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| Training: Zeiss SEM Part 1: Online training - Harvard Training Portal | | Trainer: Tim Cavanaugh | The SEM Part 1 training is available in an online format. You must pass this online training before taking the hands-on SEM training for our field emission Zeiss SEMs (FESEMs) or the EVO SEM. There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000007001
PLEASE NOTE THAT THIS TRAINING IS ONLY FOR FULLY ENROLLED CNS USERS. IF YOU ARE LOOKING FOR THE FREE CNS IMAGING GROUP MASTERCLASS WEBINARS, PLEASE SEE FURTHER BELOW
Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
| | | | Training: Basic Arctica Cryo-EM course Day 2 - B58 control room | | Trainer: Svetla Stoilova-McPhie | Practicing of the Arctica Cryo-EM workflow.
PLEASE NOTE THAT THIS TRAINING IS ONLY FOR FULLY ENROLLED CNS USERS. IF YOU ARE LOOKING FOR THE FREE CNS IMAGING GROUP MASTERCLASS WEBINARS, PLEASE SEE FURTHER BELOW | | | | Training: Basic Arctica Cryo-EM course Day 3 - B58 Control room | | Trainer: Svetla Stoilova-McPhie | Practice and Certification to follow with Intermediate course
PLEASE NOTE THAT THIS TRAINING IS ONLY FOR FULLY ENROLLED CNS USERS. IF YOU ARE LOOKING FOR THE FREE CNS IMAGING GROUP MASTERCLASS WEBINARS, PLEASE SEE FURTHER BELOW | | | | Training: Basic Arctica Cryo-EM course, Day 1 - B58 control room | | Trainer: Svetla Stoilova-McPhie | CNS users will be demonstrated the Basic operation of our Tecnai Arctica Cryo-TEM workflow and have their own area set up to practice.
PLEASE NOTE THAT THIS TRAINING IS ONLY FOR FULLY ENROLLED CNS USERS. IF YOU ARE LOOKING FOR THE FREE CNS IMAGING GROUP MASTERCLASS WEBINARS, PLEASE SEE FURTHER BELOW | | | | Training: Cryo-TEM sample preparation - GO5 | | Trainer: Svetla Stoilova-McPhie | CNS users will be trained to use the Vitorbot Mark IV to freeze their samples.
CNS users need to do the training for GO5 (2h) with Sandra Nacasone, (snakasone@cns.fas.harvard.edu) to use the equipment.
PLEASE NOTE THAT THIS TRAINING IS ONLY FOR FULLY ENROLLED CNS USERS. IF YOU ARE LOOKING FOR THE FREE CNS IMAGING GROUP MASTERCLASS WEBINARS, PLEASE SEE FURTHER BELOW | | | | Training: Intermediate Arctica Cryo-EM course Day 1 - B58 Control room | | Trainer: Svetla Stoilova-McPhie | The Intermediate Arctica Cryo-EM course has to be taken the week after the Basic Cryo-EM course.
It will consist of working with a standard Cryo-EM sample (vesicle and Apoferritin).
PLEASE NOTE THAT THIS TRAINING IS ONLY FOR FULLY ENROLLED CNS USERS. IF YOU ARE LOOKING FOR THE FREE CNS IMAGING GROUP MASTERCLASS WEBINARS, PLEASE SEE FURTHER BELOW | | |
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| Training: Soft Materials Cleanroom (SMCR) Orientation - Meet outside the cleanroom in the ground floor couches | | Trainer: Sandra Nakasone | This orientation is required for access to the Soft Materials Cleanroom (SMCR). The SMCR is a cleanroom devoted to Soft Lithography with a focus on rapid prototyping of microfluidic devices using PDMS elastomer.
LONG PANTS & CLOSED-TOE SHOES ARE MANDATORY. Long hair must be tied up. Quiz to follow. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:30 am - 12:00 pm
Long pants and closed-toe shoes are MANDATORY. Long hair must be tied up. Quiz to follow. | 6 | 6 | Register! | | |
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| Training: ALD-1 and ALD-4 Training - ALD Oxide Deposition - Starts in CNS Cleanroom Gowning Area | | Trainer: Mac Hathaway | | Training for the Savannah ALD-1 and ALD-4 systems - Used for Al2O3, HfO2, TiO2, SiO2, ZrO2, and ZnO, as well as Pt and mixed oxides. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 3:00 pm
| 5 | 5 | Register! | | | | Training: CVD-14 Oxford ICP-CVD - Low Temp - Cleanroom PVD Bay | | Trainer: Mughees Khan | Training session for the Oxford ICP-CVD system.
This system is capable of SiO2 and SiNx growth from RT to 350C. Optimized recipes at 80C. a:Si growth at 200C (optimal), full range also available.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:30 pm - 3:00 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 5 | 5 | Register! | | | | Training: CVD-3 Training: STS PECVD Training Session - Dry processing bay in the cleanroom | | Trainer: Mughees Khan | Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This training will provide users with the tools necessary to grow high quality SiO2, SiNx, and a:Si films at temperatures from ~200 to 350C. These films can also be doped with B or P.
This tool is equipped with two RF generators, one at 13.56MHz (High frequency, HF recipes) and 380 kHz (low frequency, LF recipes). There are also recipes that take advantage of both RF generators to yield films with lower stress esp. silicon nitride films.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 2:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 5 | 5 | Register! | | | | Training: Form2 3D Printer Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 3:30 pm
| 4 | 4 | Register! | | | | Training: Helix Laser Cutter Training - G06 | | Trainer: Sandra Nakasone | | Prereq 1: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. Prereq 2: You must complete the EH&S online training called "Enclosed Laser Instrument Safety" and email the certificate of completion to Sandra Nakasone (snakasone@cns.fas.harvard.edu). You can access the online training here: https://www.ehs.harvard.edu/training | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: Introduction to Thin Film Deposition Processes - Training area, outside CNS G-07 Cleanroom | | Trainer: Mac Hathaway | | Introduction to Thin Film Deposition processes and techniques, with an emphasis on process control and overall integration into your process flow. This is a PREREQUISITE for all deposition process training. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:30 am
| 10 | 10 | Register! | | | | Training: LPCVD and APCVD Training (CVD 5,6,7,9,10,11) - Dry Processing Bay in cleanroom | | Trainer: Mughees Khan | Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This is a general training for all of the LPCVD and APCVD furnaces. These Tystar furnaces can accommodate anything from a single 1cm substrate up to 50 6" wafers.
The various furnaces encompass the following processes:
- Anneals of non-metal containing samples from 250 to 1100C under O2, N2, and H2/He
- Anneals of metal containing samples from 250 to 1100C under N2 and H2/He
- Low stress and stoichiometric silicon nitride
- Amorphous and polycrystalline silicon (doped with P or B or undoped)
- SiO2 from TEOS (conformal, additive SiO2 process)
- SiO2 from oxidation of silicon using H2O or O2
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:00 am - 11:30 am
Prerequisite: Introduction to Thin Film Growth and Processing | 4 | 4 | Register! | | | | Training: Makerbot 3D Printer Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: RIE-10 - SPTS Rapier DRIE - LISE G07, CNS Cleanroom at the tool | | Trainer: Ling Xie | You have to finish NF-Training "Dry Etching Intro" first and then take this training!
SPTS RIE-10, a state-of-the-art deep silicon etching system, is furnished with dual plasma sources and dual gas inlets. The tool is characterized with high etch rate 6-10 µm/min; high aspect ratio 50:1; good selectivity > 50:1 to resist and >100:1 to silicon oxide; and a good uniformity < 5% cross 6†wafers. Its fixed RF matching technology reduces the step-process time to 1 second, which leads to a controllable side wall roughness < 6nm for nanoscale features. Major features include:
1. Primary rf power up to 3,000W
2. Secondary rf power up to 3,000W
3. Substrate power up to 300W
4. Chuck temperatures from -15°C to +40°C
5. Handling 6" or smaller samples
6. Claritas End Point Detector
Applications
1. Si etch only
2. High aspect ratio etch: 5 – 50
3. Deep etch: 5um through Si wafer etch
4. Broad feature sizes: from nano- to mm- scales in lateral dimension
5. Side wall roughness (scallop depth): 6nm – 700nm
6. Only resists and SiO2 or Si3N4 allowed as etching mask
7. Handling 6" or smaller samples
8. Absolutely no-metal mask or metal stop layers
Available Processes
1. Micro Pillars
2. Nano Pillars
3. Micro Trenches
4. Nano Trenches
5. Via etch
6. Through wafer via etch
7. Wafer thinning | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 4:00 pm
Meet in LISE 311 from 1pm - 2pm. | 4 | 4 | Register! | | |
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| Training: Contact Angle Measurement Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
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11:30 am - 12:00 pm
| 4 | 4 | Register! | | | | Training: DOE-1 - ULVAC Deep Oxide Etcher training - In front of the tool inside cleanroom. | | Trainer: Kenlin Huang | DOE-1 - ULVAC Deep Oxide Etcher training
at 3:30 pm | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:30 pm - 4:30 pm
kenlinhuang@cns.fas.harvard.edu | 4 | 4 | Register! | | | | Training: Freeze Dryer/Lyophilizer Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 1:30 pm
| 4 | 4 | Register! | | | | Training: Introduction to Dry Etching - LISE 311 | | Trainer: Ling Xie | | This class teaches basic working principles of dry etching technologies, especially focusing on reactive ion etch (RIE) and ion beam etching (IBE). Dry etching capabilities at CNS Cleanroom will be introduced and etching system selection for your etching project will be discussed. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:00 am
| 12 | 12 | Register! | | | | Training: Planetary Ball Mill Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:30 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: RIE-11 Plasma Therm Diamond RIE - LISE G07 CNS Cleanroom at the tool | | Trainer: Ling Xie | 1. Introduction
The RIE-11 PT Versaline RIE is an Inductive Coupled Plasma Etching System with a maximum ICP source power of 1,200W and a maximum substrate bias power of 600W. The system is configured to handle 4” wafers and equipped with mechanical clamping and backside helium cooling features. Its substrate temperature can be controlled from 10°C to180°C. In addition, temperatures of three other components inside the chamber can also be controlled from 20°C to 180°C, including Lid, Ceramic Spool, and Metal Liner. Setting these components at elevated temperatures before processing will reduce by-product coating speed on chamber walls and stabilize chamber conditions for the first couple of runs after the tool was at a stand-by state for a long time.
2. Application
Only Diamond is allowed to be etched in this RIE and all other materials are forbidden.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: RIE-13 - Oxford PlasmaPro 100 Cobra 300 training - In front of the tool inside cleanroom. | | Trainer: Kenlin Huang | RIE-13 - Oxford PlasmaPro 100 Cobra 300 training
at 2:30 pm
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:30 pm - 3:30 pm
kenlinhuang@cns.fas.harvard.edu | 5 | 5 | Register! | | | | Training: SP-3 AJA 3-gun sputtering system training - CNS cleanroom (G-07) Dry Bay | | Trainer: Mughees Khan | | The system has one RF source and two DC sources (DC power supply is switchable between the two sources). SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with 1 RF and 1 DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their schedule. After 3 uses (with no problems) users are given 24/7 access. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 2:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 3 | 3 | Register! | | | | Training: Wetbench + Chemical Safety Training - OUTSIDE CLEANROOM ENTRANCE - G-07 LISE | | Trainer: Mac Hathaway | Training on proper behavior, rules and techniques for wet chemical processing on the CNS wetbenches.
Requires cleanroom access, AND a cleanroom suit ALREADY HANGING UP. Will generally be followed by cleanroom tour and demonstration at 1:30 PM. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 12:30 pm
| 8 | 8 | Register! | | |
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| Training: Discussions for Nano/Micro fabrication questions - LISE G52 | | Trainer: Ling Xie | | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 3:30 pm
| 1 | 1 | Register! | | | | Training: Synergy H1m Plate Reader Training - G05 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
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11:00 am - 12:00 pm
| 4 | 4 | Register! | | | | Training: XeF2-1 - Xactix e2 XeF2 Etch System - LISE G07 CNS Cleanroom | | Trainer: Ling Xie | XeF2 etch is mainly for isotopically etching silicon. It is widely used for releasing MEMS structures, such as switches, cantilevers, bridges, mirrors, membranes, channels, and thermal isolation cavities. Its merits include highly selective etch, no stiction problems as existed with wet etch, and long under cuts. XeF2 also etches Ge, Mo and SiGe and transitional metals W, Ti, Ta, TiN and TaN under certain conditions such as high temperatures, but won’t etch Al, Ni, Cr, Pt, Ga, MgO, ZnO, AlN, GaAs, resist, and PDMS.
The Xactix e2TM System installed in CNS Cleanroom is manufactured by SPTS, an Orbotech Company, its main features include:
• Table Top System
• PC based control software manages recipes, logs data and manages multiple users with password protection
• Open load system to handle multiple types of substrates (wafers, chips, dicing frames, packages) without special handling substrates
• Expansion chamber-based design for precise, repeatable pulse pressures, and ease of mixing XeF2 with other gasses.
• Transparent process chamber lid and shower head over full wafer allows visual inspection of the entire wafer.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: Zetasizer Nano ZS DLS Training - G05 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 2:00 pm
| 4 | 4 | Register! | | |
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| Training: JAWoollam Spectroscopic Ellipsometer training - LISE-G07, in the main cleanroom | | Trainer: Jiangdong Deng | | this training will cover the basic principle and operation procedure of JAWoollam Spectroscopic Ellipsometer system for thin film optical measurement. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 3:30 pm
| 4 | 4 | Register! | | |
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| Training: G05 Cell Culture and Cryo-Prep Room Orientation - Meet outside of G05 | | Trainer: Sandra Nakasone | | This safety orientation is mandatory for access to our biomaterials, cryo-prep, and cell culture BL2 laboratory (LISE G05). In order to gain access users must attend this orientation, complete at least one training for equipment inside G05, and take the "Laboratory Biosafety" online training from the Harvard EH&S website (https://www.ehs.harvard.edu/training). Email Sandra Nakasone (snakasone@cns.fas.harvard.edu) the certificate of completion once you are done. LONG PANTS and CLOSED-TOE SHOES MANDATORY. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:30 am - 11:00 am
LONG PANTS and CLOSED-TOE SHOES MANDATORY. Long hair must be tied up. | 6 | 5 | Register! | | | | Training: G06 Nanotechnology and Rapid Prototyping Room Orientation - Meet outside of G06 | | Trainer: Sandra Nakasone | | This safety orientation is mandatory for access to our chemical nanotechnology and rapid prototyping room (LISE G06). In order to gain access users must complete this safety orientation and at least one training for equipment inside G06. LONG PANTS AND CLOSED-TOE SHOES ARE MANDATORY. | | Time | Max Attendees | Available | CNS Users ONLY |
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11:00 am - 11:30 am
LONG PANTS and CLOSED-TOE SHOES are MANDATORY. Long hair must be tied up. | 6 | 5 | Register! | | | | Training: RIE-09 Anatech Plasma O2 stripper - In front of the tool inside cleanroom. | | Trainer: Kenlin Huang | RIE-09 Anatech Plasma O2 stripper
at 3:30 pm on Monday | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:30 pm - 4:00 pm
kenlinhuang@cns.fas.harvard.edu | 5 | 5 | Register! | | | | Training: RIE-12-Matrix Plasma Asher training - In front of the tool inside cleanroom. | | Trainer: Kenlin Huang | RIE-12-Matrix Plasma Asher training
at 4 pm on Monday | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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4:00 pm - 4:30 pm
kenlinhuang@cns.fas.harvard.edu | 4 | 4 | Register! | | |
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| Training: FIB-4 FEI Helios - Basic Training - B15F | | Trainer: Stephan Kraemer | | Introduction to basic concepts of Focused Ion Beam microscopy and the operation of the FEI Helios FIB. With help of a cross section analysis all relevant techniques of material deposition, cutting and high-resolution imaging will be demonstrated. These techniques are the necessary building blocks to perform more advanced tasks such as TEM sample preparation or 3D serial sectioning. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 5:00 pm
Prior SEM training recommended | 4 | 4 | Register! | | | | Training: Form2 3D Printer Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 3:30 pm
| 4 | 4 | Register! | | | | Training: Helix Laser Cutter Training - G06 | | Trainer: Sandra Nakasone | | Prereq 1: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. Prereq 2: You must complete the EH&S online training called "Enclosed Laser Instrument Safety" and email the certificate of completion to Sandra Nakasone (snakasone@cns.fas.harvard.edu). You can access the online training here: https://www.ehs.harvard.edu/training | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: Introduction to Thin Film Deposition Processes - Training area, outside CNS G-07 Cleanroom | | Trainer: Mac Hathaway | | Introduction to Thin Film Deposition processes and techniques, with an emphasis on process control and overall integration into your process flow. This is a PREREQUISITE for all deposition process training. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:30 am
| 10 | 10 | Register! | | | | Training: Makerbot 3D Printer Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: RIE-7 - Unaxis Shuttleline ICP RIE - in front of the tool inside cleanroom. | | Trainer: Kenlin Huang | RIE-7 - Unaxis Shuttleline ICP RIE
3:30 pm | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:30 pm - 4:30 pm
kenlinhuang@cns.fas.harvard.edu | 4 | 4 | Register! | | | | Training: RIE-8 STS ICP RIE Training - LISE G07 CNS Cleanroom at the tool | | Trainer: Ling Xie | The STS MPX/LPX RIE system is an Inductively Coupled Plasma Reactor that is used for Reactive Ion Etch. Using the ICP technology, this etch system is characterized with high plasma density, low operating pressure, high etch rate, excellent etch uniformity and low energy ion damage. Equipped with a chiller, the MPX/LPX system allows the substrate temperature to be controlled from 5 to 30°C.
Applications
The STS ICP RIE will be restricted to etch silicon-based materials, which include Si, SiO2, and Si3N4.
Features
¥ ICP assembly upper electrode powered up to 1,500 W
¥ RF biased lower electrode powered up to 300 W and chilled to 4 – 30°C
¥ Single wafer loadlock up to 6” wafer
¥ Available gases: SF6, CHF3, CH4, H2, Cl2, HBr, BCl3, Ar, N2, O2, and N2
¥ Windows 2000 software control PC
¥ Internet remote control capability
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 3:00 pm
| 4 | 4 | Register! | | |
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| Training: Contact Angle Measurement Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
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11:30 am - 12:00 pm
| 4 | 4 | Register! | | | | Training: Freeze Dryer/Lyophilizer Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 1:30 pm
| 4 | 4 | Register! | | | | Training: Planetary Ball Mill Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:30 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: SP-3 AJA 3-gun sputtering system training - CNS cleanroom (G-07) Dry Bay | | Trainer: Mughees Khan | | The system has one RF source and two DC sources (DC power supply is switchable between the two sources). SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with 1 RF and 1 DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their schedule. After 3 uses (with no problems) users are given 24/7 access. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 2:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 3 | 3 | Register! | | |
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| Training: Discussions for Nano/Micro fabrication questions - LISE G52 | | Trainer: Ling Xie | | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 3:30 pm
| 1 | 1 | Register! | | | | Training: Sharon TE-3, 4, and 5 thermal evaporator training - LISE G07 (CNS Cleanroom), PVD Bay | | Trainer: Malcolm Tse | | Training on TE-3, 4 and 5 for thermal evaporation of metals is covered. We meet at the system in the CNS cleanroom PVD bay. Training takes about 2 hours. Venting, loading a sample, pumping and evaporation are performed and explained. For these TE systems, users supply their own deposition materials and boats (sources). CNS supplies the materials for training. After this training you will have access to all 3 systems, which are collectively capable of depositing: Ti, Cr, Cu, Ag, Au, Al, etc. | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 3:30 pm
| 4 | 4 | Register! | | | | Training: Synergy H1m Plate Reader Training - G05 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
11:00 am - 12:00 pm
| 4 | 4 | Register! | | | | Training: Zetasizer Nano ZS DLS Training - G05 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
1:00 pm - 2:00 pm
| 4 | 4 | Register! | | |
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| Training: Soft Materials Cleanroom (SMCR) Orientation - Meet outside the cleanroom in the ground floor couches | | Trainer: Sandra Nakasone | This orientation is required for access to the Soft Materials Cleanroom (SMCR). The SMCR is a cleanroom devoted to Soft Lithography with a focus on rapid prototyping of microfluidic devices using PDMS elastomer.
LONG PANTS & CLOSED-TOE SHOES ARE MANDATORY. Long hair must be tied up. Quiz to follow. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
10:30 am - 12:00 pm
Long pants and closed-toe shoes are MANDATORY. Long hair must be tied up. Quiz to follow. | 6 | 6 | Register! | | |
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| Training: ALD-1 and ALD-4 Training - ALD Oxide Deposition - Starts in CNS Cleanroom Gowning Area | | Trainer: Mac Hathaway | | Training for the Savannah ALD-1 and ALD-4 systems - Used for Al2O3, HfO2, TiO2, SiO2, ZrO2, and ZnO, as well as Pt and mixed oxides. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 3:00 pm
| 5 | 5 | Register! | | | | Training: CVD-14 Oxford ICP-CVD - Low Temp - Cleanroom PVD Bay | | Trainer: Mughees Khan | Training session for the Oxford ICP-CVD system.
This system is capable of SiO2 and SiNx growth from RT to 350C. Optimized recipes at 80C. a:Si growth at 200C (optimal), full range also available.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:30 pm - 3:00 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 5 | 5 | Register! | | | | Training: CVD-3 Training: STS PECVD Training Session - Dry processing bay in the cleanroom | | Trainer: Mughees Khan | Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This training will provide users with the tools necessary to grow high quality SiO2, SiNx, and a:Si films at temperatures from ~200 to 350C. These films can also be doped with B or P.
This tool is equipped with two RF generators, one at 13.56MHz (High frequency, HF recipes) and 380 kHz (low frequency, LF recipes). There are also recipes that take advantage of both RF generators to yield films with lower stress esp. silicon nitride films.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 2:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 5 | 5 | Register! | | | | Training: Form2 3D Printer Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 3:30 pm
| 4 | 4 | Register! | | | | Training: Helix Laser Cutter Training - G06 | | Trainer: Sandra Nakasone | | Prereq 1: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. Prereq 2: You must complete the EH&S online training called "Enclosed Laser Instrument Safety" and email the certificate of completion to Sandra Nakasone (snakasone@cns.fas.harvard.edu). You can access the online training here: https://www.ehs.harvard.edu/training | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: Introduction to Thin Film Deposition Processes - Training area, outside CNS G-07 Cleanroom | | Trainer: Mac Hathaway | | Introduction to Thin Film Deposition processes and techniques, with an emphasis on process control and overall integration into your process flow. This is a PREREQUISITE for all deposition process training. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:30 am
| 10 | 10 | Register! | | | | Training: LPCVD and APCVD Training (CVD 5,6,7,9,10,11) - Dry Processing Bay in cleanroom | | Trainer: Mughees Khan | Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This is a general training for all of the LPCVD and APCVD furnaces. These Tystar furnaces can accommodate anything from a single 1cm substrate up to 50 6" wafers.
The various furnaces encompass the following processes:
- Anneals of non-metal containing samples from 250 to 1100C under O2, N2, and H2/He
- Anneals of metal containing samples from 250 to 1100C under N2 and H2/He
- Low stress and stoichiometric silicon nitride
- Amorphous and polycrystalline silicon (doped with P or B or undoped)
- SiO2 from TEOS (conformal, additive SiO2 process)
- SiO2 from oxidation of silicon using H2O or O2
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
10:00 am - 11:30 am
Prerequisite: Introduction to Thin Film Growth and Processing | 4 | 4 | Register! | | | | Training: Makerbot 3D Printer Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: RIE-10 - SPTS Rapier DRIE - LISE G07, CNS Cleanroom at the tool | | Trainer: Ling Xie | You have to finish NF-Training "Dry Etching Intro" first and then take this training!
SPTS RIE-10, a state-of-the-art deep silicon etching system, is furnished with dual plasma sources and dual gas inlets. The tool is characterized with high etch rate 6-10 µm/min; high aspect ratio 50:1; good selectivity > 50:1 to resist and >100:1 to silicon oxide; and a good uniformity < 5% cross 6†wafers. Its fixed RF matching technology reduces the step-process time to 1 second, which leads to a controllable side wall roughness < 6nm for nanoscale features. Major features include:
1. Primary rf power up to 3,000W
2. Secondary rf power up to 3,000W
3. Substrate power up to 300W
4. Chuck temperatures from -15°C to +40°C
5. Handling 6" or smaller samples
6. Claritas End Point Detector
Applications
1. Si etch only
2. High aspect ratio etch: 5 – 50
3. Deep etch: 5um through Si wafer etch
4. Broad feature sizes: from nano- to mm- scales in lateral dimension
5. Side wall roughness (scallop depth): 6nm – 700nm
6. Only resists and SiO2 or Si3N4 allowed as etching mask
7. Handling 6" or smaller samples
8. Absolutely no-metal mask or metal stop layers
Available Processes
1. Micro Pillars
2. Nano Pillars
3. Micro Trenches
4. Nano Trenches
5. Via etch
6. Through wafer via etch
7. Wafer thinning | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 4:00 pm
Meet in LISE 311 from 1pm - 2pm. | 4 | 4 | Register! | | |
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| Training: Contact Angle Measurement Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
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11:30 am - 12:00 pm
| 4 | 4 | Register! | | | | Training: DOE-1 - ULVAC Deep Oxide Etcher training - In front of the tool inside cleanroom. | | Trainer: Kenlin Huang | DOE-1 - ULVAC Deep Oxide Etcher training
at 3:30 pm | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
3:30 pm - 4:30 pm
kenlinhuang@cns.fas.harvard.edu | 4 | 4 | Register! | | | | Training: Freeze Dryer/Lyophilizer Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
1:00 pm - 1:30 pm
| 4 | 4 | Register! | | | | Training: Introduction to Dry Etching - LISE 311 | | Trainer: Ling Xie | | This class teaches basic working principles of dry etching technologies, especially focusing on reactive ion etch (RIE) and ion beam etching (IBE). Dry etching capabilities at CNS Cleanroom will be introduced and etching system selection for your etching project will be discussed. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:00 am
| 12 | 12 | Register! | | | | Training: Planetary Ball Mill Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
1:30 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: RIE-11 Plasma Therm Diamond RIE - LISE G07 CNS Cleanroom at the tool | | Trainer: Ling Xie | 1. Introduction
The RIE-11 PT Versaline RIE is an Inductive Coupled Plasma Etching System with a maximum ICP source power of 1,200W and a maximum substrate bias power of 600W. The system is configured to handle 4” wafers and equipped with mechanical clamping and backside helium cooling features. Its substrate temperature can be controlled from 10°C to180°C. In addition, temperatures of three other components inside the chamber can also be controlled from 20°C to 180°C, including Lid, Ceramic Spool, and Metal Liner. Setting these components at elevated temperatures before processing will reduce by-product coating speed on chamber walls and stabilize chamber conditions for the first couple of runs after the tool was at a stand-by state for a long time.
2. Application
Only Diamond is allowed to be etched in this RIE and all other materials are forbidden.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:30 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: RIE-13 - Oxford PlasmaPro 100 Cobra 300 training - In front of the tool inside cleanroom. | | Trainer: Kenlin Huang | RIE-13 - Oxford PlasmaPro 100 Cobra 300 training
at 2:30 pm
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:30 pm - 3:30 pm
kenlinhuang@cns.fas.harvard.edu | 5 | 5 | Register! | | | | Training: SP-3 AJA 3-gun sputtering system training - CNS cleanroom (G-07) Dry Bay | | Trainer: Mughees Khan | | The system has one RF source and two DC sources (DC power supply is switchable between the two sources). SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with 1 RF and 1 DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their schedule. After 3 uses (with no problems) users are given 24/7 access. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:30 pm - 2:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 3 | 3 | Register! | | | | Training: Wetbench + Chemical Safety Training - OUTSIDE CLEANROOM ENTRANCE - G-07 LISE | | Trainer: Mac Hathaway | Training on proper behavior, rules and techniques for wet chemical processing on the CNS wetbenches.
Requires cleanroom access, AND a cleanroom suit ALREADY HANGING UP. Will generally be followed by cleanroom tour and demonstration at 1:30 PM. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
10:00 am - 12:30 pm
| 8 | 8 | Register! | | |
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| Training: Discussions for Nano/Micro fabrication questions - LISE G52 | | Trainer: Ling Xie | | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
3:00 pm - 3:30 pm
| 1 | 1 | Register! | | | | Training: Synergy H1m Plate Reader Training - G05 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
11:00 am - 12:00 pm
| 4 | 4 | Register! | | | | Training: XeF2-1 - Xactix e2 XeF2 Etch System - LISE G07 CNS Cleanroom | | Trainer: Ling Xie | XeF2 etch is mainly for isotopically etching silicon. It is widely used for releasing MEMS structures, such as switches, cantilevers, bridges, mirrors, membranes, channels, and thermal isolation cavities. Its merits include highly selective etch, no stiction problems as existed with wet etch, and long under cuts. XeF2 also etches Ge, Mo and SiGe and transitional metals W, Ti, Ta, TiN and TaN under certain conditions such as high temperatures, but won’t etch Al, Ni, Cr, Pt, Ga, MgO, ZnO, AlN, GaAs, resist, and PDMS.
The Xactix e2TM System installed in CNS Cleanroom is manufactured by SPTS, an Orbotech Company, its main features include:
• Table Top System
• PC based control software manages recipes, logs data and manages multiple users with password protection
• Open load system to handle multiple types of substrates (wafers, chips, dicing frames, packages) without special handling substrates
• Expansion chamber-based design for precise, repeatable pulse pressures, and ease of mixing XeF2 with other gasses.
• Transparent process chamber lid and shower head over full wafer allows visual inspection of the entire wafer.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: Zetasizer Nano ZS DLS Training - G05 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
1:00 pm - 2:00 pm
| 4 | 4 | Register! | | |
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| Training: JAWoollam Spectroscopic Ellipsometer training - LISE-G07, in the main cleanroom | | Trainer: Jiangdong Deng | | this training will cover the basic principle and operation procedure of JAWoollam Spectroscopic Ellipsometer system for thin film optical measurement. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:30 pm - 3:30 pm
| 4 | 4 | Register! | | |
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| Training: G05 Cell Culture and Cryo-Prep Room Orientation - Meet outside of G05 | | Trainer: Sandra Nakasone | | This safety orientation is mandatory for access to our biomaterials, cryo-prep, and cell culture BL2 laboratory (LISE G05). In order to gain access users must attend this orientation, complete at least one training for equipment inside G05, and take the "Laboratory Biosafety" online training from the Harvard EH&S website (https://www.ehs.harvard.edu/training). Email Sandra Nakasone (snakasone@cns.fas.harvard.edu) the certificate of completion once you are done. LONG PANTS and CLOSED-TOE SHOES MANDATORY. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
10:30 am - 11:00 am
LONG PANTS and CLOSED-TOE SHOES MANDATORY. Long hair must be tied up. | 6 | 6 | Register! | | | | Training: G06 Nanotechnology and Rapid Prototyping Room Orientation - Meet outside of G06 | | Trainer: Sandra Nakasone | | This safety orientation is mandatory for access to our chemical nanotechnology and rapid prototyping room (LISE G06). In order to gain access users must complete this safety orientation and at least one training for equipment inside G06. LONG PANTS AND CLOSED-TOE SHOES ARE MANDATORY. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
11:00 am - 11:30 am
LONG PANTS and CLOSED-TOE SHOES are MANDATORY. Long hair must be tied up. | 6 | 6 | Register! | | | | Training: RIE-09 Anatech Plasma O2 stripper - In front of the tool inside cleanroom. | | Trainer: Kenlin Huang | RIE-09 Anatech Plasma O2 stripper
at 3:30 pm on Monday | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
3:30 pm - 4:00 pm
kenlinhuang@cns.fas.harvard.edu | 5 | 5 | Register! | | |
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| Training: FIB-4 FEI Helios - Basic Training - B15F | | Trainer: Stephan Kraemer | | Introduction to basic concepts of Focused Ion Beam microscopy and the operation of the FEI Helios FIB. With help of a cross section analysis all relevant techniques of material deposition, cutting and high-resolution imaging will be demonstrated. These techniques are the necessary building blocks to perform more advanced tasks such as TEM sample preparation or 3D serial sectioning. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
1:00 pm - 5:00 pm
Prior SEM training recommended | 4 | 4 | Register! | | | | Training: Form2 3D Printer Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
3:00 pm - 3:30 pm
| 4 | 4 | Register! | | | | Training: Helix Laser Cutter Training - G06 | | Trainer: Sandra Nakasone | | Prereq 1: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. Prereq 2: You must complete the EH&S online training called "Enclosed Laser Instrument Safety" and email the certificate of completion to Sandra Nakasone (snakasone@cns.fas.harvard.edu). You can access the online training here: https://www.ehs.harvard.edu/training | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
1:00 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: Introduction to Thin Film Deposition Processes - Training area, outside CNS G-07 Cleanroom | | Trainer: Mac Hathaway | | Introduction to Thin Film Deposition processes and techniques, with an emphasis on process control and overall integration into your process flow. This is a PREREQUISITE for all deposition process training. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
10:00 am - 11:30 am
| 10 | 10 | Register! | | | | Training: Makerbot 3D Printer Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
2:00 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: RIE-8 STS ICP RIE Training - LISE G07 CNS Cleanroom at the tool | | Trainer: Ling Xie | The STS MPX/LPX RIE system is an Inductively Coupled Plasma Reactor that is used for Reactive Ion Etch. Using the ICP technology, this etch system is characterized with high plasma density, low operating pressure, high etch rate, excellent etch uniformity and low energy ion damage. Equipped with a chiller, the MPX/LPX system allows the substrate temperature to be controlled from 5 to 30°C.
Applications
The STS ICP RIE will be restricted to etch silicon-based materials, which include Si, SiO2, and Si3N4.
Features
¥ ICP assembly upper electrode powered up to 1,500 W
¥ RF biased lower electrode powered up to 300 W and chilled to 4 – 30°C
¥ Single wafer loadlock up to 6” wafer
¥ Available gases: SF6, CHF3, CH4, H2, Cl2, HBr, BCl3, Ar, N2, O2, and N2
¥ Windows 2000 software control PC
¥ Internet remote control capability
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:30 pm - 3:00 pm
| 4 | 4 | Register! | | |
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| Training: Contact Angle Measurement Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
11:30 am - 12:00 pm
| 4 | 4 | Register! | | | | Training: Freeze Dryer/Lyophilizer Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
1:00 pm - 1:30 pm
| 4 | 4 | Register! | | | | Training: Planetary Ball Mill Training - G06 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
1:30 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: SP-3 AJA 3-gun sputtering system training - CNS cleanroom (G-07) Dry Bay | | Trainer: Mughees Khan | | The system has one RF source and two DC sources (DC power supply is switchable between the two sources). SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with 1 RF and 1 DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their schedule. After 3 uses (with no problems) users are given 24/7 access. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:30 pm - 2:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 3 | 3 | Register! | | | | Training: Wetbench + Chemical Safety Training - OUTSIDE CLEANROOM ENTRANCE - G-07 LISE | | Trainer: Mac Hathaway | Training on proper behavior, rules and techniques for wet chemical processing on the CNS wetbenches.
Requires cleanroom access, AND a cleanroom suit ALREADY HANGING UP. Will generally be followed by cleanroom tour and demonstration at 1:30 PM. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
10:00 am - 12:30 pm
| 8 | 8 | Register! | | |
|
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| Training: Discussions for Nano/Micro fabrication questions - LISE G52 | | Trainer: Ling Xie | | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
3:00 pm - 3:30 pm
| 1 | 1 | Register! | | | | Training: Sharon TE-3, 4, and 5 thermal evaporator training - LISE G07 (CNS Cleanroom), PVD Bay | | Trainer: Malcolm Tse | | Training on TE-3, 4 and 5 for thermal evaporation of metals is covered. We meet at the system in the CNS cleanroom PVD bay. Training takes about 2 hours. Venting, loading a sample, pumping and evaporation are performed and explained. For these TE systems, users supply their own deposition materials and boats (sources). CNS supplies the materials for training. After this training you will have access to all 3 systems, which are collectively capable of depositing: Ti, Cr, Cu, Ag, Au, Al, etc. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
2:00 pm - 3:30 pm
| 4 | 4 | Register! | | | | Training: Synergy H1m Plate Reader Training - G05 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
11:00 am - 12:00 pm
| 4 | 4 | Register! | | | | Training: Zetasizer Nano ZS DLS Training - G05 | | Trainer: Sandra Nakasone | | Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
1:00 pm - 2:00 pm
| 4 | 4 | Register! | | |
|