CNS Training Events - Registration Page

 
  • Open Events
  • CNS Users Only
  • LISE Cleanroom Users Only
  • Month
Date TBD - you can pre-register for this training session.
CNS staff will notify you when a date has been set.
Training: Zeiss SEM Part 1: Online training - Harvard Training Portal
Trainer: Tim Cavanaugh
The SEM Part 1 training is available in an online format. You must pass this online training before taking the hands-on SEM training for our field emission Zeiss SEMs (FESEMs) or the EVO SEM. There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000007001
Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
 
Training: B15A online safety training - Harvard Training Portal
Trainer: Jules Gardener
CNS users who wish to use the instruments inside room B15A must complete the B15A safety training before gaining access to this room. The LISE B15A room safety training is available in an online format from https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/FAS-00013222 Please copy this URL into your browser to take the training. We recommend using Chrome, Safari or Internet Explorer.

You must pass this online training before room access can be granted. There is no sign-up required for our online trainings and these can be taken by CNS users at any time.

Please note that our online trainings can only be taken by CNS users who have a Harvard Key. If you are an external user and do not yet have a Harvard Key, please contact info@cns.fas.harvard.edu for information on how to get one.
 
Training: Sputter coater training (online) - Harvard Training Portal
Trainer: Jules Gardener
This training is for the HAR-050 EMS dual head and HAR-053 EMS single head sputter coaters located in the CNS Imaging sample preparation room (LISE B15A). These tools are optimized for coating SEM samples with a thin conductive layer. The HAR-050 is equipped with Pt/Pd and Au targets, although Cr is available as an adhesion layer upon request. The HAR-053 is for Pt/Pd deposition only. We cannot accommodate other metal targets in this sputter coater, and this instrument is not suitable for depositing thick films.

Sputter coater training is available in an online format for these tools. You must pass this online training, and have completed the B15A room safety training (also available online), before access to the sputter coaters can be granted. Once you have completed these requirements, you will have access to both sputter coaters. There is no sign-up required for our online trainings and these can be taken by CNS users at any time. You can access the sputter coater training course at https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/FAS-00013226 Please copy this URL into your browser to take the training. We recommend using Chrome, Safari or Internet Explorer.

Please note that our online trainings can only be taken by CNS users who have a Harvard Key. If you are an external user and do not yet have a Harvard Key, please contact info@cns.fas.harvard.edu for information on how to get one.
 
Training: TEM Training Part 1: Online training - Harvard Training Portal
Trainer: Jules Gardener
This is a new online training which is required as the first step of TEM training for the JEOL 2100 and FEI F20 instruments. This training will provide an introduction to TEM concepts and background about our TEMs. You must pass the assessment at the end of this online course before attending an in-person TEM training on the JEOL 2100 or FEI F20 instruments. There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000010142

Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
 
Tuesday, November 13th, 2018
Training: Arctica Basic Cryo-EM training Day1 - B58 control room
Trainer: Svetla Stoilova-McPhie
The tranees will get familiar with the Cryo-EM workflow of the Tecnai Artica for screening Cryo-EM grids
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 5:00 pm
2FULLRegistration Closed
 
Training: Atomic Layer Deposition (ALD) Training ALD-1 and ALD-4 (Oxides) - Gowning Area - G-07 Cleanroom (Yes, we start in the GOWNING AREA)
Trainer: Mac Hathaway
Equipment and Process Engineering Training for ALD-1 and ALD4. PREREQUISITE - You must take the Thin Film Deposition Introductory class before taking ALD, CVD, Evaporator, and/or Sputtering System training.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 3:00 pm
54Register!
 
Training: Cleanroom Orientation - Meet in front of G07
Trainer: John Tsakirgis
To understand our protocols and complete registration.
TimeMax AttendeesAvailableOpen Event!
1:00 pm - 2:30 pm
Please be prompt
109Register!
 
Training: CVD-3 Training: STS PECVD Training Session - Dry processing bay in the cleanroom
Trainer: Philippe de Rouffignac
Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This training will provide users with the tools necessary to grow high quality SiO2, SiNx, and a:Si films at temperatures from ~200 to 350C. These films can also be doped with B or P.
This tool is equipped with two RF generators, one at 13.56MHz (High frequency, HF recipes) and 380 kHz (low frequency, LF recipes). There are also recipes that take advantage of both RF generators to yield films with lower stress esp. silicon nitride films.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 2:30 pm
prerequisite: Introduction to Thin Film Growth and Processing
5FULLRegistration Closed
 
Training: Disco Dicing Saw Training Part-1 - LISE G06
Trainer: Jason Tresback
Dicing saw training Part-1 group demo
TimeMax AttendeesAvailableCNS Users ONLY
3:00 pm - 4:00 pm
3FULLRegistration Closed
 
Training: Form2 SLA 3D Printer Training - G06
Trainer: Sandra Nakasone
Pre-requisite: LISE G06 Room Safety Orientation
Build volume: 5.7” x 5.7” x 6.9” (145 x 145 x 175 mm)
Layer thickness: 25 – 100 microns
Laser spot size: 140 microns
Laser power: 250mW
Material/color: Clear Resin
TimeMax AttendeesAvailableCNS Users ONLY
3:00 pm - 3:30 pm
32Register!
 
Training: Heidelberg MLA150 Maskless Aligner - Meet in the metrology bay
Trainer: Guixiong Zhong
Training on the Heidelberg MLA150 Maskless Aligner. This tool can be used to expose positive and negative photoresist without the need for a photomask. The MLA150 has 1 micron or better feature resolution, 0.5 micron alignment accuracy. The prerequisites for this training are the wet bench training, and Introduction to Lithography training.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:00 pm - 3:00 pm
4FULLRegistration Closed
 
Training: Helix 75W Laser Cutter NEW USERS - G06
Trainer: Sandra Nakasone
This training is for new users. No experience necessary.
Requirement: Complete the “Enclosed Laser Instruments Safety” Online training https://www.ehs.harvard.edu/training
Send me the Certificate of Completion via email (snakasone@cns.fas.harvard.edu)
Laser Power: 75W
Working Surface area: 24" x 18" x 8.5" (610 x 457 x 215.9 mm)
Spot size: 0.003" - 0.005" (0.0762 - 0.127 mm)
Wavelength: 10.6 microns
Accuracy: +/- .01" (0.254 mm) over the entire table
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
42Register!
 
Training: Horiba LabRam Raman and PL - LISE G04
Trainer: Arthur McClelland
Learn to use the Horiba LabRam system with 532 and 633 nm excitation lines for Raman and PL spectroscopy and mapping. Full polarization control and cryostat options available.
TimeMax AttendeesAvailableCNS Users ONLY
9:30 am - 11:30 am
32Register!
 
Training: Introduction to Scanning Probe Microscopy - LISE 311
Trainer: Antonio Ambrosio
This is an introduction to Scanning Probe Microscopy (SPM) aimed at providing general concept of AFM microscopy. It is also used as orientation for the potential users to the
TimeMax AttendeesAvailableCNS Users ONLY
4:00 pm - 6:00 pm
107Register!
 
Training: Introduction to TEM using the JEOL 2100 - B15C
Trainer: Adam Graham
In this training you will learn to use the JEOL 2100. This will include start up, Alignment, high resolution imaging and shut down. This training will be mostly hands on and is part 2 of the TEM training. Online training required before attending this event. Access will be granted after successful completion of online training, hands on training and independant certification.
TimeMax AttendeesAvailableCNS Users ONLY
9:00 am - 3:30 pm
Online training required
43Register!
 
Training: Introduction to Thin Film Deposition Processes - Training area, outside CNS G-07 Cleanroom
Trainer: Mac Hathaway
Introduction to Thin Film Deposition processes and techniques, with an emphasis on process control and overall integration into your process flow. This is a PREREQUISITE for all deposition process training.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:30 am
107Register!
 
Training: LPCVD and APCVD Training (CVD 5,6,7,9,10,11) - Dry Processing Bay in cleanroom
Trainer: Philippe de Rouffignac
Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This is a general training for all of the LPCVD and APCVD furnaces. These Tystar furnaces can accommodate anything from a single 1cm substrate up to 50 6" wafers.
The various furnaces encompass the following processes:
- Anneals non metal containing samples from 250 to 1100C under O2, N2, and H2/He
- Anneals of metal containing samples from 250 to 1100C under N2 and H2/He
- Low stress and stoichiometric silicon nitride
- Amorphous and polycrystalline silicon (doped with P or B or undoped)
- SiO2 from TEOS (conformal, additive SiO2 process)
- SiO2 from oxidation of silicon using H2O or O2
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
10:00 am - 11:30 am
prerequisite: Introduction to Thin Film Growth and Processing
42Register!
 
Training: MakerBot 3D Printer Training - G06
Trainer: Sandra Nakasone
Pre-requisite: LISE G06 Room Safety Orientation
Build volume: 11.6” x 7.6” x 6.5” (29.5 x 19.5 x 16.5 cm)
Layer thickness: 100 – 300 microns
Material/color: Black PLA filament
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 3:00 pm
33Register!
 
Training: Nikon XTH 225 Micro-CT Training - LISE G27
Trainer: Hao-Yu (Greg) Lin
Non-destructive 3D X-ray imaging technique.
Include software, Avizo and VGStudio MAX for the analysis and visualization of computed tomography (CT) data.
TimeMax AttendeesAvailableCNS Users ONLY
3:00 pm - 5:00 pm
hylin@fas.harvard.edu
42Register!
 
Training: RIE 10 DRIE Training - Meet in LISE 311 for the first hour then CNS cleanroom
Trainer: Ling Xie
You have to finish NF-Training "Dry Etching Intro" first and then take this training!

SPTS RIE-10, a state-of-the-art deep silicon etching system, is furnished with dual plasma sources and dual gas inlets. The tool is characterized with high etch rate 6-10 µm/min; high aspect ratio 50:1; good selectivity > 50:1 to resist and >100:1 to silicon oxide; and a good uniformity < 5% cross 6” wafers. Its fixed RF matching technology reduces the step-process time to 1 second, which leads to a controllable side wall roughness < 6nm for nanoscale features. Major features include:

• Primary rf power up to 3,000W
• Secondary rf power up to 3,000W
• Substrate power up to 300W
• Chuck temperatures from -15°C to +40°C
• Handling 6″ or smaller samples
• Claritas End Point Detector

Applications
• Si etch only
• High aspect ratio etch: 5 – 50
• Deep etch: 5µm – through Si wafer etch
• Broad feature sizes: from nano- to mm- scales in lateral dimension
• Side wall roughness (scallop depth): 6nm – 700nm
• Only resists and SiO2 or Si3N4 allowed as etching mask
• Handling 6″ or smaller samples
• Absolutely no-metal mask or metal stop layers

Available Processes
• Micro Pillars
• Nano Pillars
• Micro Trenches
• Nano Trenches
• Via etch
• Through wafer via etch
• Wafer thinning
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:00 pm - 4:00 pm
43Register!
 
Training: RIE 10 DRIE Training - Meet in LISE 311 for the first hour then CNS cleanroom
Trainer: Ling Xie
You have to finish NF-Training "Dry Etching Intro" first and then take this training!

SPTS RIE-10, a state-of-the-art deep silicon etching system, is furnished with dual plasma sources and dual gas inlets. The tool is characterized with high etch rate 6-10 µm/min; high aspect ratio 50:1; good selectivity > 50:1 to resist and >100:1 to silicon oxide; and a good uniformity < 5% cross 6” wafers. Its fixed RF matching technology reduces the step-process time to 1 second, which leads to a controllable side wall roughness < 6nm for nanoscale features. Major features include:

• Primary rf power up to 3,000W
• Secondary rf power up to 3,000W
• Substrate power up to 300W
• Chuck temperatures from -15°C to +40°C
• Handling 6″ or smaller samples
• Claritas End Point Detector

Applications
• Si etch only
• High aspect ratio etch: 5 – 50
• Deep etch: 5µm – through Si wafer etch
• Broad feature sizes: from nano- to mm- scales in lateral dimension
• Side wall roughness (scallop depth): 6nm – 700nm
• Only resists and SiO2 or Si3N4 allowed as etching mask
• Handling 6″ or smaller samples
• Absolutely no-metal mask or metal stop layers

Available Processes
• Micro Pillars
• Nano Pillars
• Micro Trenches
• Nano Trenches
• Via etch
• Through wafer via etch
• Wafer thinning
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:00 pm - 4:00 pm
44Register!
 
Training: SEM-10 - Hitachi SU8230 SEM user training - In the cleanroom, next to the SEM
Trainer: Christine Yi-Ju Wang
Previous SEM experience preferred.
For users who are new to SEM, please complete the Harvard SEM on-line training-
There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000007001
Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
10:30 am - 11:30 am
2FULLRegistration Closed
 
Training: Transparency Photomask Printer Training - hylin@fas.harvard.edu
Trainer: Hao-Yu (Greg) Lin
Minimum 10 um resolution
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
44Register!
 
Training: Zeiss SEM Part 2 Training (Pre-Requisite Part 1 Online Training) - LISE B20B
Trainer: Tim Cavanaugh
This training covers the Zeiss FESEMs (Ultra55, Supra55VP, and UltraPlus). Topics include a discussion of microscope capabilities, software overview, and training provides a hands-on approach to acquiring high resolution surface images of various materials under different conditions. Users must complete the available “Zeiss SEM Part 1: Online training” prior to registration.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 4:00 pm
4FULLRegistration Closed
 
Wednesday, November 14th, 2018
Training: Arctica Basic Cryo-EM training Day2 - B58 control room
Trainer: Svetla Stoilova-McPhie
This training has to be taken the day after Day1. The trainees will practice in their own area with a standard specimen. The certification will be the acquiring of a correct image at the conditions required for Cryo-EM grids' screening.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 5:00 pm
2FULLRegistration Closed
 
Training: AS200 i-line stepper training - Meet at the photolithography bay inside the clean room
Trainer: Guixiong Zhong
Training for the stepper. System overview, job making, editing, reticle loading, wafer loading, and unloading will be covered in the training. Please see the tool webpage for more information on the capabilities of this tool. The prerequisite for this training is the Introduction to Lithography training.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 3:00 pm
43Register!
 
Training: Cypher AFM General Training (attending the class - G12
Trainer: Antonio Ambrosio
This is the training event where the Cypher AFM is presented. The two hours class "Introduction to Scanning Probe Microscopy" is mandatory before attending this training event.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 3:00 pm
41Register!
 
Training: Denton E-beam Evaporator (EE-4) training - LISE G07 (cleanroom); PVD Bay
Trainer: Ed Macomber
Use of the EE-4 for thin film metal deposition is covered by going through a standard deposition. EE-4 is fully automated and can deposit the following materials: Au, Pt, Ag, Ti, Cr, Pd. PLEASE NOTE: these listed materials are the only materials that can be used in EE-4. We use a test sample for a quick deposition, which is all that's required for the training. Plan on ~1 hr for this training. We meet promptly right at the machine in the LISE CR PVD bay.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:00 pm - 3:00 pm
(check links in confirmation email for documents)
5FULLRegistration Closed
 
Training: FTIR spectroscopy and microscopy - LISE G04
Trainer: Arthur McClelland
Learn to use the Nicolet iS50 with midIR and farIR spectral ranges and the Bruker Lumos with midIR mapping capabilities.
TimeMax AttendeesAvailableCNS Users ONLY
9:30 am - 11:00 am
3FULLRegistration Closed
 
Training: Introduction to Dry Etching - LISE 311
Trainer: Ling Xie
This class teaches basic working principles of dry etching technologies, especially focusing on reactive ion etch (RIE) and ion beam etching (IBE). Dry etching capabilities at CNS Cleanroom will be introduced and etching system selection for your etching project will be discussed.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:00 am
This class is pre-requested for accessing any RIEs and IBE trainings
61Register!
 
Training: Introduction to Lithography - LISE 319
Trainer: Christine Yi-Ju Wang
The class describes the basic working principles of lithography techniques. It also gives an overview of tools that are available in CNS. This is a prerequisite for all lithography process trainings.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
106Register!
 
Training: MA6 Mask aligner - In the cleanroom, next to the tool
Trainer: Christine Yi-Ju Wang
Prerequisite: "Introduction to Lithography"
The MA6 mask aligner is good for 3-6" substrates, 4-7" photomasks, with bask side alignment capability.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
11:30 am - 12:00 pm
3FULLRegistration Closed
 
Training: Metrology for Nanofabrication Part-1 (Stylus Profilometry, Ellipsometry, and Electrical Property Measurements) - LISE G07
Trainer: Jason Tresback
Please register and attend the Introduction to Metrology for Nanofabrication Lecture before attending Metrology for Nanofabrication part-1 or 2. Metrology for Nanofabrication part-1 is NOT required to attend part-2. This metrology part-1 training event will focus on fundamental measurement tools for nanofabrication including, contact/stylus surface Profilometer (DekTak XT and 6m) (PL-5/8), single wavelength scanning Ellipsometer (Gaertner-LSE) (ES-2), scanning sheet resistance mapping (CDE-ResMap 4-Pt Probe system) (MET-2), and Semiconductor Parameter Analyzer w/ Signatone 4-Pt Probe Station (Agilent 4156C & Signatone 4pt Probe Station)(PB-1 & CE-1/2). Full independent access to these tools listed above can be achieved, however the amount of time spent on each tool will vary based on participants. We meet inside the Cleanroom gowning area or within the Metrology Bay inside the CNS cleanroom (G07).
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
11:00 am - 12:30 pm
32Register!
 
Training: MJB4 mask aligner - In the cleanroom, next to the tool
Trainer: Christine Yi-Ju Wang
Prerequisite: "Introduction to Lithography"
The MJB4 mask aligner is good for up to 4" substrates, 4" and 5" photomasks. Fast troughput with optimum resolution of 2um.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
11:00 am - 11:30 am
33Register!
 
Training: RIE-11 Diamond RIE Training - LISE G07 CNS Cleanroom
Trainer: Ling Xie
You have to finish NF-Training "Dry Etching Intro" first and then take this training!

PT RIE-11 is Plasma-Therm’s Versaline Inductive Coupled Plasma (ICP) etching system, a product resulting from decades of technology evolution. Its 2 MHz ICP RF for efficient coupling of power to plasma makes etching results stable and repeatable. Well designed thermal management components control chamber temperatures at desired values from beginning to the end during processes. Major features include:

• ICP RF up to 1,200 W
• RF bias up to 600 W
• Substrate temperatures from 10 °C to 180 °C
• Lid, ceramic spool, and metal liner temperatures from 20 °C to 180 °C

Applications
Diamond etch only

Available Processes
• Thorough O2 plasma chamber cleaning processes for NV center applications
• Nano-feature etch
• Diamond thinning
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 3:00 pm
44Register!
 
Training: RTP-2 Atmospheric Rapid Thermal Processing - Inside cleanroom in PVD Bay
Trainer: John Tsakirgis
To understand the Safety and Operation of the Atmospheric Rapid Thermal tool at CNS
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:00 am
PLease be prompts and bring cleanroom notebook
54Register!
 
Training: TE-3 - Sharon Thermal Evaporator TE-3 - LISE G07 (CNS Cleanroom), PVD Bay
Trainer: Malcolm Tse
Training on TE-3, 4 and 5 for thermal evaporation of metals is covered. We meet at the system i n the CNS cleanroom PVD bay. Training takes about 2 hours. Venting, loading a sample, pumping and evaporation are performed and explained. For these TE systems, users supply their own deposition materials and boats (sources). CNS supplies the materials for training. After this training you will have access to all 3 systems, which are collectively capable of depositing: Ti, Cr, Cu, Ag, Au, Al, etc.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 12:00 pm
4FULLRegistration Closed
 
Training: Thermo Scienitifc Nexsa surface analysis training - LISE G27
Trainer: Hao-Yu (Greg) Lin
Capable to do XPS, UPS, ISS and REELS
Pre-requisite: Thermo Scientific K-Alpha+ XPS Training
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 4:00 pm
Pre-requisite: Thermo Scientific K-Alpha+ XPS Training
41Register!
 
Training: Wetbench + Chemical Safety Training - OUTSIDE CLEANROOM ENTRANCE - G-07 LISE
Trainer: Mac Hathaway
Training on wetbench safety, chemical safety, Situational Awareness, and how to not DIE at the wetbenches. MAKE SURE YOUR CLEAN SUIT IS HANGING UP READY TO GO.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 12:30 pm
84Register!
 
Thursday, November 15th, 2018
Training: ALD-2 Arradiance GEMStar ALD and Pulsed CVD Training - G-07 Cleanroom
Trainer: Philippe de Rouffignac
Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This tool utilizes both ALD and pulsed CVD techniques to grow conductive, conformal thin films.
Currently those include Ni, NiNx and WNx. These films are the most conductive ALD films available at the CNS.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:00 am
prerequisite: Introduction to Thin Film Growth and Processing
44Register!
 
Training: Autogrids Assembly - GO5
Trainer: Svetla Stoilova-McPhie
Trainees will be demonstrated autogrids assembly in G05 at room temperature and in LN2. Trainees will practice at room temperature and will book for LN2 temperature assembly for their own samples.
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 3:30 pm
2FULLRegistration Closed
 
Training: Cleanroom orientation - Meet in front of G07
Trainer: John Tsakirgis
To understand our protocols and complete your registration
TimeMax AttendeesAvailableOpen Event!
1:00 pm - 2:30 pm
Please be prompt
1010Register!
 
Training: Cypher AFM certification (attending the class - G12
Trainer: Antonio Ambrosio
This is a certification event for the Asylum Cypher AFM. Attending Part -1 "Asylum Cypher AFM - General Training" is mandatory for this training event.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 3:00 pm
2FULLRegistration Closed
 
Training: DelsaNano DLS System Training - G05
Trainer: Sandra Nakasone
Pre-requisite: LISE G05 Room Safety Orientation
Model: DelsaNano C
Make: Beckman Coulter
Sample volume: 1mL (for size) and 2.5mL (for zeta potential)
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
33Register!
 
Training: Discussion for nanofabrication related questions. - LISE G52
Trainer: Ling Xie
TimeMax AttendeesAvailableCNS Users ONLY
3:00 pm - 3:30 pm
11Register!
 
Training: Plate Reader Training - G05
Trainer: Sandra Nakasone
Pre-requisite: LISE G05 Room Safety Orientation
Model: Synergy H1m
Make: BioTek
TimeMax AttendeesAvailableCNS Users ONLY
11:00 am - 12:00 pm
33Register!
 
Training: Soft Materials Cleanroom (SMCR) Orientation - We meet in the ground floor couches (outside G07)
Trainer: Sandra Nakasone
This combined safety orientation and tool training is the complete training required for access to the Soft Materials CleanRoom (SMCR) located in LISE G07A. The SMCR is a cleanroom devoted to Soft Lithography with a focus on rapid prototyping of microfluidic devices using PDMS elastomer. During the training you will be given more information about the completion of the online quiz that will allow you to get full access to the SMCR.
TimeMax AttendeesAvailableCNS Users ONLY
2:30 pm - 4:30 pm
63Register!
 
Training: Spinner training - In the cleanroom, photolithography bay
Trainer: Christine Yi-Ju Wang
The training covers the use and programming of the spinner. This training is required for all lithography processes (Ebeam, MLA150, uPG501, mask aligners, etc).
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 2:00 pm
43Register!
 
Training: UV-VIS-NIR spectroscopy - LISE G04
Trainer: Arthur McClelland
Learn to use the Cary 7000 UV-VIS-NIR system for reflection or transmission measurements from 200-2700 nm with angle and polarization control. Integrating sphere also available.
TimeMax AttendeesAvailableCNS Users ONLY
9:30 am - 11:30 am
33Register!
 
Friday, November 16th, 2018
Training: CVD-4 Lindberg Furnace - Meet in front of G27, Please be prompts and bring notebook
Trainer: John Tsakirgis
To understand the Safety and Operation of our Lindberg Furnace
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 10:00 am
Please be prompt and bring cleanroom notebook
55Register!
 
Training: Denton E-beam Evaporator (EE-4) training - LISE G07 (cleanroom); PVD Bay
Trainer: Ed Macomber
Use of the EE-4 for thin film metal deposition is covered by going through a standard deposition. EE-4 is fully automated and can deposit the following materials: Au, Pt, Ag, Ti, Cr, Pd. PLEASE NOTE: these listed materials are the only materials that can be used in EE-4. We use a test sample for a quick deposition, which is all that's required for the training. Plan on ~1 hr for this training. We meet promptly right at the machine in the LISE CR PVD bay.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
11:30 am - 12:30 pm
(check links in confirmation email for documents)
5FULLRegistration Closed
 
Training: JAWoollam Spectroscopic Ellipsometer training - LISE-G07, in the main cleanroom
Trainer: Jiangdong Deng
In this advanced spectroscopic ellipsometer training, the basic ellipsometry principle, operation procedure, and basic data analysis skills will be covered. Some advanced thin film measurement strategies will be discussed.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 3:30 pm
42Register!
 
Monday, November 19th, 2018
Training: FIB Helios - Basics - LISE B15 F
Trainer: Stephan Kraemer
Users will be introduced to the basic handling of the instrument and its capabilities. A brief introduction into the underlying interaction of the ion beam with the material is given. At the end of the session users will be able to run a basic cross section analysis. Specific topics are: bringing sample to eucentric height, electron and ion beam alignment, deposition of protection layers, preparation and cleaning of cross sections, recording of high-resolution SEM images. These form the basis for more advanced tasks such as TEM sample preparation or serial section 3D analysis.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 5:00 pm
Prior SEM experience recommended.
43Register!
 
Training: LISE G05 Biomaterials Room Safety Orientation - Outside G05
Trainer: Sandra Nakasone
This safety orientation is mandatory for access to our biomaterials and cell culture BL2 laboratory (LISE G05). In order to gain access users must complete this safety orientation and at least one training for equipment inside G05. Long pants and closed toe shoes required!

This training will provide the safety information, room orientation and basic guidelines for working in the Biological Materials Facility. This space houses our cell culture biohoods, incubators, plate reader, DLS system, Ultramicrotome, and fluorescence microscope.
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 2:30 pm
65Register!
 
Training: LISE G06 Chemical Nanotechnology Room Orientation - Outside G06
Trainer: Sandra Nakasone
This safety orientation is mandatory for access to our chemical nanotechnology room (LISE G06). In order to gain access users must complete this safety orientation and at least one training for equipment inside G06. Long pants and closed toe shoes required!

This space houses Helix laser cutter, 3D printers, nanotechnology tools (sonicator, ball mill, weighing balances), Chemical process tools (acid & solvent benches), Disco wafer dicing saw, Stylus profiler and lithography tools (PDMS, mixer, spincoater, degassing chamber, oven).
TimeMax AttendeesAvailableCNS Users ONLY
2:30 pm - 3:00 pm
64Register!
 
Training: Plasma O2 stripper : RIE 09 and RIE 05 - In front of the tool , inside cleanroom.
Trainer: Kenlin Huang
Dry etching Intro Class is the prerequisite for taking training class of Plasma O2 stripper : RIE 09 and RIE 05 at 03:30 pm
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
3:30 pm - 4:00 pm
kenlnhuang@cns.fas.harvard.edu,617-495-1738
43Register!
 
Training: SP-3 AJA 3-gun sputtering system training - CNS cleanroom (G-07) Dry Bay
Trainer: Christine Yi-Ju Wang
Prerequisite: "Introduction to Thin Film deposition processes"
The system has one RF source and two DC sources (DC power supply is switchable between the two sources). SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with 1 RF and 1 DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their own schedule. After 3 uses (with no problems) users are given 24/7 access.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 2:30 pm
22Register!
 
Training: Zeiss SEM Part 2 Training (Pre-Requisite Part 1 Online Training) - LISE B20B
Trainer: Tim Cavanaugh
This training covers the Zeiss FESEMs (Ultra55, Supra55VP, and UltraPlus). Topics include a discussion of microscope capabilities, software overview, and training provides a hands-on approach to acquiring high resolution surface images of various materials under different conditions. Users must complete the available "Zeiss SEM Part 1: Online training" prior to registration.
TimeMax AttendeesAvailableCNS Users ONLY
12:00 pm - 3:00 pm
4FULLRegistration Closed
 
Tuesday, November 20th, 2018
Training: Introduction to Metrology for Nanofabrication Lecture - LISE G07 Hallway
Trainer: Jason Tresback
This lecture is an informal discussion about the measurement tools and techniques available inside the nanofabrication cleanroom G07. The introduction serves as a pre-requisite for metrology for nanofabrication part 1 & 2 training events, however, metrology part-1 is not required to attend part-2. Please email jtresback@cns.fas.harvard.edu if you have any questions
TimeMax AttendeesAvailableCNS Users ONLY
3:00 pm - 4:00 pm
66Register!
 
Training: Cleanroom Orientation - Meet in front of G07
Trainer: John Tsakirgis
To understand our protocols and complete registration.
TimeMax AttendeesAvailableOpen Event!
1:00 pm - 2:30 pm
Please be prompt
109Register!
 
Training: DOE01-ULVAC Deep Oxide Etcher Training - in front of the tool ,inside the G7 cleanroom
Trainer: Kenlin Huang
Dry etching Intro Class is the prerequisite for taking DOE01-ULVAC Deep Oxide Etcher Training
10:30 t0 11:30 am Tuesday
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
10:30 am - 11:30 am
kenlinhuang@cns.fas.harvard.edu, 617-495-1738
43Register!
 
Training: Form2 SLA 3D Printer Training - G06
Trainer: Sandra Nakasone
Pre-requisite: LISE G06 Room Safety Orientation
Build volume: 5.7” x 5.7” x 6.9” (145 x 145 x 175 mm)
Layer thickness: 25 – 100 microns
Laser spot size: 140 microns
Laser power: 250mW
Material/color: Clear Resin
TimeMax AttendeesAvailableCNS Users ONLY
3:00 pm - 3:30 pm
33Register!
 
Training: Helix 75W Laser Cutter NEW USERS - G06
Trainer: Sandra Nakasone
This training is for new users. No experience necessary.
Requirement: Complete the “Enclosed Laser Instruments Safety” Online training https://www.ehs.harvard.edu/training
Send me the Certificate of Completion via email (snakasone@cns.fas.harvard.edu)
Laser Power: 75W
Working Surface area: 24" x 18" x 8.5" (610 x 457 x 215.9 mm)
Spot size: 0.003" - 0.005" (0.0762 - 0.127 mm)
Wavelength: 10.6 microns
Accuracy: +/- .01" (0.254 mm) over the entire table
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
44Register!
 
Training: Horiba LabRam Raman and PL - LISE G04
Trainer: Arthur McClelland
Learn to use the Horiba LabRam system with 532 and 633 nm excitation lines for Raman and PL spectroscopy and mapping. Full polarization control and cryostat options available.
TimeMax AttendeesAvailableCNS Users ONLY
9:30 am - 11:30 am
33Register!
 
Training: Intermediate Arctica Cryo-EM training - B58 control room
Trainer: Svetla Stoilova-McPhie
This training is the conclusion of the Basic Arctica Cryo-EM training and should be taken the week after Day1 and Day2. Trainee should split: one the morning starting 10am and one the afternoon starting 2 pm. Certification for the Intermediate training will give access to the control room - B58 and the scheduling system.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 5:00 pm
2FULLRegistration Closed
 
Training: Introduction to Thin Film Deposition Processes - Training area, outside CNS G-07 Cleanroom
Trainer: Mac Hathaway
Introduction to Thin Film Deposition processes and techniques, with an emphasis on process control and overall integration into your process flow. This is a PREREQUISITE for all deposition process training.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:30 am
109Register!
 
Training: MakerBot 3D Printer Training - G06
Trainer: Sandra Nakasone
Pre-requisite: LISE G06 Room Safety Orientation
Build volume: 11.6” x 7.6” x 6.5” (29.5 x 19.5 x 16.5 cm)
Layer thickness: 100 – 300 microns
Material/color: Black PLA filament
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 3:00 pm
33Register!
 
Training: RIE-7 - Unaxis Shuttleline ICP RIE - in front of the tool inside clearoom.
Trainer: Kenlin Huang
RIE-7 - Unaxis Shuttleline ICP RIE training
3:30 - 4:30 pm
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
3:30 pm - 4:30 pm
kenlinuang@cns.fas.harvard.edu
43Register!
 
Training: SEM-10 - Hitachi SU8230 SEM user training - In the cleanroom, next to the SEM
Trainer: Christine Yi-Ju Wang
Previous SEM experience preferred.
For users who are new to SEM, please complete the Harvard SEM on-line training-
There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000007001
Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
10:30 am - 11:30 am
21Register!
 
Training: Sharon TE-3, 4, and 5 thermal evaporator training - LISE G07 (CNS Cleanroom), PVD Bay
Trainer: Malcolm Tse
Training on TE-3, 4 and 5 for thermal evaporation of metals is covered. We meet at the system in the CNS cleanroom PVD bay. Training takes about 2 hours. Venting, loading a sample, pumping and evaporation are performed and explained. For these TE systems, users supply their own deposition materials and boats (sources). CNS supplies the materials for training. After this training you will have access to all 3 systems, which are collectively capable of depositing: Ti, Cr, Cu, Ag, Au, Al, etc.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:30 am
44Register!
 
Training: SPECTRO XEPOS XRF Training - LISE G27
Trainer: Hao-Yu (Greg) Lin
Energy dispersive X-ray fluorescence (ED-XRF) spectrometer for elemental analysis of liquid, solid, powder and thin film samples.
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 3:30 pm
hylin@fas.harvard.edu
44Register!
 
Training: STS RIE-8 - LISE CNS Cleanroom
Trainer: Ling Xie
You have to finish NF-Training "Dry Etching Intro" first and then take this training!

STS RIE - 8 is an Inductively Coupled Plasma etching system and characterized with high plasma density, low operating pressure, high etch rate, excellent etch uniformity, and low energy ion damage. Major features include:

• ICP power up to 1,500 W
• RF bias up to 300 W
• Available gases: SF6, C4F8, CHF3, CF4, H2, Cl2, HBr, BCl3, Ar, O2, and N2
• Substrate temperatures from 10 °C to 30 °C
• Handling 6″ or smaller samples

Applications
Etching silicon-based materials, boron nitride, and other compatible 2-D materials

Available Processes
• High aspect ratio Si pillars
• Si nano-wires and nano-needles
• Si micro holes
• Si trenches
• SiO2 and Si3N4 trenches
• Graphene and boron nitride etch
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 3:00 pm
41Register!
 
Wednesday, November 21st, 2018
Training: Contact Angle Measuring Tool Training - G06
Trainer: Sandra Nakasone
Pre-requisite: LISE G06 Room Safety Orientation
TimeMax AttendeesAvailableCNS Users ONLY
11:00 am - 11:30 am
33Register!
 
Training: Cypher AFM General Training (attending the class - G12
Trainer: Antonio Ambrosio
This is the training event where the Cypher AFM is presented. The two hours class "Introduction to Scanning Probe Microscopy" is mandatory before attending this training event.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 3:00 pm
44Register!
 
Training: Introduction to Lithography - LISE 319
Trainer: Christine Yi-Ju Wang
The class describes the basic working principles of lithography techniques. It also gives an overview of tools that are available in CNS. This is a prerequisite for all lithography process trainings.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
1010Register!
 
Training: KLA-Tencor P-16 Profiler Training - LISE G06
Trainer: Hao-Yu (Greg) Lin
Surface metrology analysis technique.
Capable of step height analysis, surface contour, waviness and roughness measurements with detailed 2D or 3D analysis of topography for a variety of surfaces and materials.
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 3:00 pm
hylin@fas.harvard.edu
44Register!
 
Training: Lyophilizer/Freeze Dryer Training - G06
Trainer: Sandra Nakasone
Pre-requisite: LISE G06 Room Safety Orientation
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 1:30 pm
33Register!
 
Training: MA6 Mask aligner - In the cleanroom, next to the tool
Trainer: Christine Yi-Ju Wang
Prerequisite: "Introduction to Lithography"
The MA6 mask aligner is good for 3-6" substrates, 4-7" photomasks, with bask side alignment capability.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
10:30 am - 11:00 am
33Register!
 
Training: Metrology for Nanofabrication Part-1 (Stylus Profilometry, Ellipsometry, and Electrical Property Measurements) - LISE G07
Trainer: Jason Tresback
Please register and attend the Introduction to Metrology for Nanofabrication Lecture before attending Metrology for Nanofabrication part-1 or 2. Metrology for Nanofabrication part-1 is NOT required to attend part-2. This metrology part-1 training event will focus on fundamental measurement tools for nanofabrication including, contact/stylus surface Profilometer (DekTak XT and 6m) (PL-5/8), single wavelength scanning Ellipsometer (Gaertner-LSE) (ES-2), scanning sheet resistance mapping (CDE-ResMap 4-Pt Probe system) (MET-2), and Semiconductor Parameter Analyzer w/ Signatone 4-Pt Probe Station (Agilent 4156C & Signatone 4pt Probe Station)(PB-1 & CE-1/2). Full independent access to these tools listed above can be achieved, however the amount of time spent on each tool will vary based on participants. We meet inside the Cleanroom gowning area or within the Metrology Bay inside the CNS cleanroom (G07).
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
10:30 am - 12:30 pm
31Register!
 
Training: Metrology for Nanofabrication-Part 2 (Optical Profilometry and Veeco AFM) - LISE G07 Nanofabrication Cleanroom
Trainer: Jason Tresback
Please register and attend the Introduction to Metrology for Nanofabrication Lecture before attending Metrology for Nanofabrication part-1 or 2. Metrology for Nanofabrication part-1 is NOT required to attend part-2. This training event covers some advanced metrology techniques, such as the Optical Profiler (CCI HD) (PL-6) and the Atomic Force Microscope (Veeco NanoMan AFM) (SPM-5). Training on each tool may take up to 1 hour and after signing up for the training, users should also send an email to the CNS staff (jtresback@cns.fas.harvard.edu) to identify the tool they would like to learn and a brief description of the sample and measurement goal. Full independent access to the AFM (SPM-5) requires at least one individual user assisted session that serves as a qualification for independent use and scheduled on another day. AFM probes are provided for training; however users must supply their own probes during independent use. We meet inside the cleanroom gowning area or within the Metrology Bay inside the CNS cleanroom.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:30 pm - 4:30 pm
31Register!
 
Training: MJB4 mask aligner - In the cleanroom, next to the tool
Trainer: Christine Yi-Ju Wang
Prerequisite: "Introduction to Lithography"
The MJB4 mask aligner is good for up to 4" substrates, 4" and 5" photomasks. Fast troughput with optimum resolution of 2um.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
11:00 am - 11:30 am
33Register!
 
Training: Planetary Ball Mill Training - G06
Trainer: Sandra Nakasone
Pre-requisite: LISE G06 Room Safety Orientation
TimeMax AttendeesAvailableCNS Users ONLY
1:30 pm - 2:00 pm
33Register!
 
Training: Sharon EE-3 e-beam evaporator training - We meet in the cleanroom PVD bay (last bay inside of LISE G07)
Trainer: Ed Macomber
E-beam evaporation in EE-3 is covered; EE-3 can deposit 19 different materials (metals). All materials are user supplied for EE-3 (pellets and crucible liners). We will cover venting, loading the sample, pumping down (vacuum system) and the actual deposition. Plan on ~2 hr for this training. This is a manually operated deposition system and will likely take most users a few times using it to become comfortable with the machine. We meet in the cleanroom PVD bay (last bay inside LISE G07).
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:00 pm - 2:00 pm
(Please review document links in email confirmation)
5FULLRegistration Closed
 
Training: Spinner training - In the cleanroom, photolithography bay
Trainer: Christine Yi-Ju Wang
The training covers the use and programming of the spinner. This training is required for all lithography processes (Ebeam, MLA150, uPG501, mask aligners, etc).
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:30 pm - 3:00 pm
44Register!
 
Training: Thermo Scientific K-Alpha+ XPS Training - LISE G27
Trainer: Hao-Yu (Greg) Lin
Surface analysis technique.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 12:00 pm
hylin@fas.harvard.edu
4FULLRegistration Closed
 
Training: Wetbench + Chemical Safety Training - OUTSIDE CLEANROOM ENTRANCE - G-07 LISE
Trainer: Mac Hathaway
Training on wetbench safety, chemical safety, Situational Awareness, and how to not DIE at the wetbenches. MAKE SURE YOUR CLEAN SUIT IS HANGING UP READY TO GO.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 12:30 pm
87Register!
 
Thursday, November 22nd, 2018
Training: ALD3 - PDR Thermal ALD System Training - Cleanroom PVD Bay
Trainer: Philippe de Rouffignac
Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This ALD system utilizes a smaller chamber and faster heating and cooling to achieve quicker ALD process times. It is also equipped with an ozone generator that enables the growth of high quality, conformal SiO2 films as well as low temperature Pt metal films. Other films available include Al2O3, TiO2, and HfO2.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:00 am
prerequisite: Introduction to Thin Film Growth and Processing
44Register!
 
Training: Cleanroom orientation - Meet in front of G07
Trainer: John Tsakirgis
To understand our protocols and complete your registration
TimeMax AttendeesAvailableOpen Event!
1:00 pm - 2:30 pm
Please be prompt
1010Register!
 
Training: Cypher AFM certification (attending the class - G12
Trainer: Antonio Ambrosio
This is a certification event for the Asylum Cypher AFM. Attending Part -1 "Asylum Cypher AFM - General Training" is mandatory for this training event.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 3:00 pm
22Register!
 
Training: Horiba XploRa Raman, PL, hyperspectral imaging - LISE G04
Trainer: Arthur McClelland
Learn to use the Horiba Explora system with 405 and 785 nm exciation lines for Raman and PL spectroscopy and mapping. The system also has the Cytoviva hyperspectral module that allows for transmission or refection spectra in bright field or dark field to be collected at every pixel in your field of view.
TimeMax AttendeesAvailableCNS Users ONLY
1:30 pm - 3:30 pm
22Register!
 
Monday, November 26th, 2018
Training: Plasma O2 stripper : RIE 09 and RIE 05 - In front of the tool , inside cleanroom.
Trainer: Kenlin Huang
Dry etching Intro Class is the prerequisite for taking training class of Plasma O2 stripper : RIE 09 and RIE 05 at 03:30 pm
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
3:30 pm - 4:00 pm
kenlnhuang@cns.fas.harvard.edu,617-495-1738
44Register!
 
Training: RCA Cleaning station - Inside cleanroom
Trainer: John Tsakirgis
To understand the RCA Cleaning station here at CNS. The Operation and Safety of the Bench
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
10:00 am - 11:00 am
Please be prompt and bring cleanroom notebook
55Register!
 
Training: SP-3 AJA 3-gun sputtering system training - CNS cleanroom (G-07) Dry Bay
Trainer: Christine Yi-Ju Wang
Prerequisite: "Introduction to Thin Film deposition processes"
The system has one RF source and two DC sources (DC power supply is switchable between the two sources). SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with 1 RF and 1 DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their own schedule. After 3 uses (with no problems) users are given 24/7 access.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 2:30 pm
21Register!
 
Tuesday, November 27th, 2018
Training: Atomic Layer Deposition (ALD) Training ALD-1 and ALD-4 (Oxides) - Gowning Area - G-07 Cleanroom (Yes, we start in the GOWNING AREA)
Trainer: Mac Hathaway
Equipment and Process Engineering Training for ALD-1 and ALD4. PREREQUISITE - You must take the Thin Film Deposition Introductory class before taking ALD, CVD, Evaporator, and/or Sputtering System training.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 3:00 pm
55Register!
 
Training: Cleanroom Orientation - Meet in front of G07
Trainer: John Tsakirgis
To understand our protocols and complete registration.
TimeMax AttendeesAvailableOpen Event!
1:00 pm - 2:30 pm
Please be prompt
1010Register!
 
Training: CVD-3 Training: STS PECVD Training Session - Dry processing bay in the cleanroom
Trainer: Philippe de Rouffignac
Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This training will provide users with the tools necessary to grow high quality SiO2, SiNx, and a:Si films at temperatures from ~200 to 350C. These films can also be doped with B or P.
This tool is equipped with two RF generators, one at 13.56MHz (High frequency, HF recipes) and 380 kHz (low frequency, LF recipes). There are also recipes that take advantage of both RF generators to yield films with lower stress esp. silicon nitride films.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 2:30 pm
prerequisite: Introduction to Thin Film Growth and Processing
54Register!
 
Training: Heidelberg MLA150 Maskless Aligner - Meet in the metrology bay
Trainer: Guixiong Zhong
Training on the Heidelberg MLA150 Maskless Aligner. This tool can be used to expose positive and negative photoresist without the need for a photomask. The MLA150 has 1 micron or better feature resolution, 0.5 micron alignment accuracy. The prerequisites for this training are the wet bench training, and Introduction to Lithography training.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:00 pm - 3:00 pm
4FULLRegistration Closed
 
Training: Heidelberg uPG501 training - Meet in the metrology bay
Trainer: Guixiong Zhong
Training on the Heidelberg uPG501 direct-write lithography system. This tool can be used to expose positive and negative photoresist without the need for a photomask; it can also be used to write photomasks. uPG501 has 2 microns or better feature resolution, 1 micron alignment accuracy. The prerequisites for this training are the Introduction to Lithography class, wet bench training, and spinner/developing training.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
3:00 pm - 4:00 pm
43Register!
 
Training: Horiba LabRam Raman and PL - LISE G04
Trainer: Arthur McClelland
Learn to use the Horiba LabRam system with 532 and 633 nm excitation lines for Raman and PL spectroscopy and mapping. Full polarization control and cryostat options available.
TimeMax AttendeesAvailableCNS Users ONLY
9:30 am - 11:30 am
33Register!
 
Training: Introduction to Thin Film Deposition Processes - Training area, outside CNS G-07 Cleanroom
Trainer: Mac Hathaway
Introduction to Thin Film Deposition processes and techniques, with an emphasis on process control and overall integration into your process flow. This is a PREREQUISITE for all deposition process training.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:30 am
1010Register!
 
Training: LPCVD and APCVD Training (CVD 5,6,7,9,10,11) - Dry Processing Bay in cleanroom
Trainer: Philippe de Rouffignac
Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This is a general training for all of the LPCVD and APCVD furnaces. These Tystar furnaces can accommodate anything from a single 1cm substrate up to 50 6" wafers.
The various furnaces encompass the following processes:
- Anneals non metal containing samples from 250 to 1100C under O2, N2, and H2/He
- Anneals of metal containing samples from 250 to 1100C under N2 and H2/He
- Low stress and stoichiometric silicon nitride
- Amorphous and polycrystalline silicon (doped with P or B or undoped)
- SiO2 from TEOS (conformal, additive SiO2 process)
- SiO2 from oxidation of silicon using H2O or O2
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
10:00 am - 11:30 am
prerequisite: Introduction to Thin Film Growth and Processing
44Register!
 
Training: SEM-10 - Hitachi SU8230 SEM user training - In the cleanroom, next to the SEM
Trainer: Christine Yi-Ju Wang
Previous SEM experience preferred.
For users who are new to SEM, please complete the Harvard SEM on-line training-
There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000007001
Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
10:30 am - 11:30 am
22Register!
 
Training: Transparency Photomask Printer Training - hylin@fas.harvard.edu
Trainer: Hao-Yu (Greg) Lin
Minimum 10 um resolution
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 3:00 pm
44Register!
 
Wednesday, November 28th, 2018
Training: Denton E-beam Evaporator (EE-4) training - LISE G07 (cleanroom); PVD Bay
Trainer: Ed Macomber
Use of the EE-4 for thin film metal deposition is covered by going through a standard deposition. EE-4 is fully automated and can deposit the following materials: Au, Pt, Ag, Ti, Cr, Pd. PLEASE NOTE: these listed materials are the only materials that can be used in EE-4. We use a test sample for a quick deposition, which is all that's required for the training. Plan on ~1 hr for this training. We meet promptly right at the machine in the LISE CR PVD bay.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:00 pm - 3:00 pm
(check links in confirmation email for documents)
51Register!
 
Training: FTIR spectroscopy and microscopy - LISE G04
Trainer: Arthur McClelland
Learn to use the Nicolet iS50 with midIR and farIR spectral ranges and the Bruker Lumos with midIR mapping capabilities.
TimeMax AttendeesAvailableCNS Users ONLY
9:30 am - 11:00 am
33Register!
 
Training: Introduction to Dry Etching - LISE 311
Trainer: Ling Xie
This class teaches basic working principles of dry etching technologies, especially focusing on reactive ion etch (RIE) and ion beam etching (IBE). Dry etching capabilities at CNS Cleanroom will be introduced and etching system selection for your etching project will be discussed.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:00 am
This class is pre-requested for accessing any RIEs and IBE trainings
66Register!
 
Training: Introduction to Lithography - LISE 319
Trainer: Christine Yi-Ju Wang
The class describes the basic working principles of lithography techniques. It also gives an overview of tools that are available in CNS. This is a prerequisite for all lithography process trainings.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
1010Register!
 
Training: MA6 Mask aligner - In the cleanroom, next to the tool
Trainer: Christine Yi-Ju Wang
Prerequisite: "Introduction to Lithography"
The MA6 mask aligner is good for 3-6" substrates, 4-7" photomasks, with bask side alignment capability.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
10:30 am - 11:00 am
33Register!
 
Training: MJB4 mask aligner - In the cleanroom, next to the tool
Trainer: Christine Yi-Ju Wang
Prerequisite: "Introduction to Lithography"
The MJB4 mask aligner is good for up to 4" substrates, 4" and 5" photomasks. Fast troughput with optimum resolution of 2um.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
11:00 am - 11:30 am
33Register!
 
Training: Nikon XTH 225 Micro-CT Training - LISE G27
Trainer: Hao-Yu (Greg) Lin
Non-destructive 3D X-ray imaging technique.
Include software, Avizo and VGStudio MAX for the analysis and visualization of computed tomography (CT) data.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 12:00 pm
hylin@fas.harvard.edu
44Register!
 
Training: RIE-13 - Oxford PlasmaPro 100 Cobra - in front of the tool , inside cleanroom.
Trainer: Kenlin Huang
Dry etching Intro Class is the prerequisite for taking RIE-13 - Oxford PlasmaPro 100 Cobra 300 training
(2:30 - 3:30 pm Wednesday)
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:30 pm - 3:30 pm
kenlinhuang@cns.fas.harvard.edu, 617-495-1738
31Register!
 
Training: RTP-2 Atmospheric Rapid Thermal Processing - Inside cleanroom in PVD Bay
Trainer: John Tsakirgis
To understand the Safety and Operation of the Atmospheric Rapid Thermal tool at CNS
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:00 am
PLease be prompts and bring cleanroom notebook
55Register!
 
Training: Spinner training - In the cleanroom, photolithography bay
Trainer: Christine Yi-Ju Wang
The training covers the use and programming of the spinner. This training is required for all lithography processes (Ebeam, MLA150, uPG501, mask aligners, etc).
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:30 pm - 3:00 pm
44Register!
 
Training: Thermo Scienitifc Nexsa surface analysis training - LISE G27
Trainer: Hao-Yu (Greg) Lin
Capable to do XPS, UPS, ISS and REELS
Pre-requisite: Thermo Scientific K-Alpha+ XPS Training
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 4:00 pm
Pre-requisite: Thermo Scientific K-Alpha+ XPS Training
42Register!
 
Training: UV-VIS-NIR spectroscopy - LISE G04
Trainer: Arthur McClelland
Learn to use the Cary 7000 UV-VIS-NIR system for reflection or transmission measurements from 200-2700 nm with angle and polarization control. Integrating sphere also available.
TimeMax AttendeesAvailableCNS Users ONLY
1:30 pm - 3:30 pm
33Register!
 
Training: Wetbench + Chemical Safety Training - OUTSIDE CLEANROOM ENTRANCE - G-07 LISE
Trainer: Mac Hathaway
Training on wetbench safety, chemical safety, Situational Awareness, and how to not DIE at the wetbenches. MAKE SURE YOUR CLEAN SUIT IS HANGING UP READY TO GO.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 12:30 pm
88Register!
 
Thursday, November 29th, 2018
Training: ALD-2 Arradiance GEMStar ALD and Pulsed CVD Training - G-07 Cleanroom
Trainer: Philippe de Rouffignac
Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This tool utilizes both ALD and pulsed CVD techniques to grow conductive, conformal thin films.
Currently those include Ni, NiNx and WNx. These films are the most conductive ALD films available at the CNS.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:00 am
prerequisite: Introduction to Thin Film Growth and Processing
43Register!
 
Training: Cleanroom orientation - Meet in front of G07
Trainer: John Tsakirgis
To understand our protocols and complete your registration
TimeMax AttendeesAvailableOpen Event!
1:00 pm - 2:30 pm
Please be prompt
1010Register!
 
Training: Horiba XploRa Raman, PL, hyperspectral imaging - LISE G04
Trainer: Arthur McClelland
Learn to use the Horiba Explora system with 405 and 785 nm exciation lines for Raman and PL spectroscopy and mapping. The system also has the Cytoviva hyperspectral module that allows for transmission or refection spectra in bright field or dark field to be collected at every pixel in your field of view.
TimeMax AttendeesAvailableCNS Users ONLY
1:30 pm - 3:30 pm
22Register!
 
Training: Zeiss SEM Part 2 Training (Pre-Requisite Part 1 Online Training) - LISE B20B
Trainer: Tim Cavanaugh
This training covers the Zeiss FESEMs (Ultra55, Supra55VP, and UltraPlus). Topics include a discussion of microscope capabilities, software overview, and training provides a hands-on approach to acquiring high resolution surface images of various materials under different conditions. Users must complete the available "Zeiss SEM Part 1: Online training" prior to registration.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 1:00 pm
44Register!
 
Friday, November 30th, 2018
Training: CVD-4 Lindberg Furnace - Meet in front of G27, Please be prompts and bring notebook
Trainer: John Tsakirgis
To understand the Safety and Operation of our Lindberg Furnace
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 10:00 am
Please be prompt and bring cleanroom notebook
55Register!
 
Training: JAWoollam Spectroscopic Ellipsometer training - LISE-G07, in the main cleanroom
Trainer: Jiangdong Deng
In this advanced spectroscopic ellipsometer training, the basic ellipsometry principle, operation procedure, and basic data analysis skills will be covered. Some advanced thin film measurement strategies will be discussed.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 3:30 pm
44Register!
 

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