrate up to two full cassettes (50) of 6" wafers.
The various furnaces encompass the following processes:
- Anneals of non-metal containing samples from 250 to 1100C under O2, N2, and H2/He
- Anneals of metal containing samples from 250 to 1100C under N2 and H2/He
- Low stress and stoichiometric silicon nitride
- Amorphous and polycrystalline silicon (doped with P or B or undoped)
- SiO2 from TEOS (conformal, additive SiO2 process)
- SiO2 from oxidation of silicon using H2O or O2
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:00 am - 12:00 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 2 | 2 | Register! | | | | Training: NF-Training Litho. Intro. - Online by Zoom | | Trainer: Bok Yeop Ahn | This class is Introduction to Lithography at CNS, covers basics of photolithography, e-beam lithography, and 3D laser lithography. Users are encouraged to take this class before taking any other photo- or e-beam lithography trainings. As listed below, there are two prerequisites that you must finish before registering to this training session:
- LISE Safety Training (John Sweeney: john_sweeney@harvard.edu)
- CNS Cleanroom Orientation (Another name of this training is General Nanofabrication Facility Access, John Tsakirgis: johntsakirgis@cns.fas.harvard.edu)
Bok is inviting you to a scheduled Zoom meeting.
Time: Oct 11, 2022 09:30 AM Eastern Time (US and Canada)
Join Zoom Meeting
https://us06web.zoom.us/j/89167531385?pwd=cnVuWVpxTjhFYmdWUWE2cTlsMkJwUT09
Meeting ID: 891 6753 1385
Passcode: 565556
| | Time | Max Attendees | Available | CNS Users ONLY |
|---|
9:30 am - 10:30 am
| 10 | 2 | Register! | | | | Training: Office Hour for Nano-/Micro- Fabrication Related Questions - Online with Zoom | | Trainer: Ling Xie | Ling Xie is inviting you to a scheduled Zoom meeting.
Topic: Zoom Meeting for training
Time: This is a recurring meeting Meet anytime
Join Zoom meeting
https://harvard.zoom.us/j/99096815765?pwd=NGo3N2xocTV5T0hIRXdWcW80Y1NzUT09
Password: 315648
Join by telephone (use any number to dial in)
+1 301 715 8592
+1 309 205 3325
+1 312 626 6799
+1 646 931 3860
+1 929 436 2866
+1 669 444 9171
+1 669 900 6833
+1 719 359 4580
+1 253 215 8782
+1 346 248 7799
+1 386 347 5053
+1 564 217 2000
International numbers available: https://harvard.zoom.us/u/abwNsmaaBL
One tap mobile: +13017158592,,99096815765# US (Washington DC)
Join by SIP conference room system
Meeting ID: 990 9681 5765
99096815765.315648@zoomcrc.com
| | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 3:30 pm
| 1 | 1 | Register! | | | | Training: RIE-8 - STS ICP RIE Training - CNS Cleanroom LISE G07 | | Trainer: Ling Xie | It is required to take the "Introduction to Dry Etching" before this training.
The RIE 8 is used to etch silicon, silicon oxide, silicon nitride, silicon carbide, and 2D materials.
Chamber Pre-Cleaning and Conditioning are Required: Before etching any samples, users must run the O2-Clean recipe for 20 minutes and the recipe to be used for 5-10 minutes.
The STS MPX/LPX RIE system is an Inductively Coupled Plasma (ICP) etching system. Using the ICP technology, this RIE is characterized with high plasma density, low operating pressure, high etch rate, excellent etch uniformity, and low energy ion damage. Available etching gases on this system include SF6, C4F8, O2, H2, Ar, Cl2, BCl3, and HBr. The maximum coil and platen powers are 1200W and 250W, respectively. Equipped with a chiller, the MPX/LPX system allows the substrate temperature to be controlled from 15ฐC to 30ฐC. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 2:30 pm
| 2 | FULL | Registration Closed | | | | Training: SEM-10, User training for Hitachi SU8230 SEM - G07, Inside Cleanroom at the tool | | Trainer: Bok Yeop Ahn | This is a training session for HITACHI SU8230 SEM in cleanroom at CNS. As listed below, there are several prerequisites that you must finish before getting to this tool.
- LISE Safety Training (John Sweeney: john_sweeney@harvard.edu)
- CNS Cleanroom Orientation (Another name of this training is General Nanofabrication Facility Access, John Tsakirgis: johntsakirgis@cns.fas.harvard.edu)
- CNS Online SEM Training Module (Online course) https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/leclassview/dowbt-00008486
Please make sure that you finish all the prerequisites before registering to the Hitachi SU8230 SEM training. Let me know if you may have any questions.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
| 3 | FULL | Registration Closed | | |
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| Training: RIE-13 - Oxford PlasmaPro 100 Cobra 300 - In front of the tool, inside the G7 cleanroom. | | Trainer: Kenlin Huang | | RIE-13 - Oxford PlasmaPro 100 Cobra 300 training | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:00 pm - 4:00 pm
617-495-1738 | 4 | 3 | Register! | | | | Training: CVD-14 Oxford ICP-CVD - Low Temp - CNS cleanroom - Dry processing bay at CVD-14 | | Trainer: Mughees Khan | | Introduction to Thin Film Growth and Processing is required before you can sign up for training. This training will enable users to grow high quality SiO2, SiNx, and a-Si films. No doping or active cooling is available on this tool. All baseline processes are at 80C with the exception of a-Si, which runs at 200C. Full temperature range is from -20C to 400C. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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11:00 am - 12:30 pm
prerequisite: Introduction to Thin Film Growth and Processing | 3 | 1 | Register! | | | | Training: CVD-3 STS PECVD - CNS Cleanroom - Dry processing bay | | Trainer: Mughees Khan | This training will provide users the necessary technique to deposit high quality SiO2, SiNx, and a:Si films at temperatures from ~200 to 350C. a-Si films can also be doped with B or P.
This tool is equipped with two RF generators, one at 13.56MHz (High frequency, HF recipes) and 380 kHz (low frequency, LF recipes). There are also recipes that take advantage of both RF generators to yield films with lower stress esp. silicon nitride films. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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9:30 am - 11:00 am
Prerequisite: Introduction to Thin Film Growth and Processing | 3 | 2 | Register! | | | | Training: Headway Photoresist Spiner - SC5 & VPO - Cleanroom Photo Bay | | Trainer: Malcolm Tse | Introduction to Spin Coating - to deposit uniform coating of Photoresist on a flat surface.
Basic operation, select and edit program of the Headway PWM32 series Spinner. HMDS coating with Yes Vapor Prime Oven. | | Time | Max Attendees | Available | CNS Users ONLY |
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9:30 am - 10:30 am
| 3 | FULL | Registration Closed | | | | Training: Jupiter XR Atomic Force Microscopy (AFM) Training Part-1 (SPM-12) Inside the Cleanroom G07 - LISE G07 Nanofabrication Cleanroom | | Trainer: Jason Tresback | | This training event will focus on the basic imaging and operation of the Jupiter XR AFM available inside the Nanofabrication Cleanroom (SPM-12). Starting from the basic principles of AFM, users will also learn about cantilever selection and installation, different imaging modes, image quality improvement, and data processing and analysis methods. SPM probes are provided for training; however, users must supply their own probes during independent use. Full independent tool access requires completion of part-1 basic imaging and operation demonstrated by staff, followed by part-2 individual user assisted session that serves as a qualification for independent use on another day. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:00 pm - 4:00 pm
| 3 | 2 | Register! | | | | Training: Metrology for Nanofabrication Part-1 (Stylus Profilometry, Ellipsometry, and Electrical Property Measurements) - Inside LISE G07 Nanofabrication Cleanroom | | Trainer: Jason Tresback | | It is recommended but not required that you register and attend the Introduction to Metrology for Nanofabrication Lecture. The metrology for nanofabrication part-1 training event will focus on fundamental measurement tools for nanofabrication including, contact/stylus surface Profilometer (DekTak XT and 6m) (PL-5/8), multi-wavelength scanning Ellipsometer (FS-150XY) (ES-3), Thick film Reflectometer (MET-35), sheet resistance Rs mapping (CDE-ResMap 4-Pt Probe system) (MET-2), and Semiconductor Parameter Analyzer w/ Signatone 4-Pt Probe Station (Agilent 4156C & Signatone 4pt Probe Station)(PB-1 & CE-1/2). Full independent access to these tools listed above can be achieved, however the amount of time spent on each tool will vary based on participants. We meet inside the Cleanroom gowning area or within the Metrology Bay inside the CNS cleanroom (G07). | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:30 am - 12:00 pm
| 3 | FULL | Registration Closed | | | | Training: MLA150 Maskless Aligners - Metrology bay in the cleanroom | | Trainer: Guixiong Zhong | | Basic training to use both maskless aligners, the MLA150 and MLA-2. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 2:30 pm
| 4 | FULL | Registration Closed | | | | Training: OL-4, SUSS MA6 Mask Aligner - G07, Inside Cleanroom at the tool | | Trainer: Bok Yeop Ahn | This is a training session for MA6 Mask Aligner in the cleanroom at CNS. As listed below, there are several prerequisites that you must finish before getting to MA6 mask aligner training.
- LISE Safety Training (John Sweeney: john_sweeney@harvard.edu)
- CNS Cleanroom Orientation (Another name of this training is General Nanofabrication Facility Access, John Tsakirgis: johntsakirgis@cns.fas.harvard.edu)
- Introduction to Lithography (Bok Yeop Ahn: byahn@cns.fas.harvard.edu)
- Wet bench and Chemical Safety Training Part I and II (Mac Hathaway: hathway@cns.fas.harvard.edu)
- Resister Spinner Training (Malcolm Tse: mtse@cns.fas.harvard.edu)
Let me know if you may have any questions.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:30 pm
| 3 | FULL | Registration Closed | | | | Training: Optical Profiler Training (PL-6) - Inside LISE G07 Nanofabrication Cleanroom | | Trainer: Jason Tresback | | This training event basic operation of the Optical Profiler (CCI HD) (PL-6) which uses white light interferometry (WLI) to measure roughness, step-heights, and topography with sub-nm vertical resolution and 1um lateral resolution. This is a rapid, non-contact, and non-destructive technique to analyze small areas (80x80 um) and large areas (100x100 mm). Limitations include thin, transparent films and dissimilar materials. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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11:30 am - 12:30 pm
| 3 | 2 | Register! | | | | Training: RIE 11 Plasma-Therm Versaline Diamond Etcher - CNS Cleanroom, Wet Process Bay | | Trainer: Ling Xie | It is required to take the "Introduction to Dry Etching" before this training.
RIE 11 is used for diamond etch only!
The Versaline RIE is an Inductive Coupled Plasma Etching System with a maximum ICP source power of 1,200W and a maximum substrate bias power of 600W. The system is configured to handle 4 wafers and equipped with mechanical clamping and backside helium heat-conducting features. Its substrate temperature can be controlled from 10ฐC to180ฐC. In addition, temperatures of three other components inside the chamber can also be controlled from room temperature to 120ฐC, including Lid, Ceramic Spool, and Metal Liner. Setting these components at elevated temperatures before processing will reduce by-product coating speed on chamber walls and stabilize chamber conditions for the first couple of runs after the tool was at a stand-by state for a long time. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 2:30 pm
| 2 | 2 | Register! | | | | Training: RIE-7 - Unaxis Shuttleline ICP RIE - In front of the tool, inside the G7 cleanroom. | | Trainer: Kenlin Huang | | RIE-7 - Unaxis Shuttleline ICP RIE | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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4:00 pm - 5:00 pm
617-495-1738 | 4 | 4 | Register! | | | | Training: Sharon EE-3 e-beam evaporator training - We meet in the cleanroom PVD bay (last bay inside of LISE G07) | | Trainer: Ed Macomber | Please read the training description all the way through:
E-beam evaporation in EE-3 is covered; EE-3 can deposit 19 different materials (metals). All materials are user supplied for EE-3 (pellets and crucible liners). We will cover venting, loading the sample, pumping down (vacuum system) and the actual deposition. Plan on ~1.5 hr for this training. This is a manually operated deposition system and will likely take most users a few times using it to become comfortable with the machine. We meet in the cleanroom PVD bay (last bay inside LISE G07).
Once you sign up, you will receive the training confirmation email which will contain links to documents including the SOP. Please be sure to review the SOP BEFORE the training.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 2:00 pm
(Please review document links in email confirmation) | 4 | FULL | Registration Closed | | | | Training: Thermo Scientific K-Alpha+ XPS training - LISE G27 | | Trainer: Hao-Yu (Greg) Lin | | training on Thermo Scientific K-Alpha+ XPS system | | Time | Max Attendees | Available | CNS Users ONLY |
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9:30 am - 11:30 am
| 2 | 1 | Register! | | | | Training: WB-2 EVG 501 Wafer Bonder - G07, Inside Cleanroom at the tool | | Trainer: Bok Yeop Ahn | This training covers the standard operation procedure for the WB-2 EVG 501 Wafer Bonder. Users will learn wafer bonding techniques:
1) Direct
2) Thermo-Compression
3) Adhesive
** Users may need Wet Bench/Acid/RCA Training
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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9:30 am - 10:30 am
| 3 | 1 | Register! | | | | Training: Wetbench and Chemical Safety Training Part I and II (IN PERSON!!) - Outside Cleanroom (at the CNS Pedagogical Area!) | | Trainer: Mac Hathaway | | Training for Wetbenches and Chemical Safety. Prerequisite for all photolithography training. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:00 am - 12:30 pm
| 10 | 3 | Register! | | | | Training: XeF2 Etcher Training - CNS Cleanroom at the tool | | Trainer: Ling Xie | XeF2 etch is mainly for isotopically etching silicon. It is widely used for releasing MEMS structures, such as switches, cantilevers, bridges, mirrors, membranes, channels, and thermal isolation cavities. Its merits include highly selective etch, no stiction problems as existed with wet etch, and long under cuts. XeF2 also etches Ge, Mo and SiGe and transitional metals W, Ti, Ta, TiN and TaN under certain conditions such as high temperatures, but wont etch Al, Ni, Cr, Pt, Ga, MgO, ZnO, AlN, GaAs, resist, and PDMS.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:30 pm - 3:30 pm
| 2 | 1 | Register! | | | | Training: Zeiss Gemini 560 Experienced User Training - LISE B15i | | Trainer: Tim Cavanaugh | | This is an orientation training currently being offered for experienced Zeiss SEM users (previously trained on SEM-4 or SEM-8). This training will cover the basics of the software updates and new features on the Gemini 560, and give previously trained users an opportunity to register SmartSEM software accounts. Please contact me with any questions. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 12:00 pm
| 12 | 9 | Register! | | |
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| Training: ALD-2 GEMStar ALD Training - Wet Processing Bay - CNS cleanroom | | Trainer: Mughees Khan | | This training introduces users protocols needed to operate ALD-2. This system is primarily used for depositing conducting metal nitride and potentially pure metal films with good uniformity, conformality, and material purity. Deposition rates are slow, in the range of 1-3 ล per minute, but extremely high-aspect-ratio fill (40:1) is easily achievable. Currently, only WNx is available. In addition, Al2O3 can also be deposited on this tool. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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9:00 am - 10:00 am
prerequisite: Introduction to Thin Film Growth and Processing | 2 | 2 | Register! | | | | Training: CNS cleanroom orientation - meet in front of G07 | | Trainer: John Tsakirgis | | To understand safety and protocols for G07 | | Time | Max Attendees | Available | CNS Users ONLY |
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9:30 am - 11:00 am
please be prompt | 8 | 6 | Register! | | | | Training: RIE-9 - Anatech Barrel Plasma System and RIE-14 - Samco PC-300 Plasma Cleaning System - In front of the tool, inside the G7 cleanroom. | | Trainer: Kenlin Huang | | Tool training for both RIE-9 - Anatech Barrel Plasma System and RIE-14 - Samco PC-300 Plasma Cleaning System | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:30 pm - 4:00 pm
617-495-1738 | 4 | FULL | Registration Closed | | | | Training: Wire Bonder - LISE G27 | | Trainer: Guixiong Zhong | | Basic training to use the WB-1 wire bonder. The tool is configured to bond 1mil Al wire to gold pad. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 2:00 pm
| 4 | 3 | Register! | | | | Training: Zeiss Gemini 360 New User Training - LISE B15i | | Trainer: Tim Cavanaugh | | This is a training session on the Zeiss Gemini 360 FESEM for users who have not previously used Zeiss SEM tools at CNS. The Gemini 360 offers high resolution secondary and backscatter imaging at high vacuum, as well as low vacuum capability. This will be an in depth training session covering all aspects of the hardware and software and the entire imaging process. Please complete the pre-requisite Part 1 Online training prior to registering for this event. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 1:00 pm
| 4 | 3 | Register! | | |
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| Training: AJA SP-2 Sputtering System Training - LISE G07 (CNS Cleanroom) | | Trainer: Ed Macomber | | The SP-2 system is a 6-gun magnetron sputtering machine with (3) RF guns and (3) DC guns to cover a range of metals, semi-conductors, and dielectric materials, including Au, Pt, and magnetics. Sputtering materials are loaded into the system every other week on an "as-requested" basis. This means you may wait up to four weeks (or more) for your material depending on system demand at the time. Substrate pre-cleaning, heating, co-sputtering, and reactive sputtering are all available on this system. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 2:30 pm
Look in the confirmation email for important attachments including the S.O.P. | 2 | FULL | Registration Closed | | |
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| Training: FIB-4 FEI Helios Basic Training - B15F | | Trainer: Stephan Kraemer | | Introduction into the basic operation of the Helios Nanolab 660 Focused Ion Beam microscope, including general workflow, beam-assisted deposition, basics of ion-material interaction, preparation of cross sections and high-resolution imaging. More advanced tasks, such as TEM sample preparation or 3D serial sectioning, will build on the introduced concepts. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
9:00 am - 1:00 pm
Prior SEM training recommended but not necessary | 4 | 4 | Register! | | | | Training: Introduction to Dry Etching - Online, Zoom link: https://harvard.zoom.us/j/99096815765?pwd=NGo3N2xocTV5T0hIRXdWcW80Y1NzUT09 Or Meeting ID: 990 9681 5765, password: 315648 | | Trainer: Ling Xie | A online training, Zoom link: https://harvard.zoom.us/j/99096815765?pwd=NGo3N2xocTV5T0hIRXdWcW80Y1NzUT09
Or Meeting ID: 990 9681 5765, password: 315648
In this introduction class, the topics to be discussed include:
1. Dry Etch Methods
2. Plasma in Dry Etch Processes
3. Reactive Ion Etch
i). Chemical etch
ii). Physical etch
iii). Etch direction control
4. Ion Beam Etch
5. Dry Etch Technologies & Capabilities at CNS
6. Open Discussion
| | Time | Max Attendees | Available | CNS Users ONLY |
|---|
11:00 am - 12:00 pm
| 12 | 8 | Register! | | | | Training: Introduction to Scan Probe Microscopy Lecture - Hallway Outside LISE G07 | | Trainer: Jason Tresback | | This lecture is an informal discussion about the scan probe microscopy capabilities available at CNS. The introduction serves as a tutorial and guidance for choosing individual AFM tool trainings. We will cover basic AC tapping mode for roughness, topography, and step heights, as well as mechanical, electrical, and magnetic property measurements using AFM. We recommend and encourage you to attend before registering for individual AFM tool trainings. Please email jtresback@cns.fas.harvard.edu if you have any questions | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
11:00 am - 12:00 pm
| 4 | 4 | Register! | | | | Training: Office Hour for Nano-/Micro- Fabrication Related Questions - Online with Zoom | | Trainer: Ling Xie | Ling Xie is inviting you to a scheduled Zoom meeting.
Topic: Zoom Meeting for training
Time: This is a recurring meeting Meet anytime
Join Zoom meeting
https://harvard.zoom.us/j/99096815765?pwd=NGo3N2xocTV5T0hIRXdWcW80Y1NzUT09
Password: 315648
Join by telephone (use any number to dial in)
+1 301 715 8592
+1 309 205 3325
+1 312 626 6799
+1 646 931 3860
+1 929 436 2866
+1 669 444 9171
+1 669 900 6833
+1 719 359 4580
+1 253 215 8782
+1 346 248 7799
+1 386 347 5053
+1 564 217 2000
International numbers available: https://harvard.zoom.us/u/abwNsmaaBL
One tap mobile: +13017158592,,99096815765# US (Washington DC)
Join by SIP conference room system
Meeting ID: 990 9681 5765
99096815765.315648@zoomcrc.com
| | Time | Max Attendees | Available | CNS Users ONLY |
|---|
3:00 pm - 3:30 pm
| 1 | 1 | Register! | | | | Training: SEM-10, User training for Hitachi SU8230 SEM - G07, Inside Cleanroom at the tool | | Trainer: Bok Yeop Ahn | This is a training session for HITACHI SU8230 SEM in cleanroom at CNS. As listed below, there are several prerequisites that you must finish before getting to this tool.
- LISE Safety Training (John Sweeney: john_sweeney@harvard.edu)
- CNS Cleanroom Orientation (Another name of this training is General Nanofabrication Facility Access, John Tsakirgis: johntsakirgis@cns.fas.harvard.edu)
- CNS Online SEM Training Module (Online course) https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/leclassview/dowbt-00008486
Please make sure that you finish all the prerequisites before registering to the Hitachi SU8230 SEM training. Let me know if you may have any questions.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
| 3 | 2 | Register! | | |
|
|
| Training: Cypher S/ES and MFP3d BiO Atomic Force Microscopy (AFM) Training Part-1 (SPM-2 & 6) - LISE B58 | | Trainer: Jason Tresback | | This training event will focus on the basic imaging and operation of the Cypher S/ES and/or MFP3D BiO AFMs available at CNS (SPM- 2 and 6). Starting from the basic principles of AFM, users will also learn about cantilever selection and installation, different imaging modes, image quality improvement, and data processing and analysis methods. SPM probes are provided for training; however, users must supply their own probes during independent use. Full independent tool access requires completion of part-1 basic imaging and operation demonstrated by staff, followed by part-2 individual user assisted session that serves as a qualification for independent use on another day. Please register for each event and meet in hallway outside LISE B58 | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
3:00 pm - 4:00 pm
| 3 | 3 | Register! | | | | Training: Maskless Aligner MLA-2 - E-beam lithography bay in the cleanroom | | Trainer: Guixiong Zhong | | Basic training to use the Maskless Aligner MLA-2. The prerequisite for the training is OL-10 MLA150. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 2:30 pm
| 4 | 3 | Register! | | | | Training: Metrology for Nanofabrication Part-1 (Stylus Profilometry, Ellipsometry, and Electrical Property Measurements) - Inside LISE G07 Nanofabrication Cleanroom | | Trainer: Jason Tresback | | It is recommended but not required that you register and attend the Introduction to Metrology for Nanofabrication Lecture. The metrology for nanofabrication part-1 training event will focus on fundamental measurement tools for nanofabrication including, contact/stylus surface Profilometer (DekTak XT and 6m) (PL-5/8), multi-wavelength scanning Ellipsometer (FS-150XY) (ES-3), Thick film Reflectometer (MET-35), sheet resistance Rs mapping (CDE-ResMap 4-Pt Probe system) (MET-2), and Semiconductor Parameter Analyzer w/ Signatone 4-Pt Probe Station (Agilent 4156C & Signatone 4pt Probe Station)(PB-1 & CE-1/2). Full independent access to these tools listed above can be achieved, however the amount of time spent on each tool will vary based on participants. We meet inside the Cleanroom gowning area or within the Metrology Bay inside the CNS cleanroom (G07). | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
10:30 am - 12:00 pm
| 3 | 2 | Register! | | | | Training: Nikon Micro-CT Training - LISE G27 | | Trainer: Hao-Yu (Greg) Lin | | training on Nikon X-Tek HMXST225 Micro-CT system | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
9:30 am - 11:30 am
| 2 | 1 | Register! | | | | Training: OL-4, SUSS MA6 Mask Aligner - G07, Inside Cleanroom at the tool | | Trainer: Bok Yeop Ahn | This is a training session for MA6 Mask Aligner in the cleanroom at CNS. As listed below, there are several prerequisites that you must finish before getting to MA6 mask aligner training.
- LISE Safety Training (John Sweeney: john_sweeney@harvard.edu)
- CNS Cleanroom Orientation (Another name of this training is General Nanofabrication Facility Access, John Tsakirgis: johntsakirgis@cns.fas.harvard.edu)
- Introduction to Lithography (Bok Yeop Ahn: byahn@cns.fas.harvard.edu)
- Wet bench and Chemical Safety Training Part I and II (Mac Hathaway: hathway@cns.fas.harvard.edu)
- Resister Spinner Training (Malcolm Tse: mtse@cns.fas.harvard.edu)
Let me know if you may have any questions.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:30 pm
| 3 | 3 | Register! | | | | Training: Optical Profiler Training (PL-6) - Inside LISE G07 Nanofabrication Cleanroom | | Trainer: Jason Tresback | | This training event basic operation of the Optical Profiler (CCI HD) (PL-6) which uses white light interferometry (WLI) to measure roughness, step-heights, and topography with sub-nm vertical resolution and 1um lateral resolution. This is a rapid, non-contact, and non-destructive technique to analyze small areas (80x80 um) and large areas (100x100 mm). Limitations include thin, transparent films and dissimilar materials. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
11:30 am - 12:30 pm
| 3 | 3 | Register! | | | | Training: RIE 10 Rapier DRIE Training - The first hour training is held outside the cleanroom and the rest of time is inside the cleanroom | | Trainer: Ling Xie | It is required to take the "Introduction to Dry Etching" before this training.
The first hour training is online, Zoom ID 990 9681 5765, passcode 315648.
The SPTS Rapier system is for deep silicon etch only, it is configured with dual plasma sources, dual gas inlets, electro-static clamping chuck, AMS chiller to control the chuck temperature from -15ฐC to + 40ฐC, and Claritas end-point detector.
Specifications
Etch rate: 1.0 10 ตm/min
Aspect ratio: 5 50
Etch depth: 5ตm several hundreds of microns
Feature size: nm mm scales in lateral dimension
Sider wall roughness (scallop depth): 6nm 700nm
Sample size ≤ 6
Etch mask: only resists and SiO2 allowed
The first hour training is online, Zoom ID 990 9681 5765, passcode 315648. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:00 pm - 3:30 pm
| 2 | FULL | Registration Closed | | | | Training: Sharon TE-3, 4, and 5 Thermal Evaporator Training - LISE G07 (CNS Cleanroom), PVD Bay | | Trainer: Ed Macomber | | Training on TE-3, 4 and 5 for thermal evaporation of metals is covered. We meet at the system in the CNS cleanroom PVD bay. Training takes about 2 hours. Venting, loading a sample, pumping and evaporation are performed and explained. For these TE systems, users supply their own deposition materials and boats (sources). CNS supplies the materials for training. After this training you will have access to all 3 systems, which are collectively capable of depositing: Ti, Cr, Cu, Ag, Au, Al, Ni, etc. Check the links in the confirmation email for important attachments including the S.O.P. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:00 pm - 2:30 pm
(Please review document links in email confirmation) | 3 | 1 | Register! | | |
|
|
| Training: DOE-1 - ULVAC Deep Oxide Etcher - in front of the tool, inside the G7 cleanroom. | | Trainer: Kenlin Huang | | DOE-1 - ULVAC Deep Oxide Etcher training | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
3:30 pm - 4:30 pm
617-495-1738 | 4 | 4 | Register! | | | | Training: CNS cleanroom orientation - meet in front of G07 | | Trainer: John Tsakirgis | | To understand safety and protocols for G07 | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
9:30 am - 11:00 am
please be prompt | 8 | 8 | Register! | | | | Training: RIE-12 - Matrix Plasma Asher - In front of the tool, inside the G7 cleanroom. | | Trainer: Kenlin Huang | | RIE-12 - Matrix Plasma Asher | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
4:30 pm - 5:00 pm
617-495-1738 | 4 | 3 | Register! | | |
|
|
| Training: ALD-3 PdR ALD System Training - PVD Bay (last bay in cleanroom); small red and white instrument on far wall | | Trainer: Mughees Khan | | This training provides users the protocols needed to operate the ALD-3 benchtop thermal ALD system. This system is primarily used for depositing Al2O3, SiO2 and Pt thin films on 4" substrates or 3D objects up to 8mm in height. The tool is capable of 40C deposition of Al2O3 and down to 100C for SiO2 and 125C for Pt. Both the SiO2 and Pt processes utilize Ozone as the counter reactant. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
prerequisite: Introduction to Thin Film Growth and Processing | 2 | 2 | Register! | | | | Training: FIB-4 FEI Helios Basic Training - B15F | | Trainer: Stephan Kraemer | | Introduction into the basic operation of the Helios Nanolab 660 Focused Ion Beam microscope, including general workflow, beam-assisted deposition, basics of ion-material interaction, preparation of cross sections and high-resolution imaging. More advanced tasks, such as TEM sample preparation or 3D serial sectioning, will build on the introduced concepts. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
9:00 am - 1:00 pm
Prior SEM training recommended but not necessary | 4 | 4 | Register! | | | | Training: Intro to Metrology for Nanofabrication Lecture - Hallway Outside LISE G07 | | Trainer: Jason Tresback | | This lecture is an informal discussion about the measurement tools and techniques available inside the nanofabrication cleanroom G07, however we meet outside the cleanroom in the Hallway. The introduction serves as a tutorial and guidance for choosing metrology training events. Please email jtresback@cns.fas.harvard.edu if you have any questions | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
11:00 am - 12:00 pm
| 4 | 3 | Register! | | | | Training: Introduction to Thin Film Processes - Outside Cleanroom (at the CNS Pedagogical Area!) | | Trainer: Mac Hathaway | All About Thin Films, with an emphasis on Practical Uses and Important Process Variables
Prerequisite for ALL Thin Film Equipment training | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
2:00 pm - 4:00 pm
| 10 | 10 | Register! | | | | Training: LPCVD and APCVD Training (CVD 5,6,7,9,10,11) - Cleanroom Dry Processing Bay | | Trainer: Mughees Khan | Introduction to Thin Film Growth and Processing is required before you can sign up for this training.
This is a general training for all of the LPCVD and APCVD furnaces. These Tystar furnaces can accommodate anything from a single 1cm substrate up to two full cassettes (50) of 6" wafers.
The various furnaces encompass the following processes:
- Anneals of non-metal containing samples from 250 to 1100C under O2, N2, and H2/He
- Anneals of metal containing samples from 250 to 1100C under N2 and H2/He
- Low stress and stoichiometric silicon nitride
- Amorphous and polycrystalline silicon (doped with P or B or undoped)
- SiO2 from TEOS (conformal, additive SiO2 process)
- SiO2 from oxidation of silicon using H2O or O2
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
10:00 am - 12:00 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 2 | 1 | Register! | | | | Training: NF-Training Litho. Intro. - Online by Zoom | | Trainer: Bok Yeop Ahn | This class is Introduction to Lithography at CNS, covers basics of photolithography, e-beam lithography, and 3D laser lithography. Users are encouraged to take this class before taking any other photo- or e-beam lithography trainings. As listed below, there are two prerequisites that you must finish before registering to this training session:
- LISE Safety Training (John Sweeney: john_sweeney@harvard.edu)
- CNS Cleanroom Orientation (Another name of this training is General Nanofabrication Facility Access, John Tsakirgis: johntsakirgis@cns.fas.harvard.edu)
Bok is inviting you to a scheduled Zoom meeting.
Time: Oct 25, 2022 09:30 AM Eastern Time (US and Canada)
Join Zoom Meeting
https://us06web.zoom.us/j/86709414133?pwd=THpKTWEremluOHFQZmV6dmVaSFdLUT09
Meeting ID: 867 0941 4133
Passcode: 871770
| | Time | Max Attendees | Available | CNS Users ONLY |
|---|
10:30 am - 10:30 am
| 10 | 10 | Register! | | | | Training: Office Hour for Nano-/Micro- Fabrication Related Questions - Online with Zoom | | Trainer: Ling Xie | Ling Xie is inviting you to a scheduled Zoom meeting.
Topic: Zoom Meeting for training
Time: This is a recurring meeting Meet anytime
Join Zoom meeting
https://harvard.zoom.us/j/99096815765?pwd=NGo3N2xocTV5T0hIRXdWcW80Y1NzUT09
Password: 315648
Join by telephone (use any number to dial in)
+1 301 715 8592
+1 309 205 3325
+1 312 626 6799
+1 646 931 3860
+1 929 436 2866
+1 669 444 9171
+1 669 900 6833
+1 719 359 4580
+1 253 215 8782
+1 346 248 7799
+1 386 347 5053
+1 564 217 2000
International numbers available: https://harvard.zoom.us/u/abwNsmaaBL
One tap mobile: +13017158592,,99096815765# US (Washington DC)
Join by SIP conference room system
Meeting ID: 990 9681 5765
99096815765.315648@zoomcrc.com
| | Time | Max Attendees | Available | CNS Users ONLY |
|---|
3:00 pm - 3:30 pm
| 1 | 1 | Register! | | | | Training: RIE-8 - STS ICP RIE Training - CNS Cleanroom LISE G07 | | Trainer: Ling Xie | It is required to take the "Introduction to Dry Etching" before this training.
The RIE 8 is used to etch silicon, silicon oxide, silicon nitride, silicon carbide, and 2D materials.
Chamber Pre-Cleaning and Conditioning are Required: Before etching any samples, users must run the O2-Clean recipe for 20 minutes and the recipe to be used for 5-10 minutes.
The STS MPX/LPX RIE system is an Inductively Coupled Plasma (ICP) etching system. Using the ICP technology, this RIE is characterized with high plasma density, low operating pressure, high etch rate, excellent etch uniformity, and low energy ion damage. Available etching gases on this system include SF6, C4F8, O2, H2, Ar, Cl2, BCl3, and HBr. The maximum coil and platen powers are 1200W and 250W, respectively. Equipped with a chiller, the MPX/LPX system allows the substrate temperature to be controlled from 15ฐC to 30ฐC. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:00 pm - 2:30 pm
| 2 | FULL | Registration Closed | | | | Training: SEM-10, User training for Hitachi SU8230 SEM - G07, Inside Cleanroom at the tool | | Trainer: Bok Yeop Ahn | This is a training session for HITACHI SU8230 SEM in cleanroom at CNS. As listed below, there are several prerequisites that you must finish before getting to this tool.
- LISE Safety Training (John Sweeney: john_sweeney@harvard.edu)
- CNS Cleanroom Orientation (Another name of this training is General Nanofabrication Facility Access, John Tsakirgis: johntsakirgis@cns.fas.harvard.edu)
- CNS Online SEM Training Module (Online course) https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/leclassview/dowbt-00008486
Please make sure that you finish all the prerequisites before registering to the Hitachi SU8230 SEM training. Let me know if you may have any questions.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
| 3 | 2 | Register! | | | | Training: Thermo Scientific K-Alpha+ XPS training - LISE G27 | | Trainer: Hao-Yu (Greg) Lin | | training on Thermo Scientific K-Alpha+ XPS system | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
9:30 am - 11:30 am
| 2 | 2 | Register! | | |
|
|
| Training: RIE-13 - Oxford PlasmaPro 100 Cobra 300 - In front of the tool, inside the G7 cleanroom. | | Trainer: Kenlin Huang | | RIE-13 - Oxford PlasmaPro 100 Cobra 300 training | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
3:00 pm - 4:00 pm
617-495-1738 | 4 | 4 | Register! | | | | Training: CVD-14 Oxford ICP-CVD - Low Temp - CNS cleanroom - Dry processing bay at CVD-14 | | Trainer: Mughees Khan | | Introduction to Thin Film Growth and Processing is required before you can sign up for training. This training will enable users to grow high quality SiO2, SiNx, and a-Si films. No doping or active cooling is available on this tool. All baseline processes are at 80C with the exception of a-Si, which runs at 200C. Full temperature range is from -20C to 400C. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
11:00 am - 12:30 pm
prerequisite: Introduction to Thin Film Growth and Processing | 3 | 3 | Register! | | | | Training: CVD-3 STS PECVD - CNS Cleanroom - Dry processing bay | | Trainer: Mughees Khan | This training will provide users the necessary technique to deposit high quality SiO2, SiNx, and a:Si films at temperatures from ~200 to 350C. a-Si films can also be doped with B or P.
This tool is equipped with two RF generators, one at 13.56MHz (High frequency, HF recipes) and 380 kHz (low frequency, LF recipes). There are also recipes that take advantage of both RF generators to yield films with lower stress esp. silicon nitride films. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
9:30 am - 11:00 am
Prerequisite: Introduction to Thin Film Growth and Processing | 3 | 1 | Register! | | | | Training: Headway Photoresist Spiner - SC5 & VPO - Cleanroom Photo Bay | | Trainer: Malcolm Tse | Introduction to Spin Coating - to deposit uniform coating of Photoresist on a flat surface.
Basic operation, select and edit program of the Headway PWM32 series Spinner. HMDS coating with Yes Vapor Prime Oven. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
9:30 am - 10:30 am
| 3 | FULL | Registration Closed | | | | Training: Jupiter XR Atomic Force Microscopy (AFM) Training Part-1 (SPM-12) Inside the Cleanroom G07 - LISE G07 Nanofabrication Cleanroom | | Trainer: Jason Tresback | | This training event will focus on the basic imaging and operation of the Jupiter XR AFM available inside the Nanofabrication Cleanroom (SPM-12). Starting from the basic principles of AFM, users will also learn about cantilever selection and installation, different imaging modes, image quality improvement, and data processing and analysis methods. SPM probes are provided for training; however, users must supply their own probes during independent use. Full independent tool access requires completion of part-1 basic imaging and operation demonstrated by staff, followed by part-2 individual user assisted session that serves as a qualification for independent use on another day. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
3:00 pm - 4:00 pm
| 3 | 3 | Register! | | | | Training: Metrology for Nanofabrication Part-1 (Stylus Profilometry, Ellipsometry, and Electrical Property Measurements) - Inside LISE G07 Nanofabrication Cleanroom | | Trainer: Jason Tresback | | It is recommended but not required that you register and attend the Introduction to Metrology for Nanofabrication Lecture. The metrology for nanofabrication part-1 training event will focus on fundamental measurement tools for nanofabrication including, contact/stylus surface Profilometer (DekTak XT and 6m) (PL-5/8), multi-wavelength scanning Ellipsometer (FS-150XY) (ES-3), Thick film Reflectometer (MET-35), sheet resistance Rs mapping (CDE-ResMap 4-Pt Probe system) (MET-2), and Semiconductor Parameter Analyzer w/ Signatone 4-Pt Probe Station (Agilent 4156C & Signatone 4pt Probe Station)(PB-1 & CE-1/2). Full independent access to these tools listed above can be achieved, however the amount of time spent on each tool will vary based on participants. We meet inside the Cleanroom gowning area or within the Metrology Bay inside the CNS cleanroom (G07). | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
10:30 am - 12:00 pm
| 3 | 3 | Register! | | | | Training: MLA150 Maskless Aligners - Metrology bay in the cleanroom | | Trainer: Guixiong Zhong | | Basic training to use both maskless aligners, the MLA150 and MLA-2. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:00 pm - 2:30 pm
| 4 | FULL | Registration Closed | | | | Training: OL-4, SUSS MA6 Mask Aligner - G07, Inside Cleanroom at the tool | | Trainer: Bok Yeop Ahn | This is a training session for MA6 Mask Aligner in the cleanroom at CNS. As listed below, there are several prerequisites that you must finish before getting to MA6 mask aligner training.
- LISE Safety Training (John Sweeney: john_sweeney@harvard.edu)
- CNS Cleanroom Orientation (Another name of this training is General Nanofabrication Facility Access, John Tsakirgis: johntsakirgis@cns.fas.harvard.edu)
- Introduction to Lithography (Bok Yeop Ahn: byahn@cns.fas.harvard.edu)
- Wet bench and Chemical Safety Training Part I and II (Mac Hathaway: hathway@cns.fas.harvard.edu)
- Resister Spinner Training (Malcolm Tse: mtse@cns.fas.harvard.edu)
Let me know if you may have any questions.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:30 pm
| 3 | 3 | Register! | | | | Training: Optical Profiler Training (PL-6) - Inside LISE G07 Nanofabrication Cleanroom | | Trainer: Jason Tresback | | This training event basic operation of the Optical Profiler (CCI HD) (PL-6) which uses white light interferometry (WLI) to measure roughness, step-heights, and topography with sub-nm vertical resolution and 1um lateral resolution. This is a rapid, non-contact, and non-destructive technique to analyze small areas (80x80 um) and large areas (100x100 mm). Limitations include thin, transparent films and dissimilar materials. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
11:30 am - 12:30 pm
| 3 | 3 | Register! | | | | Training: RIE 11 Plasma-Therm Versaline Diamond Etcher - CNS Cleanroom, Wet Process Bay | | Trainer: Ling Xie | It is required to take the "Introduction to Dry Etching" before this training.
RIE 11 is used for diamond etch only!
The Versaline RIE is an Inductive Coupled Plasma Etching System with a maximum ICP source power of 1,200W and a maximum substrate bias power of 600W. The system is configured to handle 4 wafers and equipped with mechanical clamping and backside helium heat-conducting features. Its substrate temperature can be controlled from 10ฐC to180ฐC. In addition, temperatures of three other components inside the chamber can also be controlled from room temperature to 120ฐC, including Lid, Ceramic Spool, and Metal Liner. Setting these components at elevated temperatures before processing will reduce by-product coating speed on chamber walls and stabilize chamber conditions for the first couple of runs after the tool was at a stand-by state for a long time. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:00 pm - 2:30 pm
| 2 | 1 | Register! | | | | Training: RIE-7 - Unaxis Shuttleline ICP RIE - In front of the tool, inside the G7 cleanroom. | | Trainer: Kenlin Huang | | RIE-7 - Unaxis Shuttleline ICP RIE | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
4:00 pm - 5:00 pm
617-495-1738 | 4 | 4 | Register! | | | | Training: Sharon EE-3 e-beam evaporator training - We meet in the cleanroom PVD bay (last bay inside of LISE G07) | | Trainer: Ed Macomber | Please read the training description all the way through:
E-beam evaporation in EE-3 is covered; EE-3 can deposit 19 different materials (metals). All materials are user supplied for EE-3 (pellets and crucible liners). We will cover venting, loading the sample, pumping down (vacuum system) and the actual deposition. Plan on ~1.5 hr for this training. This is a manually operated deposition system and will likely take most users a few times using it to become comfortable with the machine. We meet in the cleanroom PVD bay (last bay inside LISE G07).
Once you sign up, you will receive the training confirmation email which will contain links to documents including the SOP. Please be sure to review the SOP BEFORE the training.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:00 pm - 2:00 pm
(Please review document links in email confirmation) | 4 | 2 | Register! | | | | Training: WB-2 EVG 501 Wafer Bonder - G07, Inside Cleanroom at the tool | | Trainer: Bok Yeop Ahn | This training covers the standard operation procedure for the WB-2 EVG 501 Wafer Bonder. Users will learn wafer bonding techniques:
1) Direct
2) Thermo-Compression
3) Adhesive
** Users may need Wet Bench/Acid/RCA Training
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
9:30 am - 10:30 am
| 3 | 3 | Register! | | | | Training: Wetbench and Chemical Safety Training Part I and II (IN PERSON!!) - Outside Cleanroom (at the CNS Pedagogical Area!) | | Trainer: Mac Hathaway | | Training for Wetbenches and Chemical Safety. Prerequisite for all photolithography training. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:00 am - 12:30 pm
| 10 | 10 | Register! | | | | Training: XeF2 Etcher Training - CNS Cleanroom at the tool | | Trainer: Ling Xie | XeF2 etch is mainly for isotopically etching silicon. It is widely used for releasing MEMS structures, such as switches, cantilevers, bridges, mirrors, membranes, channels, and thermal isolation cavities. Its merits include highly selective etch, no stiction problems as existed with wet etch, and long under cuts. XeF2 also etches Ge, Mo and SiGe and transitional metals W, Ti, Ta, TiN and TaN under certain conditions such as high temperatures, but wont etch Al, Ni, Cr, Pt, Ga, MgO, ZnO, AlN, GaAs, resist, and PDMS.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:30 pm - 3:30 pm
| 2 | 2 | Register! | | |
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| Training: ALD-2 GEMStar ALD Training - Wet Processing Bay - CNS cleanroom | | Trainer: Mughees Khan | | This training introduces users protocols needed to operate ALD-2. This system is primarily used for depositing conducting metal nitride and potentially pure metal films with good uniformity, conformality, and material purity. Deposition rates are slow, in the range of 1-3 ล per minute, but extremely high-aspect-ratio fill (40:1) is easily achievable. Currently, only WNx is available. In addition, Al2O3 can also be deposited on this tool. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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9:00 am - 10:00 am
prerequisite: Introduction to Thin Film Growth and Processing | 2 | 2 | Register! | | | | Training: CNS cleanroom orientation - meet in front of G07 | | Trainer: John Tsakirgis | | To understand safety and protocols for G07 | | Time | Max Attendees | Available | CNS Users ONLY |
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9:30 am - 11:00 am
please be prompt | 8 | 8 | Register! | | |
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