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| Training: Zeiss SEM Part 1: Online training - Harvard Training Portal | | Trainer: Tim Cavanaugh | The SEM Part 1 training is available in an online format. You must pass this online training before taking the hands-on SEM training for our field emission Zeiss SEMs (FESEMs) or the EVO SEM. There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000007001
Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
| | | | Training: B15A online safety training - Harvard Training Portal | | Trainer: Jules Gardener | CNS users who wish to use the instruments inside room B15A must complete the B15A safety training before gaining access to this room. The LISE B15A room safety training is available in an online format from https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/FAS-00013222 Please copy this URL into your browser to take the training. We recommend using Chrome, Safari or Internet Explorer.
You must pass this online training before room access can be granted. There is no sign-up required for our online trainings and these can be taken by CNS users at any time.
Please note that our online trainings can only be taken by CNS users who have a Harvard Key. If you are an external user and do not yet have a Harvard Key, please contact info@cns.fas.harvard.edu for information on how to get one. | | | | Training: Sputter coater training (online) - Harvard Training Portal | | Trainer: Jules Gardener | This training is for the HAR-050 EMS dual head and HAR-053 EMS single head sputter coaters located in the CNS Imaging sample preparation room (LISE B15A). These tools are optimized for coating SEM samples with a thin conductive layer. The HAR-050 is equipped with Pt/Pd and Au targets, although Cr is available as an adhesion layer upon request. The HAR-053 is for Pt/Pd deposition only. We cannot accommodate other metal targets in this sputter coater, and this instrument is not suitable for depositing thick films.
Sputter coater training is available in an online format for these tools. You must pass this online training, and have completed the B15A room safety training (also available online), before access to the sputter coaters can be granted. Once you have completed these requirements, you will have access to both sputter coaters. There is no sign-up required for our online trainings and these can be taken by CNS users at any time. You can access the sputter coater training course at https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/FAS-00013226 Please copy this URL into your browser to take the training. We recommend using Chrome, Safari or Internet Explorer.
Please note that our online trainings can only be taken by CNS users who have a Harvard Key. If you are an external user and do not yet have a Harvard Key, please contact info@cns.fas.harvard.edu for information on how to get one.
| | | | Training: TEM Training Part 1: Online training - Harvard Training Portal | | Trainer: Jules Gardener | This is a new online training which is required as the first step of TEM training for the JEOL 2100 and FEI F20 instruments. This training will provide an introduction to TEM concepts and background about our TEMs. You must pass the assessment at the end of this online course before attending an in-person TEM training on the JEOL 2100 or FEI F20 instruments. There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000010142
Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
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| Training: Arctica Basic Cryo-EM training Day1 - B58 control room | | Trainer: Svetla Stoilova-McPhie | | The tranees will get familiar with the Cryo-EM workflow of the Tecnai Artica for screening Cryo-EM grids | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 5:00 pm
| 2 | FULL | Registration Closed | | | | Training: Atomic Layer Deposition (ALD) Training ALD-1 and ALD-4 (Oxides) - Gowning Area - G-07 Cleanroom (Yes, we start in the GOWNING AREA) | | Trainer: Mac Hathaway | | Equipment and Process Engineering Training for ALD-1 and ALD4. PREREQUISITE - You must take the Thin Film Deposition Introductory class before taking ALD, CVD, Evaporator, and/or Sputtering System training. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 3:00 pm
| 5 | 4 | Register! | | | | Training: Cleanroom Orientation - Meet in front of G07 | | Trainer: John Tsakirgis | | To understand our protocols and complete registration. | | Time | Max Attendees | Available | Open Event! |
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1:00 pm - 2:30 pm
Please be prompt | 10 | 9 | Register! | | | | Training: CVD-3 Training: STS PECVD Training Session - Dry processing bay in the cleanroom | | Trainer: Philippe de Rouffignac | Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This training will provide users with the tools necessary to grow high quality SiO2, SiNx, and a:Si films at temperatures from ~200 to 350C. These films can also be doped with B or P.
This tool is equipped with two RF generators, one at 13.56MHz (High frequency, HF recipes) and 380 kHz (low frequency, LF recipes). There are also recipes that take advantage of both RF generators to yield films with lower stress esp. silicon nitride films. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 2:30 pm
prerequisite: Introduction to Thin Film Growth and Processing | 5 | FULL | Registration Closed | | | | Training: Disco Dicing Saw Training Part-1 - LISE G06 | | Trainer: Jason Tresback | | Dicing saw training Part-1 group demo | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 4:00 pm
| 3 | FULL | Registration Closed | | | | Training: Form2 SLA 3D Printer Training - G06 | | Trainer: Sandra Nakasone | Pre-requisite: LISE G06 Room Safety Orientation
Build volume: 5.7” x 5.7” x 6.9” (145 x 145 x 175 mm)
Layer thickness: 25 – 100 microns
Laser spot size: 140 microns
Laser power: 250mW
Material/color: Clear Resin | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 3:30 pm
| 3 | 2 | Register! | | | | Training: Heidelberg MLA150 Maskless Aligner - Meet in the metrology bay | | Trainer: Guixiong Zhong | | Training on the Heidelberg MLA150 Maskless Aligner. This tool can be used to expose positive and negative photoresist without the need for a photomask. The MLA150 has 1 micron or better feature resolution, 0.5 micron alignment accuracy. The prerequisites for this training are the wet bench training, and Introduction to Lithography training. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
| 4 | FULL | Registration Closed | | | | Training: Helix 75W Laser Cutter NEW USERS - G06 | | Trainer: Sandra Nakasone | This training is for new users. No experience necessary.
Requirement: Complete the “Enclosed Laser Instruments Safety” Online training https://www.ehs.harvard.edu/training
Send me the Certificate of Completion via email (snakasone@cns.fas.harvard.edu)
Laser Power: 75W
Working Surface area: 24" x 18" x 8.5" (610 x 457 x 215.9 mm)
Spot size: 0.003" - 0.005" (0.0762 - 0.127 mm)
Wavelength: 10.6 microns
Accuracy: +/- .01" (0.254 mm) over the entire table | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 2:00 pm
| 4 | 2 | Register! | | | | Training: Horiba LabRam Raman and PL - LISE G04 | | Trainer: Arthur McClelland | | Learn to use the Horiba LabRam system with 532 and 633 nm excitation lines for Raman and PL spectroscopy and mapping. Full polarization control and cryostat options available. | | Time | Max Attendees | Available | CNS Users ONLY |
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9:30 am - 11:30 am
| 3 | 2 | Register! | | | | Training: Introduction to Scanning Probe Microscopy - LISE 311 | | Trainer: Antonio Ambrosio | | This is an introduction to Scanning Probe Microscopy (SPM) aimed at providing general concept of AFM microscopy. It is also used as orientation for the potential users to the | | Time | Max Attendees | Available | CNS Users ONLY |
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4:00 pm - 6:00 pm
| 10 | 7 | Register! | | | | Training: Introduction to TEM using the JEOL 2100 - B15C | | Trainer: Adam Graham | In this training you will learn to use the JEOL 2100. This will include start up, Alignment, high resolution imaging and shut down. This training will be mostly hands on and is part 2 of the TEM training. Online training required before attending this event. Access will be granted after successful completion of online training, hands on training and independant certification.
| | Time | Max Attendees | Available | CNS Users ONLY |
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9:00 am - 3:30 pm
Online training required | 4 | 3 | Register! | | | | Training: Introduction to Thin Film Deposition Processes - Training area, outside CNS G-07 Cleanroom | | Trainer: Mac Hathaway | | Introduction to Thin Film Deposition processes and techniques, with an emphasis on process control and overall integration into your process flow. This is a PREREQUISITE for all deposition process training. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:30 am
| 10 | 7 | Register! | | | | Training: LPCVD and APCVD Training (CVD 5,6,7,9,10,11) - Dry Processing Bay in cleanroom | | Trainer: Philippe de Rouffignac | Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This is a general training for all of the LPCVD and APCVD furnaces. These Tystar furnaces can accommodate anything from a single 1cm substrate up to 50 6" wafers.
The various furnaces encompass the following processes:
- Anneals non metal containing samples from 250 to 1100C under O2, N2, and H2/He
- Anneals of metal containing samples from 250 to 1100C under N2 and H2/He
- Low stress and stoichiometric silicon nitride
- Amorphous and polycrystalline silicon (doped with P or B or undoped)
- SiO2 from TEOS (conformal, additive SiO2 process)
- SiO2 from oxidation of silicon using H2O or O2 | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:00 am - 11:30 am
prerequisite: Introduction to Thin Film Growth and Processing | 4 | 2 | Register! | | | | Training: MakerBot 3D Printer Training - G06 | | Trainer: Sandra Nakasone | Pre-requisite: LISE G06 Room Safety Orientation
Build volume: 11.6” x 7.6” x 6.5” (29.5 x 19.5 x 16.5 cm)
Layer thickness: 100 – 300 microns
Material/color: Black PLA filament | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 3:00 pm
| 3 | 3 | Register! | | | | Training: Nikon XTH 225 Micro-CT Training - LISE G27 | | Trainer: Hao-Yu (Greg) Lin | Non-destructive 3D X-ray imaging technique.
Include software, Avizo and VGStudio MAX for the analysis and visualization of computed tomography (CT) data. | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 5:00 pm
hylin@fas.harvard.edu | 4 | 2 | Register! | | | | Training: RIE 10 DRIE Training - Meet in LISE 311 for the first hour then CNS cleanroom | | Trainer: Ling Xie | You have to finish NF-Training "Dry Etching Intro" first and then take this training!
SPTS RIE-10, a state-of-the-art deep silicon etching system, is furnished with dual plasma sources and dual gas inlets. The tool is characterized with high etch rate 6-10 µm/min; high aspect ratio 50:1; good selectivity > 50:1 to resist and >100:1 to silicon oxide; and a good uniformity < 5% cross 6” wafers. Its fixed RF matching technology reduces the step-process time to 1 second, which leads to a controllable side wall roughness < 6nm for nanoscale features. Major features include:
• Primary rf power up to 3,000W
• Secondary rf power up to 3,000W
• Substrate power up to 300W
• Chuck temperatures from -15°C to +40°C
• Handling 6″ or smaller samples
• Claritas End Point Detector
Applications
• Si etch only
• High aspect ratio etch: 5 – 50
• Deep etch: 5µm – through Si wafer etch
• Broad feature sizes: from nano- to mm- scales in lateral dimension
• Side wall roughness (scallop depth): 6nm – 700nm
• Only resists and SiO2 or Si3N4 allowed as etching mask
• Handling 6″ or smaller samples
• Absolutely no-metal mask or metal stop layers
Available Processes
• Micro Pillars
• Nano Pillars
• Micro Trenches
• Nano Trenches
• Via etch
• Through wafer via etch
• Wafer thinning | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 4:00 pm
| 4 | 3 | Register! | | | | Training: RIE 10 DRIE Training - Meet in LISE 311 for the first hour then CNS cleanroom | | Trainer: Ling Xie | You have to finish NF-Training "Dry Etching Intro" first and then take this training!
SPTS RIE-10, a state-of-the-art deep silicon etching system, is furnished with dual plasma sources and dual gas inlets. The tool is characterized with high etch rate 6-10 µm/min; high aspect ratio 50:1; good selectivity > 50:1 to resist and >100:1 to silicon oxide; and a good uniformity < 5% cross 6” wafers. Its fixed RF matching technology reduces the step-process time to 1 second, which leads to a controllable side wall roughness < 6nm for nanoscale features. Major features include:
• Primary rf power up to 3,000W
• Secondary rf power up to 3,000W
• Substrate power up to 300W
• Chuck temperatures from -15°C to +40°C
• Handling 6″ or smaller samples
• Claritas End Point Detector
Applications
• Si etch only
• High aspect ratio etch: 5 – 50
• Deep etch: 5µm – through Si wafer etch
• Broad feature sizes: from nano- to mm- scales in lateral dimension
• Side wall roughness (scallop depth): 6nm – 700nm
• Only resists and SiO2 or Si3N4 allowed as etching mask
• Handling 6″ or smaller samples
• Absolutely no-metal mask or metal stop layers
Available Processes
• Micro Pillars
• Nano Pillars
• Micro Trenches
• Nano Trenches
• Via etch
• Through wafer via etch
• Wafer thinning | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 4:00 pm
| 4 | 4 | Register! | | | | Training: SEM-10 - Hitachi SU8230 SEM user training - In the cleanroom, next to the SEM | | Trainer: Christine Yi-Ju Wang | Previous SEM experience preferred.
For users who are new to SEM, please complete the Harvard SEM on-line training-
There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000007001
Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:30 am - 11:30 am
| 2 | FULL | Registration Closed | | | | Training: Transparency Photomask Printer Training - hylin@fas.harvard.edu | | Trainer: Hao-Yu (Greg) Lin | | Minimum 10 um resolution | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: Zeiss SEM Part 2 Training (Pre-Requisite Part 1 Online Training) - LISE B20B | | Trainer: Tim Cavanaugh | | This training covers the Zeiss FESEMs (Ultra55, Supra55VP, and UltraPlus). Topics include a discussion of microscope capabilities, software overview, and training provides a hands-on approach to acquiring high resolution surface images of various materials under different conditions. Users must complete the available “Zeiss SEM Part 1: Online training” prior to registration. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 4:00 pm
| 4 | FULL | Registration Closed | | |
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| Training: Arctica Basic Cryo-EM training Day2 - B58 control room | | Trainer: Svetla Stoilova-McPhie | | This training has to be taken the day after Day1. The trainees will practice in their own area with a standard specimen. The certification will be the acquiring of a correct image at the conditions required for Cryo-EM grids' screening. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 5:00 pm
| 2 | FULL | Registration Closed | | | | Training: AS200 i-line stepper training - Meet at the photolithography bay inside the clean room | | Trainer: Guixiong Zhong | | Training for the stepper. System overview, job making, editing, reticle loading, wafer loading, and unloading will be covered in the training. Please see the tool webpage for more information on the capabilities of this tool. The prerequisite for this training is the Introduction to Lithography training. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 3:00 pm
| 4 | 3 | Register! | | | | Training: Cypher AFM General Training (attending the class - G12 | | Trainer: Antonio Ambrosio | | This is the training event where the Cypher AFM is presented. The two hours class "Introduction to Scanning Probe Microscopy" is mandatory before attending this training event. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 3:00 pm
| 4 | 1 | Register! | | | | Training: Denton E-beam Evaporator (EE-4) training - LISE G07 (cleanroom); PVD Bay | | Trainer: Ed Macomber | | Use of the EE-4 for thin film metal deposition is covered by going through a standard deposition. EE-4 is fully automated and can deposit the following materials: Au, Pt, Ag, Ti, Cr, Pd. PLEASE NOTE: these listed materials are the only materials that can be used in EE-4. We use a test sample for a quick deposition, which is all that's required for the training. Plan on ~1 hr for this training. We meet promptly right at the machine in the LISE CR PVD bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
(check links in confirmation email for documents) | 5 | FULL | Registration Closed | | | | Training: FTIR spectroscopy and microscopy - LISE G04 | | Trainer: Arthur McClelland | | Learn to use the Nicolet iS50 with midIR and farIR spectral ranges and the Bruker Lumos with midIR mapping capabilities. | | Time | Max Attendees | Available | CNS Users ONLY |
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9:30 am - 11:00 am
| 3 | FULL | Registration Closed | | | | Training: Introduction to Dry Etching - LISE 311 | | Trainer: Ling Xie | | This class teaches basic working principles of dry etching technologies, especially focusing on reactive ion etch (RIE) and ion beam etching (IBE). Dry etching capabilities at CNS Cleanroom will be introduced and etching system selection for your etching project will be discussed. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:00 am
This class is pre-requested for accessing any RIEs and IBE trainings | 6 | 1 | Register! | | | | Training: Introduction to Lithography - LISE 319 | | Trainer: Christine Yi-Ju Wang | | The class describes the basic working principles of lithography techniques. It also gives an overview of tools that are available in CNS. This is a prerequisite for all lithography process trainings. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 2:00 pm
| 10 | 6 | Register! | | | | Training: MA6 Mask aligner - In the cleanroom, next to the tool | | Trainer: Christine Yi-Ju Wang | Prerequisite: "Introduction to Lithography"
The MA6 mask aligner is good for 3-6" substrates, 4-7" photomasks, with bask side alignment capability. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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11:30 am - 12:00 pm
| 3 | FULL | Registration Closed | | | | Training: Metrology for Nanofabrication Part-1 (Stylus Profilometry, Ellipsometry, and Electrical Property Measurements) - LISE G07 | | Trainer: Jason Tresback | | Please register and attend the Introduction to Metrology for Nanofabrication Lecture before attending Metrology for Nanofabrication part-1 or 2. Metrology for Nanofabrication part-1 is NOT required to attend part-2. This metrology part-1 training event will focus on fundamental measurement tools for nanofabrication including, contact/stylus surface Profilometer (DekTak XT and 6m) (PL-5/8), single wavelength scanning Ellipsometer (Gaertner-LSE) (ES-2), scanning sheet resistance mapping (CDE-ResMap 4-Pt Probe system) (MET-2), and Semiconductor Parameter Analyzer w/ Signatone 4-Pt Probe Station (Agilent 4156C & Signatone 4pt Probe Station)(PB-1 & CE-1/2). Full independent access to these tools listed above can be achieved, however the amount of time spent on each tool will vary based on participants. We meet inside the Cleanroom gowning area or within the Metrology Bay inside the CNS cleanroom (G07). | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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11:00 am - 12:30 pm
| 3 | 2 | Register! | | | | Training: MJB4 mask aligner - In the cleanroom, next to the tool | | Trainer: Christine Yi-Ju Wang | Prerequisite: "Introduction to Lithography"
The MJB4 mask aligner is good for up to 4" substrates, 4" and 5" photomasks. Fast troughput with optimum resolution of 2um. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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11:00 am - 11:30 am
| 3 | 3 | Register! | | | | Training: RIE-11 Diamond RIE Training - LISE G07 CNS Cleanroom | | Trainer: Ling Xie | You have to finish NF-Training "Dry Etching Intro" first and then take this training!
PT RIE-11 is Plasma-Therm’s Versaline Inductive Coupled Plasma (ICP) etching system, a product resulting from decades of technology evolution. Its 2 MHz ICP RF for efficient coupling of power to plasma makes etching results stable and repeatable. Well designed thermal management components control chamber temperatures at desired values from beginning to the end during processes. Major features include:
• ICP RF up to 1,200 W
• RF bias up to 600 W
• Substrate temperatures from 10 °C to 180 °C
• Lid, ceramic spool, and metal liner temperatures from 20 °C to 180 °C
Applications
Diamond etch only
Available Processes
• Thorough O2 plasma chamber cleaning processes for NV center applications
• Nano-feature etch
• Diamond thinning
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: RTP-2 Atmospheric Rapid Thermal Processing - Inside cleanroom in PVD Bay | | Trainer: John Tsakirgis | | To understand the Safety and Operation of the Atmospheric Rapid Thermal tool at CNS | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:00 am
PLease be prompts and bring cleanroom notebook | 5 | 4 | Register! | | | | Training: TE-3 - Sharon Thermal Evaporator TE-3 - LISE G07 (CNS Cleanroom), PVD Bay | | Trainer: Malcolm Tse | | Training on TE-3, 4 and 5 for thermal evaporation of metals is covered. We meet at the system i n the CNS cleanroom PVD bay. Training takes about 2 hours. Venting, loading a sample, pumping and evaporation are performed and explained. For these TE systems, users supply their own deposition materials and boats (sources). CNS supplies the materials for training. After this training you will have access to all 3 systems, which are collectively capable of depositing: Ti, Cr, Cu, Ag, Au, Al, etc. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 12:00 pm
| 4 | FULL | Registration Closed | | | | Training: Thermo Scienitifc Nexsa surface analysis training - LISE G27 | | Trainer: Hao-Yu (Greg) Lin | Capable to do XPS, UPS, ISS and REELS
Pre-requisite: Thermo Scientific K-Alpha+ XPS Training | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 4:00 pm
Pre-requisite: Thermo Scientific K-Alpha+ XPS Training | 4 | 1 | Register! | | | | Training: Wetbench + Chemical Safety Training - OUTSIDE CLEANROOM ENTRANCE - G-07 LISE | | Trainer: Mac Hathaway | | Training on wetbench safety, chemical safety, Situational Awareness, and how to not DIE at the wetbenches. MAKE SURE YOUR CLEAN SUIT IS HANGING UP READY TO GO. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 12:30 pm
| 8 | 4 | Register! | | |
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| Training: ALD-2 Arradiance GEMStar ALD and Pulsed CVD Training - G-07 Cleanroom | | Trainer: Philippe de Rouffignac | Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This tool utilizes both ALD and pulsed CVD techniques to grow conductive, conformal thin films.
Currently those include Ni, NiNx and WNx. These films are the most conductive ALD films available at the CNS. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:00 am
prerequisite: Introduction to Thin Film Growth and Processing | 4 | 4 | Register! | | | | Training: Autogrids Assembly - GO5 | | Trainer: Svetla Stoilova-McPhie | | Trainees will be demonstrated autogrids assembly in G05 at room temperature and in LN2. Trainees will practice at room temperature and will book for LN2 temperature assembly for their own samples. | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 3:30 pm
| 2 | FULL | Registration Closed | | | | Training: Cleanroom orientation - Meet in front of G07 | | Trainer: John Tsakirgis | | To understand our protocols and complete your registration | | Time | Max Attendees | Available | Open Event! |
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1:00 pm - 2:30 pm
Please be prompt | 10 | 10 | Register! | | | | Training: Cypher AFM certification (attending the class - G12 | | Trainer: Antonio Ambrosio | | This is a certification event for the Asylum Cypher AFM. Attending Part -1 "Asylum Cypher AFM - General Training" is mandatory for this training event. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 3:00 pm
| 2 | FULL | Registration Closed | | | | Training: DelsaNano DLS System Training - G05 | | Trainer: Sandra Nakasone | Pre-requisite: LISE G05 Room Safety Orientation
Model: DelsaNano C
Make: Beckman Coulter
Sample volume: 1mL (for size) and 2.5mL (for zeta potential)
| | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 2:00 pm
| 3 | 3 | Register! | | | | Training: Discussion for nanofabrication related questions. - LISE G52 | | Trainer: Ling Xie | | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 3:30 pm
| 1 | 1 | Register! | | | | Training: Plate Reader Training - G05 | | Trainer: Sandra Nakasone | Pre-requisite: LISE G05 Room Safety Orientation
Model: Synergy H1m
Make: BioTek
| | Time | Max Attendees | Available | CNS Users ONLY |
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11:00 am - 12:00 pm
| 3 | 3 | Register! | | | | Training: Soft Materials Cleanroom (SMCR) Orientation - We meet in the ground floor couches (outside G07) | | Trainer: Sandra Nakasone | | This combined safety orientation and tool training is the complete training required for access to the Soft Materials CleanRoom (SMCR) located in LISE G07A. The SMCR is a cleanroom devoted to Soft Lithography with a focus on rapid prototyping of microfluidic devices using PDMS elastomer. During the training you will be given more information about the completion of the online quiz that will allow you to get full access to the SMCR. | | Time | Max Attendees | Available | CNS Users ONLY |
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2:30 pm - 4:30 pm
| 6 | 3 | Register! | | | | Training: Spinner training - In the cleanroom, photolithography bay | | Trainer: Christine Yi-Ju Wang | | The training covers the use and programming of the spinner. This training is required for all lithography processes (Ebeam, MLA150, uPG501, mask aligners, etc). | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 2:00 pm
| 4 | 3 | Register! | | | | Training: UV-VIS-NIR spectroscopy - LISE G04 | | Trainer: Arthur McClelland | | Learn to use the Cary 7000 UV-VIS-NIR system for reflection or transmission measurements from 200-2700 nm with angle and polarization control. Integrating sphere also available. | | Time | Max Attendees | Available | CNS Users ONLY |
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9:30 am - 11:30 am
| 3 | 3 | Register! | | |
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| Training: CVD-4 Lindberg Furnace - Meet in front of G27, Please be prompts and bring notebook | | Trainer: John Tsakirgis | | To understand the Safety and Operation of our Lindberg Furnace | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 10:00 am
Please be prompt and bring cleanroom notebook | 5 | 5 | Register! | | | | Training: Denton E-beam Evaporator (EE-4) training - LISE G07 (cleanroom); PVD Bay | | Trainer: Ed Macomber | | Use of the EE-4 for thin film metal deposition is covered by going through a standard deposition. EE-4 is fully automated and can deposit the following materials: Au, Pt, Ag, Ti, Cr, Pd. PLEASE NOTE: these listed materials are the only materials that can be used in EE-4. We use a test sample for a quick deposition, which is all that's required for the training. Plan on ~1 hr for this training. We meet promptly right at the machine in the LISE CR PVD bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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11:30 am - 12:30 pm
(check links in confirmation email for documents) | 5 | FULL | Registration Closed | | | | Training: JAWoollam Spectroscopic Ellipsometer training - LISE-G07, in the main cleanroom | | Trainer: Jiangdong Deng | | In this advanced spectroscopic ellipsometer training, the basic ellipsometry principle, operation procedure, and basic data analysis skills will be covered. Some advanced thin film measurement strategies will be discussed. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 3:30 pm
| 4 | 2 | Register! | | |
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| Training: FIB Helios - Basics - LISE B15 F | | Trainer: Stephan Kraemer | | Users will be introduced to the basic handling of the instrument and its capabilities. A brief introduction into the underlying interaction of the ion beam with the material is given. At the end of the session users will be able to run a basic cross section analysis. Specific topics are: bringing sample to eucentric height, electron and ion beam alignment, deposition of protection layers, preparation and cleaning of cross sections, recording of high-resolution SEM images. These form the basis for more advanced tasks such as TEM sample preparation or serial section 3D analysis. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 5:00 pm
Prior SEM experience recommended. | 4 | 3 | Register! | | | | Training: LISE G05 Biomaterials Room Safety Orientation - Outside G05 | | Trainer: Sandra Nakasone | This safety orientation is mandatory for access to our biomaterials and cell culture BL2 laboratory (LISE G05). In order to gain access users must complete this safety orientation and at least one training for equipment inside G05. Long pants and closed toe shoes required!
This training will provide the safety information, room orientation and basic guidelines for working in the Biological Materials Facility. This space houses our cell culture biohoods, incubators, plate reader, DLS system, Ultramicrotome, and fluorescence microscope. | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 2:30 pm
| 6 | 5 | Register! | | | | Training: LISE G06 Chemical Nanotechnology Room Orientation - Outside G06 | | Trainer: Sandra Nakasone | This safety orientation is mandatory for access to our chemical nanotechnology room (LISE G06). In order to gain access users must complete this safety orientation and at least one training for equipment inside G06. Long pants and closed toe shoes required!
This space houses Helix laser cutter, 3D printers, nanotechnology tools (sonicator, ball mill, weighing balances), Chemical process tools (acid & solvent benches), Disco wafer dicing saw, Stylus profiler and lithography tools (PDMS, mixer, spincoater, degassing chamber, oven). | | Time | Max Attendees | Available | CNS Users ONLY |
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2:30 pm - 3:00 pm
| 6 | 4 | Register! | | | | Training: Plasma O2 stripper : RIE 09 and RIE 05 - In front of the tool , inside cleanroom. | | Trainer: Kenlin Huang | | Dry etching Intro Class is the prerequisite for taking training class of Plasma O2 stripper : RIE 09 and RIE 05 at 03:30 pm | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:30 pm - 4:00 pm
kenlnhuang@cns.fas.harvard.edu,617-495-1738 | 4 | 3 | Register! | | | | Training: SP-3 AJA 3-gun sputtering system training - CNS cleanroom (G-07) Dry Bay | | Trainer: Christine Yi-Ju Wang | Prerequisite: "Introduction to Thin Film deposition processes"
The system has one RF source and two DC sources (DC power supply is switchable between the two sources). SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with 1 RF and 1 DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their own schedule. After 3 uses (with no problems) users are given 24/7 access. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 2:30 pm
| 2 | 2 | Register! | | | | Training: Zeiss SEM Part 2 Training (Pre-Requisite Part 1 Online Training) - LISE B20B | | Trainer: Tim Cavanaugh | | This training covers the Zeiss FESEMs (Ultra55, Supra55VP, and UltraPlus). Topics include a discussion of microscope capabilities, software overview, and training provides a hands-on approach to acquiring high resolution surface images of various materials under different conditions. Users must complete the available "Zeiss SEM Part 1: Online training" prior to registration. | | Time | Max Attendees | Available | CNS Users ONLY |
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12:00 pm - 3:00 pm
| 4 | FULL | Registration Closed | | |
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| Training: Introduction to Metrology for Nanofabrication Lecture - LISE G07 Hallway | | Trainer: Jason Tresback | | This lecture is an informal discussion about the measurement tools and techniques available inside the nanofabrication cleanroom G07. The introduction serves as a pre-requisite for metrology for nanofabrication part 1 & 2 training events, however, metrology part-1 is not required to attend part-2. Please email jtresback@cns.fas.harvard.edu if you have any questions | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 4:00 pm
| 6 | 6 | Register! | | | | Training: Cleanroom Orientation - Meet in front of G07 | | Trainer: John Tsakirgis | | To understand our protocols and complete registration. | | Time | Max Attendees | Available | Open Event! |
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1:00 pm - 2:30 pm
Please be prompt | 10 | 9 | Register! | | | | Training: DOE01-ULVAC Deep Oxide Etcher Training - in front of the tool ,inside the G7 cleanroom | | Trainer: Kenlin Huang | Dry etching Intro Class is the prerequisite for taking DOE01-ULVAC Deep Oxide Etcher Training
10:30 t0 11:30 am Tuesday | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:30 am - 11:30 am
kenlinhuang@cns.fas.harvard.edu, 617-495-1738 | 4 | 3 | Register! | | | | Training: Form2 SLA 3D Printer Training - G06 | | Trainer: Sandra Nakasone | Pre-requisite: LISE G06 Room Safety Orientation
Build volume: 5.7” x 5.7” x 6.9” (145 x 145 x 175 mm)
Layer thickness: 25 – 100 microns
Laser spot size: 140 microns
Laser power: 250mW
Material/color: Clear Resin | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 3:30 pm
| 3 | 3 | Register! | | | | Training: Helix 75W Laser Cutter NEW USERS - G06 | | Trainer: Sandra Nakasone | This training is for new users. No experience necessary.
Requirement: Complete the “Enclosed Laser Instruments Safety” Online training https://www.ehs.harvard.edu/training
Send me the Certificate of Completion via email (snakasone@cns.fas.harvard.edu)
Laser Power: 75W
Working Surface area: 24" x 18" x 8.5" (610 x 457 x 215.9 mm)
Spot size: 0.003" - 0.005" (0.0762 - 0.127 mm)
Wavelength: 10.6 microns
Accuracy: +/- .01" (0.254 mm) over the entire table | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: Horiba LabRam Raman and PL - LISE G04 | | Trainer: Arthur McClelland | | Learn to use the Horiba LabRam system with 532 and 633 nm excitation lines for Raman and PL spectroscopy and mapping. Full polarization control and cryostat options available. | | Time | Max Attendees | Available | CNS Users ONLY |
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9:30 am - 11:30 am
| 3 | 3 | Register! | | | | Training: Intermediate Arctica Cryo-EM training - B58 control room | | Trainer: Svetla Stoilova-McPhie | | This training is the conclusion of the Basic Arctica Cryo-EM training and should be taken the week after Day1 and Day2. Trainee should split: one the morning starting 10am and one the afternoon starting 2 pm. Certification for the Intermediate training will give access to the control room - B58 and the scheduling system. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 5:00 pm
| 2 | FULL | Registration Closed | | | | Training: Introduction to Thin Film Deposition Processes - Training area, outside CNS G-07 Cleanroom | | Trainer: Mac Hathaway | | Introduction to Thin Film Deposition processes and techniques, with an emphasis on process control and overall integration into your process flow. This is a PREREQUISITE for all deposition process training. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:30 am
| 10 | 9 | Register! | | | | Training: MakerBot 3D Printer Training - G06 | | Trainer: Sandra Nakasone | Pre-requisite: LISE G06 Room Safety Orientation
Build volume: 11.6” x 7.6” x 6.5” (29.5 x 19.5 x 16.5 cm)
Layer thickness: 100 – 300 microns
Material/color: Black PLA filament | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 3:00 pm
| 3 | 3 | Register! | | | | Training: RIE-7 - Unaxis Shuttleline ICP RIE - in front of the tool inside clearoom. | | Trainer: Kenlin Huang | RIE-7 - Unaxis Shuttleline ICP RIE training
3:30 - 4:30 pm | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:30 pm - 4:30 pm
kenlinuang@cns.fas.harvard.edu | 4 | 3 | Register! | | | | Training: SEM-10 - Hitachi SU8230 SEM user training - In the cleanroom, next to the SEM | | Trainer: Christine Yi-Ju Wang | Previous SEM experience preferred.
For users who are new to SEM, please complete the Harvard SEM on-line training-
There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000007001
Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:30 am - 11:30 am
| 2 | 1 | Register! | | | | Training: Sharon TE-3, 4, and 5 thermal evaporator training - LISE G07 (CNS Cleanroom), PVD Bay | | Trainer: Malcolm Tse | | Training on TE-3, 4 and 5 for thermal evaporation of metals is covered. We meet at the system in the CNS cleanroom PVD bay. Training takes about 2 hours. Venting, loading a sample, pumping and evaporation are performed and explained. For these TE systems, users supply their own deposition materials and boats (sources). CNS supplies the materials for training. After this training you will have access to all 3 systems, which are collectively capable of depositing: Ti, Cr, Cu, Ag, Au, Al, etc. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:30 am
| 4 | 4 | Register! | | | | Training: SPECTRO XEPOS XRF Training - LISE G27 | | Trainer: Hao-Yu (Greg) Lin | | Energy dispersive X-ray fluorescence (ED-XRF) spectrometer for elemental analysis of liquid, solid, powder and thin film samples. | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 3:30 pm
hylin@fas.harvard.edu | 4 | 4 | Register! | | | | Training: STS RIE-8 - LISE CNS Cleanroom | | Trainer: Ling Xie | You have to finish NF-Training "Dry Etching Intro" first and then take this training!
STS RIE - 8 is an Inductively Coupled Plasma etching system and characterized with high plasma density, low operating pressure, high etch rate, excellent etch uniformity, and low energy ion damage. Major features include:
• ICP power up to 1,500 W
• RF bias up to 300 W
• Available gases: SF6, C4F8, CHF3, CF4, H2, Cl2, HBr, BCl3, Ar, O2, and N2
• Substrate temperatures from 10 °C to 30 °C
• Handling 6″ or smaller samples
Applications
Etching silicon-based materials, boron nitride, and other compatible 2-D materials
Available Processes
• High aspect ratio Si pillars
• Si nano-wires and nano-needles
• Si micro holes
• Si trenches
• SiO2 and Si3N4 trenches
• Graphene and boron nitride etch
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 3:00 pm
| 4 | 1 | Register! | | |
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| Training: Contact Angle Measuring Tool Training - G06 | | Trainer: Sandra Nakasone | | Pre-requisite: LISE G06 Room Safety Orientation | | Time | Max Attendees | Available | CNS Users ONLY |
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11:00 am - 11:30 am
| 3 | 3 | Register! | | | | Training: Cypher AFM General Training (attending the class - G12 | | Trainer: Antonio Ambrosio | | This is the training event where the Cypher AFM is presented. The two hours class "Introduction to Scanning Probe Microscopy" is mandatory before attending this training event. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: Introduction to Lithography - LISE 319 | | Trainer: Christine Yi-Ju Wang | | The class describes the basic working principles of lithography techniques. It also gives an overview of tools that are available in CNS. This is a prerequisite for all lithography process trainings. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 2:00 pm
| 10 | 10 | Register! | | | | Training: KLA-Tencor P-16 Profiler Training - LISE G06 | | Trainer: Hao-Yu (Greg) Lin | Surface metrology analysis technique.
Capable of step height analysis, surface contour, waviness and roughness measurements with detailed 2D or 3D analysis of topography for a variety of surfaces and materials. | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 3:00 pm
hylin@fas.harvard.edu | 4 | 4 | Register! | | | | Training: Lyophilizer/Freeze Dryer Training - G06 | | Trainer: Sandra Nakasone | | Pre-requisite: LISE G06 Room Safety Orientation | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 1:30 pm
| 3 | 3 | Register! | | | | Training: MA6 Mask aligner - In the cleanroom, next to the tool | | Trainer: Christine Yi-Ju Wang | Prerequisite: "Introduction to Lithography"
The MA6 mask aligner is good for 3-6" substrates, 4-7" photomasks, with bask side alignment capability. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:30 am - 11:00 am
| 3 | 3 | Register! | | | | Training: Metrology for Nanofabrication Part-1 (Stylus Profilometry, Ellipsometry, and Electrical Property Measurements) - LISE G07 | | Trainer: Jason Tresback | | Please register and attend the Introduction to Metrology for Nanofabrication Lecture before attending Metrology for Nanofabrication part-1 or 2. Metrology for Nanofabrication part-1 is NOT required to attend part-2. This metrology part-1 training event will focus on fundamental measurement tools for nanofabrication including, contact/stylus surface Profilometer (DekTak XT and 6m) (PL-5/8), single wavelength scanning Ellipsometer (Gaertner-LSE) (ES-2), scanning sheet resistance mapping (CDE-ResMap 4-Pt Probe system) (MET-2), and Semiconductor Parameter Analyzer w/ Signatone 4-Pt Probe Station (Agilent 4156C & Signatone 4pt Probe Station)(PB-1 & CE-1/2). Full independent access to these tools listed above can be achieved, however the amount of time spent on each tool will vary based on participants. We meet inside the Cleanroom gowning area or within the Metrology Bay inside the CNS cleanroom (G07). | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:30 am - 12:30 pm
| 3 | 1 | Register! | | | | Training: Metrology for Nanofabrication-Part 2 (Optical Profilometry and Veeco AFM) - LISE G07 Nanofabrication Cleanroom | | Trainer: Jason Tresback | | Please register and attend the Introduction to Metrology for Nanofabrication Lecture before attending Metrology for Nanofabrication part-1 or 2. Metrology for Nanofabrication part-1 is NOT required to attend part-2. This training event covers some advanced metrology techniques, such as the Optical Profiler (CCI HD) (PL-6) and the Atomic Force Microscope (Veeco NanoMan AFM) (SPM-5). Training on each tool may take up to 1 hour and after signing up for the training, users should also send an email to the CNS staff (jtresback@cns.fas.harvard.edu) to identify the tool they would like to learn and a brief description of the sample and measurement goal. Full independent access to the AFM (SPM-5) requires at least one individual user assisted session that serves as a qualification for independent use and scheduled on another day. AFM probes are provided for training; however users must supply their own probes during independent use. We meet inside the cleanroom gowning area or within the Metrology Bay inside the CNS cleanroom. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:30 pm - 4:30 pm
| 3 | 1 | Register! | | | | Training: MJB4 mask aligner - In the cleanroom, next to the tool | | Trainer: Christine Yi-Ju Wang | Prerequisite: "Introduction to Lithography"
The MJB4 mask aligner is good for up to 4" substrates, 4" and 5" photomasks. Fast troughput with optimum resolution of 2um. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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11:00 am - 11:30 am
| 3 | 3 | Register! | | | | Training: Planetary Ball Mill Training - G06 | | Trainer: Sandra Nakasone | Pre-requisite: LISE G06 Room Safety Orientation
| | Time | Max Attendees | Available | CNS Users ONLY |
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1:30 pm - 2:00 pm
| 3 | 3 | Register! | | | | Training: Sharon EE-3 e-beam evaporator training - We meet in the cleanroom PVD bay (last bay inside of LISE G07) | | Trainer: Ed Macomber | | E-beam evaporation in EE-3 is covered; EE-3 can deposit 19 different materials (metals). All materials are user supplied for EE-3 (pellets and crucible liners). We will cover venting, loading the sample, pumping down (vacuum system) and the actual deposition. Plan on ~2 hr for this training. This is a manually operated deposition system and will likely take most users a few times using it to become comfortable with the machine. We meet in the cleanroom PVD bay (last bay inside LISE G07). | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 2:00 pm
(Please review document links in email confirmation) | 5 | FULL | Registration Closed | | | | Training: Spinner training - In the cleanroom, photolithography bay | | Trainer: Christine Yi-Ju Wang | | The training covers the use and programming of the spinner. This training is required for all lithography processes (Ebeam, MLA150, uPG501, mask aligners, etc). | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:30 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: Thermo Scientific K-Alpha+ XPS Training - LISE G27 | | Trainer: Hao-Yu (Greg) Lin | | Surface analysis technique. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 12:00 pm
hylin@fas.harvard.edu | 4 | FULL | Registration Closed | | | | Training: Wetbench + Chemical Safety Training - OUTSIDE CLEANROOM ENTRANCE - G-07 LISE | | Trainer: Mac Hathaway | | Training on wetbench safety, chemical safety, Situational Awareness, and how to not DIE at the wetbenches. MAKE SURE YOUR CLEAN SUIT IS HANGING UP READY TO GO. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 12:30 pm
| 8 | 7 | Register! | | |
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| Training: ALD3 - PDR Thermal ALD System Training - Cleanroom PVD Bay | | Trainer: Philippe de Rouffignac | Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This ALD system utilizes a smaller chamber and faster heating and cooling to achieve quicker ALD process times. It is also equipped with an ozone generator that enables the growth of high quality, conformal SiO2 films as well as low temperature Pt metal films. Other films available include Al2O3, TiO2, and HfO2. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:00 am
prerequisite: Introduction to Thin Film Growth and Processing | 4 | 4 | Register! | | | | Training: Cleanroom orientation - Meet in front of G07 | | Trainer: John Tsakirgis | | To understand our protocols and complete your registration | | Time | Max Attendees | Available | Open Event! |
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1:00 pm - 2:30 pm
Please be prompt | 10 | 10 | Register! | | | | Training: Cypher AFM certification (attending the class - G12 | | Trainer: Antonio Ambrosio | | This is a certification event for the Asylum Cypher AFM. Attending Part -1 "Asylum Cypher AFM - General Training" is mandatory for this training event. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 3:00 pm
| 2 | 2 | Register! | | | | Training: Horiba XploRa Raman, PL, hyperspectral imaging - LISE G04 | | Trainer: Arthur McClelland | | Learn to use the Horiba Explora system with 405 and 785 nm exciation lines for Raman and PL spectroscopy and mapping. The system also has the Cytoviva hyperspectral module that allows for transmission or refection spectra in bright field or dark field to be collected at every pixel in your field of view. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:30 pm - 3:30 pm
| 2 | 2 | Register! | | |
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| Training: Plasma O2 stripper : RIE 09 and RIE 05 - In front of the tool , inside cleanroom. | | Trainer: Kenlin Huang | | Dry etching Intro Class is the prerequisite for taking training class of Plasma O2 stripper : RIE 09 and RIE 05 at 03:30 pm | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:30 pm - 4:00 pm
kenlnhuang@cns.fas.harvard.edu,617-495-1738 | 4 | 4 | Register! | | | | Training: RCA Cleaning station - Inside cleanroom | | Trainer: John Tsakirgis | | To understand the RCA Cleaning station here at CNS. The Operation and Safety of the Bench | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:00 am - 11:00 am
Please be prompt and bring cleanroom notebook | 5 | 5 | Register! | | | | Training: SP-3 AJA 3-gun sputtering system training - CNS cleanroom (G-07) Dry Bay | | Trainer: Christine Yi-Ju Wang | Prerequisite: "Introduction to Thin Film deposition processes"
The system has one RF source and two DC sources (DC power supply is switchable between the two sources). SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with 1 RF and 1 DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their own schedule. After 3 uses (with no problems) users are given 24/7 access. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 2:30 pm
| 2 | 1 | Register! | | |
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| Training: Atomic Layer Deposition (ALD) Training ALD-1 and ALD-4 (Oxides) - Gowning Area - G-07 Cleanroom (Yes, we start in the GOWNING AREA) | | Trainer: Mac Hathaway | | Equipment and Process Engineering Training for ALD-1 and ALD4. PREREQUISITE - You must take the Thin Film Deposition Introductory class before taking ALD, CVD, Evaporator, and/or Sputtering System training. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 3:00 pm
| 5 | 5 | Register! | | | | Training: Cleanroom Orientation - Meet in front of G07 | | Trainer: John Tsakirgis | | To understand our protocols and complete registration. | | Time | Max Attendees | Available | Open Event! |
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1:00 pm - 2:30 pm
Please be prompt | 10 | 10 | Register! | | | | Training: CVD-3 Training: STS PECVD Training Session - Dry processing bay in the cleanroom | | Trainer: Philippe de Rouffignac | Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This training will provide users with the tools necessary to grow high quality SiO2, SiNx, and a:Si films at temperatures from ~200 to 350C. These films can also be doped with B or P.
This tool is equipped with two RF generators, one at 13.56MHz (High frequency, HF recipes) and 380 kHz (low frequency, LF recipes). There are also recipes that take advantage of both RF generators to yield films with lower stress esp. silicon nitride films. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 2:30 pm
prerequisite: Introduction to Thin Film Growth and Processing | 5 | 4 | Register! | | | | Training: Heidelberg MLA150 Maskless Aligner - Meet in the metrology bay | | Trainer: Guixiong Zhong | | Training on the Heidelberg MLA150 Maskless Aligner. This tool can be used to expose positive and negative photoresist without the need for a photomask. The MLA150 has 1 micron or better feature resolution, 0.5 micron alignment accuracy. The prerequisites for this training are the wet bench training, and Introduction to Lithography training. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
| 4 | FULL | Registration Closed | | | | Training: Heidelberg uPG501 training - Meet in the metrology bay | | Trainer: Guixiong Zhong | | Training on the Heidelberg uPG501 direct-write lithography system. This tool can be used to expose positive and negative photoresist without the need for a photomask; it can also be used to write photomasks. uPG501 has 2 microns or better feature resolution, 1 micron alignment accuracy. The prerequisites for this training are the Introduction to Lithography class, wet bench training, and spinner/developing training. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:00 pm - 4:00 pm
| 4 | 3 | Register! | | | | Training: Horiba LabRam Raman and PL - LISE G04 | | Trainer: Arthur McClelland | | Learn to use the Horiba LabRam system with 532 and 633 nm excitation lines for Raman and PL spectroscopy and mapping. Full polarization control and cryostat options available. | | Time | Max Attendees | Available | CNS Users ONLY |
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9:30 am - 11:30 am
| 3 | 3 | Register! | | | | Training: Introduction to Thin Film Deposition Processes - Training area, outside CNS G-07 Cleanroom | | Trainer: Mac Hathaway | | Introduction to Thin Film Deposition processes and techniques, with an emphasis on process control and overall integration into your process flow. This is a PREREQUISITE for all deposition process training. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:30 am
| 10 | 10 | Register! | | | | Training: LPCVD and APCVD Training (CVD 5,6,7,9,10,11) - Dry Processing Bay in cleanroom | | Trainer: Philippe de Rouffignac | Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This is a general training for all of the LPCVD and APCVD furnaces. These Tystar furnaces can accommodate anything from a single 1cm substrate up to 50 6" wafers.
The various furnaces encompass the following processes:
- Anneals non metal containing samples from 250 to 1100C under O2, N2, and H2/He
- Anneals of metal containing samples from 250 to 1100C under N2 and H2/He
- Low stress and stoichiometric silicon nitride
- Amorphous and polycrystalline silicon (doped with P or B or undoped)
- SiO2 from TEOS (conformal, additive SiO2 process)
- SiO2 from oxidation of silicon using H2O or O2 | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:00 am - 11:30 am
prerequisite: Introduction to Thin Film Growth and Processing | 4 | 4 | Register! | | | | Training: SEM-10 - Hitachi SU8230 SEM user training - In the cleanroom, next to the SEM | | Trainer: Christine Yi-Ju Wang | Previous SEM experience preferred.
For users who are new to SEM, please complete the Harvard SEM on-line training-
There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000007001
Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:30 am - 11:30 am
| 2 | 2 | Register! | | | | Training: Transparency Photomask Printer Training - hylin@fas.harvard.edu | | Trainer: Hao-Yu (Greg) Lin | | Minimum 10 um resolution | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 3:00 pm
| 4 | 4 | Register! | | |
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| Training: Denton E-beam Evaporator (EE-4) training - LISE G07 (cleanroom); PVD Bay | | Trainer: Ed Macomber | | Use of the EE-4 for thin film metal deposition is covered by going through a standard deposition. EE-4 is fully automated and can deposit the following materials: Au, Pt, Ag, Ti, Cr, Pd. PLEASE NOTE: these listed materials are the only materials that can be used in EE-4. We use a test sample for a quick deposition, which is all that's required for the training. Plan on ~1 hr for this training. We meet promptly right at the machine in the LISE CR PVD bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
(check links in confirmation email for documents) | 5 | 1 | Register! | | | | Training: FTIR spectroscopy and microscopy - LISE G04 | | Trainer: Arthur McClelland | | Learn to use the Nicolet iS50 with midIR and farIR spectral ranges and the Bruker Lumos with midIR mapping capabilities. | | Time | Max Attendees | Available | CNS Users ONLY |
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9:30 am - 11:00 am
| 3 | 3 | Register! | | | | Training: Introduction to Dry Etching - LISE 311 | | Trainer: Ling Xie | | This class teaches basic working principles of dry etching technologies, especially focusing on reactive ion etch (RIE) and ion beam etching (IBE). Dry etching capabilities at CNS Cleanroom will be introduced and etching system selection for your etching project will be discussed. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:00 am
This class is pre-requested for accessing any RIEs and IBE trainings | 6 | 6 | Register! | | | | Training: Introduction to Lithography - LISE 319 | | Trainer: Christine Yi-Ju Wang | | The class describes the basic working principles of lithography techniques. It also gives an overview of tools that are available in CNS. This is a prerequisite for all lithography process trainings. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 2:00 pm
| 10 | 10 | Register! | | | | Training: MA6 Mask aligner - In the cleanroom, next to the tool | | Trainer: Christine Yi-Ju Wang | Prerequisite: "Introduction to Lithography"
The MA6 mask aligner is good for 3-6" substrates, 4-7" photomasks, with bask side alignment capability. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:30 am - 11:00 am
| 3 | 3 | Register! | | | | Training: MJB4 mask aligner - In the cleanroom, next to the tool | | Trainer: Christine Yi-Ju Wang | Prerequisite: "Introduction to Lithography"
The MJB4 mask aligner is good for up to 4" substrates, 4" and 5" photomasks. Fast troughput with optimum resolution of 2um. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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11:00 am - 11:30 am
| 3 | 3 | Register! | | | | Training: Nikon XTH 225 Micro-CT Training - LISE G27 | | Trainer: Hao-Yu (Greg) Lin | Non-destructive 3D X-ray imaging technique.
Include software, Avizo and VGStudio MAX for the analysis and visualization of computed tomography (CT) data. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 12:00 pm
hylin@fas.harvard.edu | 4 | 4 | Register! | | | | Training: RIE-13 - Oxford PlasmaPro 100 Cobra - in front of the tool , inside cleanroom. | | Trainer: Kenlin Huang | Dry etching Intro Class is the prerequisite for taking RIE-13 - Oxford PlasmaPro 100 Cobra 300 training
(2:30 - 3:30 pm Wednesday) | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:30 pm - 3:30 pm
kenlinhuang@cns.fas.harvard.edu, 617-495-1738 | 3 | 1 | Register! | | | | Training: RTP-2 Atmospheric Rapid Thermal Processing - Inside cleanroom in PVD Bay | | Trainer: John Tsakirgis | | To understand the Safety and Operation of the Atmospheric Rapid Thermal tool at CNS | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:00 am
PLease be prompts and bring cleanroom notebook | 5 | 5 | Register! | | | | Training: Spinner training - In the cleanroom, photolithography bay | | Trainer: Christine Yi-Ju Wang | | The training covers the use and programming of the spinner. This training is required for all lithography processes (Ebeam, MLA150, uPG501, mask aligners, etc). | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:30 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: Thermo Scienitifc Nexsa surface analysis training - LISE G27 | | Trainer: Hao-Yu (Greg) Lin | Capable to do XPS, UPS, ISS and REELS
Pre-requisite: Thermo Scientific K-Alpha+ XPS Training | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 4:00 pm
Pre-requisite: Thermo Scientific K-Alpha+ XPS Training | 4 | 2 | Register! | | | | Training: UV-VIS-NIR spectroscopy - LISE G04 | | Trainer: Arthur McClelland | | Learn to use the Cary 7000 UV-VIS-NIR system for reflection or transmission measurements from 200-2700 nm with angle and polarization control. Integrating sphere also available. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:30 pm - 3:30 pm
| 3 | 3 | Register! | | | | Training: Wetbench + Chemical Safety Training - OUTSIDE CLEANROOM ENTRANCE - G-07 LISE | | Trainer: Mac Hathaway | | Training on wetbench safety, chemical safety, Situational Awareness, and how to not DIE at the wetbenches. MAKE SURE YOUR CLEAN SUIT IS HANGING UP READY TO GO. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 12:30 pm
| 8 | 8 | Register! | | |
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| Training: ALD-2 Arradiance GEMStar ALD and Pulsed CVD Training - G-07 Cleanroom | | Trainer: Philippe de Rouffignac | Introduction to Thin Film Growth and Processing is required before you can sign up for this training:
This tool utilizes both ALD and pulsed CVD techniques to grow conductive, conformal thin films.
Currently those include Ni, NiNx and WNx. These films are the most conductive ALD films available at the CNS. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 11:00 am
prerequisite: Introduction to Thin Film Growth and Processing | 4 | 3 | Register! | | | | Training: Cleanroom orientation - Meet in front of G07 | | Trainer: John Tsakirgis | | To understand our protocols and complete your registration | | Time | Max Attendees | Available | Open Event! |
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1:00 pm - 2:30 pm
Please be prompt | 10 | 10 | Register! | | | | Training: Horiba XploRa Raman, PL, hyperspectral imaging - LISE G04 | | Trainer: Arthur McClelland | | Learn to use the Horiba Explora system with 405 and 785 nm exciation lines for Raman and PL spectroscopy and mapping. The system also has the Cytoviva hyperspectral module that allows for transmission or refection spectra in bright field or dark field to be collected at every pixel in your field of view. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:30 pm - 3:30 pm
| 2 | 2 | Register! | | | | Training: Zeiss SEM Part 2 Training (Pre-Requisite Part 1 Online Training) - LISE B20B | | Trainer: Tim Cavanaugh | | This training covers the Zeiss FESEMs (Ultra55, Supra55VP, and UltraPlus). Topics include a discussion of microscope capabilities, software overview, and training provides a hands-on approach to acquiring high resolution surface images of various materials under different conditions. Users must complete the available "Zeiss SEM Part 1: Online training" prior to registration. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 1:00 pm
| 4 | 4 | Register! | | |
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| Training: CVD-4 Lindberg Furnace - Meet in front of G27, Please be prompts and bring notebook | | Trainer: John Tsakirgis | | To understand the Safety and Operation of our Lindberg Furnace | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 10:00 am
Please be prompt and bring cleanroom notebook | 5 | 5 | Register! | | | | Training: JAWoollam Spectroscopic Ellipsometer training - LISE-G07, in the main cleanroom | | Trainer: Jiangdong Deng | | In this advanced spectroscopic ellipsometer training, the basic ellipsometry principle, operation procedure, and basic data analysis skills will be covered. Some advanced thin film measurement strategies will be discussed. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 3:30 pm
| 4 | 4 | Register! | | |
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