All in-person trainings that CNS offers are listed in one of three categories. They are as follows:

Open Event: Any training with this designation is not charged and one does not require a CNS User Name and password in order to register. As a result, you can sign-up for any training with this designation even prior to completion of the CNS User enrollment process.

CNS Users Only: Trainings under this training designation do require an active CNS UN and PW. One must have completed the CNS User enrollment process and received the new user confirmation email in order to attend a training of this designation.

LISE Cleanroom Users Only: Trainings under this designation require, in addition to having a CNS UN and PW, that one be fully cleanroom qualified before one can sign-up. Information on how to become cleanroom qualified can be found in the User Info section of the website under the Nanofabrication Facility Use tab.

CNS does offer some trainings online through the Harvard University Training Portal. They will be listed below and do not require advance sign-up. Online trainings at the portal do require a Harvard Key. If you are a Non-Harvard User who does not have a HUID or HU Key, you will get one as part of the enrollment process.

The LISE CNS Safety Training, which is required as part of the enrollment process, is not listed as it is held at fixed times. Please see the Become a CNS User tab of the CNS web site for more info regarding that training.

Important information regarding training pre-requisite requirements and training pathways for specific instrumentation can be found in the User Info section of the CNS website under the tabs: Nanofabrication Facility Use and Imaging and Analysis Facility Use.

If you cannot find a training for something you are interested in receiving training on at CNS, please see the instrument sections of our website to find the technical staff member who manages it and contact them directly. If you cannot figure out who to contact regarding training, please contact us at info@cns.fas.harvard.edu

It is CNS policy that CNS Users only sign-up for trainings that they plan to attend. It is not permitted for a CNS User to sign-up for a groupmate or other party as a placeholder.

CNS Training Events - Registration Page


(Important information - please read)
 
  • Open Events
  • CNS Users Only
  • LISE Cleanroom Users Only
  • Month
Date TBD - you can pre-register for this training session.
CNS staff will notify you when a date has been set.
Training: Zeiss SEM Part 1: Online training - Harvard Training Portal
Trainer: Tim Cavanaugh
The SEM Part 1 training is available in an online format. You must pass this online training before taking the hands-on SEM training for our field emission Zeiss SEMs (FESEMs) or the EVO SEM. There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000007001
Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
 
Training: B15A online safety training - Harvard Training Portal
Trainer: Jules Gardener
CNS users who wish to use the instruments inside room B15A must complete the B15A safety training before gaining access to this room. The LISE B15A room safety training is available in an online format from https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/FAS-00013222 Please copy this URL into your browser to take the training. We recommend using Chrome, Safari or Internet Explorer.

You must pass this online training before room access can be granted. There is no sign-up required for our online trainings and these can be taken by CNS users at any time.

Please note that our online trainings can only be taken by CNS users who have a Harvard Key. If you are an external user and do not yet have a Harvard Key, please contact info@cns.fas.harvard.edu for information on how to get one.
 
Training: Basic Arctica Cryo-EM course Day 2 - B58 control room
Trainer: Svetla Stoilova-McPhie
Practicing of the Arctica Cryo-EM workflow.
 
Training: Basic Arctica Cryo-EM course Day 3 - B58 Control room
Trainer: Svetla Stoilova-McPhie
Practice and Certification to follow with Intermediate course
 
Training: Basic Arctica Cryo-EM course, Day 1 - B58 control room
Trainer: Svetla Stoilova-McPhie
CNS users will be demonstrated the Basic operation of our Tecnai Arctica Cryo-TEM workflow and have their own area set up to practice.
 
Training: Cryo-TEM sample preparation - GO5
Trainer: Svetla Stoilova-McPhie
CNS users will be trained to use the Vitorbot Mark IV to freeze their samples.
CNS users need to do the training for GO5 (2h) with Sandra Nacasone, (snakasone@cns.fas.harvard.edu) to use the equipment.
 
Training: Intermediate Arctica Cryo-EM course Day 1 - B58 Control room
Trainer: Svetla Stoilova-McPhie
The Intermediate Arctica Cryo-EM course has to be taken the week after the Basic Cryo-EM course.
It will consist of working with a standard Cryo-EM sample (vesicle and Apoferritin).
 
Training: Sputter coater training (online) - Harvard Training Portal
Trainer: Jules Gardener
This training is for the EMS sputter coaters located in the CNS Imaging sample preparation room (LISE B15A). These tools are optimized for coating SEM samples with a thin conductive layer. These coaters cannot be used for coating thick (>20nm) films. Pt/Pd and Au coatings are available.

Sputter coater training is available in an online format for these tools. You must pass this online training, and have completed the B15A room safety training (also available online), before access to the sputter coaters can be granted. Once you have completed these requirements, you will have access to both sputter coaters. There is no sign-up required for our online trainings and these can be taken by CNS users at any time. You can access the sputter coater training course at https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/FAS-00013226 Please copy this URL into your browser to take the training. We recommend using Chrome, Safari or Internet Explorer.

Please note that our online trainings can only be taken by CNS users who have a Harvard Key. If you are an external user and do not yet have a Harvard Key, please contact info@cns.fas.harvard.edu for information on how to get one.
 
Training: TEM Training Part 1: Online training - Harvard Training Portal
Trainer: Jules Gardener
This is a new online training which is required as the first step of TEM training for the JEOL 2100 and FEI F20 instruments. This training will provide an introduction to TEM concepts and background about our TEMs. You must pass the assessment at the end of this online course before attending an in-person TEM training on the JEOL 2100 or FEI F20 instruments. There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000010142

Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
 
Monday, May 4th, 2020
Training: G05 Cell Culture and Cryo-Prep Room Orientation - Meet outside of G05
Trainer: Sandra Nakasone
This safety orientation is mandatory for access to our biomaterials, cryo-prep, and cell culture BL2 laboratory (LISE G05). In order to gain access users must attend this orientation, complete at least one training for equipment inside G05, and take the "Laboratory Biosafety" online training from the Harvard EH&S website (https://www.ehs.harvard.edu/training). Email Sandra Nakasone (snakasone@cns.fas.harvard.edu) the certificate of completion once you are done. LONG PANTS and CLOSED-TOE SHOES MANDATORY.
TimeMax AttendeesAvailableCNS Users ONLY
10:30 am - 11:00 am
LONG PANTS and CLOSED-TOE SHOES MANDATORY. Long hair must be tied up.
66Register!
 
Training: G06 Nanotechnology and Rapid Prototyping Room Orientation - Meet outside of G06
Trainer: Sandra Nakasone
This safety orientation is mandatory for access to our chemical nanotechnology and rapid prototyping room (LISE G06). In order to gain access users must complete this safety orientation and at least one training for equipment inside G06. LONG PANTS AND CLOSED-TOE SHOES ARE MANDATORY.
TimeMax AttendeesAvailableCNS Users ONLY
11:00 am - 11:30 am
LONG PANTS and CLOSED-TOE SHOES are MANDATORY. Long hair must be tied up.
66Register!
 
Tuesday, May 5th, 2020
Training: FIB-4 FEI Helios - Basic Training - B15F
Trainer: Stephan Kraemer
Introduction to basic concepts of Focused Ion Beam microscopy and the operation of the FEI Helios FIB. With help of a cross section analysis all relevant techniques of material deposition, cutting and high-resolution imaging will be demonstrated. These techniques are the necessary building blocks to perform more advanced tasks such as TEM sample preparation or 3D serial sectioning.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 5:00 pm
Prior SEM training recommended
44Register!
 
Training: Form2 3D Printer Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
3:00 pm - 3:30 pm
44Register!
 
Training: Helix Laser Cutter Training - G06
Trainer: Sandra Nakasone
Prereq 1: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. Prereq 2: You must complete the EH&S online training called "Enclosed Laser Instrument Safety" and email the certificate of completion to Sandra Nakasone (snakasone@cns.fas.harvard.edu). You can access the online training here: https://www.ehs.harvard.edu/training
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
44Register!
 
Training: Introduction to Thin Film Deposition Processes - Training area, outside CNS G-07 Cleanroom
Trainer: Mac Hathaway
Introduction to Thin Film Deposition processes and techniques, with an emphasis on process control and overall integration into your process flow. This is a PREREQUISITE for all deposition process training.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:30 am
1010Register!
 
Training: Makerbot 3D Printer Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 3:00 pm
44Register!
 
Training: RIE-7 - Unaxis Shuttleline ICP RIE - in front of the tool inside cleanroom.
Trainer: Kenlin Huang
RIE-7 - Unaxis Shuttleline ICP RIE
3:30 pm
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
3:30 pm - 4:30 pm
kenlinhuang@cns.fas.harvard.edu
44Register!
 
Training: RIE-8 STS ICP RIE Training - LISE G07 CNS Cleanroom at the tool
Trainer: Ling Xie
The STS MPX/LPX RIE system is an Inductively Coupled Plasma Reactor that is used for Reactive Ion Etch. Using the ICP technology, this etch system is characterized with high plasma density, low operating pressure, high etch rate, excellent etch uniformity and low energy ion damage. Equipped with a chiller, the MPX/LPX system allows the substrate temperature to be controlled from 5 to 30C.

Applications

The STS ICP RIE will be restricted to etch silicon-based materials, which include Si, SiO2, and Si3N4.

Features
ICP assembly upper electrode powered up to 1,500 W
RF biased lower electrode powered up to 300 W and chilled to 4 30C
Single wafer loadlock up to 6 wafer
Available gases: SF6, CHF3, CH4, H2, Cl2, HBr, BCl3, Ar, N2, O2, and N2
Windows 2000 software control PC
Internet remote control capability
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 3:00 pm
44Register!
 
Training: Spinner training - SC-5 Spinner
Trainer: Malcolm Tse
The training covers the use and programming of the spinner. This training is required for all lithography processes (EBL, MLA150, uPG501, mask aligners, etc).
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 2:30 pm
44Register!
 
Wednesday, May 6th, 2020
Training: Contact Angle Measurement Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
11:30 am - 12:00 pm
44Register!
 
Training: Freeze Dryer/Lyophilizer Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 1:30 pm
44Register!
 
Training: Planetary Ball Mill Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
1:30 pm - 2:00 pm
44Register!
 
Training: SP-3 AJA 3-gun sputtering system training - CNS cleanroom (G-07) Dry Bay
Trainer: Mughees Khan
The system has one RF source and two DC sources (DC power supply is switchable between the two sources). SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with 1 RF and 1 DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their schedule. After 3 uses (with no problems) users are given 24/7 access.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 2:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing
33Register!
 
Training: Wetbench + Chemical Safety Training - OUTSIDE CLEANROOM ENTRANCE - G-07 LISE
Trainer: Mac Hathaway
Training on proper behavior, rules and techniques for wet chemical processing on the CNS wetbenches.
Requires cleanroom access, AND a cleanroom suit ALREADY HANGING UP. Will generally be followed by cleanroom tour and demonstration at 1:30 PM.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 12:30 pm
88Register!
 
Thursday, May 7th, 2020
Training: Discussions for Nano/Micro fabrication questions - LISE G52
Trainer: Ling Xie
TimeMax AttendeesAvailableCNS Users ONLY
3:00 pm - 3:30 pm
11Register!
 
Training: Sharon TE-3, 4, and 5 thermal evaporator training - LISE G07 (CNS Cleanroom), PVD Bay
Trainer: Malcolm Tse
Training on TE-3, 4 and 5 for thermal evaporation of metals is covered. We meet at the system in the CNS cleanroom PVD bay. Training takes about 2 hours. Venting, loading a sample, pumping and evaporation are performed and explained. For these TE systems, users supply their own deposition materials and boats (sources). CNS supplies the materials for training. After this training you will have access to all 3 systems, which are collectively capable of depositing: Ti, Cr, Cu, Ag, Au, Al, etc.
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 3:30 pm
44Register!
 
Training: Synergy H1m Plate Reader Training - G05
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
11:00 am - 12:00 pm
44Register!
 
Training: Zetasizer Nano ZS DLS Training - G05
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
44Register!
 
Monday, May 11th, 2020
Training: RIE-12-Matrix Plasma Asher training - In front of the tool inside cleanroom.
Trainer: Kenlin Huang
RIE-12-Matrix Plasma Asher training
at 4 pm on Monday
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
4:00 pm - 4:30 pm
kenlinhuang@cns.fas.harvard.edu
44Register!
 
Training: Soft Materials Cleanroom (SMCR) Orientation - Meet outside the cleanroom in the ground floor couches
Trainer: Sandra Nakasone
This orientation is required for access to the Soft Materials Cleanroom (SMCR). The SMCR is a cleanroom devoted to Soft Lithography with a focus on rapid prototyping of microfluidic devices using PDMS elastomer.

LONG PANTS & CLOSED-TOE SHOES ARE MANDATORY. Long hair must be tied up. Quiz to follow.
TimeMax AttendeesAvailableCNS Users ONLY
10:30 am - 12:00 pm
Long pants and closed-toe shoes are MANDATORY. Long hair must be tied up. Quiz to follow.
66Register!
 
Tuesday, May 12th, 2020
Training: ALD-1 and ALD-4 Training - ALD Oxide Deposition - Starts in CNS Cleanroom Gowning Area
Trainer: Mac Hathaway
Training for the Savannah ALD-1 and ALD-4 systems - Used for Al2O3, HfO2, TiO2, SiO2, ZrO2, and ZnO, as well as Pt and mixed oxides.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 3:00 pm
55Register!
 
Training: CVD-14 Oxford ICP-CVD - Low Temp - Cleanroom PVD Bay
Trainer: Mughees Khan
Training session for the Oxford ICP-CVD system.

This system is capable of SiO2 and SiNx growth from RT to 350C. Optimized recipes at 80C. a:Si growth at 200C (optimal), full range also available.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:30 pm - 3:00 pm
Prerequisite: Introduction to Thin Film Growth and Processing
55Register!
 
Training: CVD-3 Training: STS PECVD Training Session - Dry processing bay in the cleanroom
Trainer: Mughees Khan
Introduction to Thin Film Growth and Processing is required before you can sign up for this training:

This training will provide users with the tools necessary to grow high quality SiO2, SiNx, and a:Si films at temperatures from ~200 to 350C. These films can also be doped with B or P.
This tool is equipped with two RF generators, one at 13.56MHz (High frequency, HF recipes) and 380 kHz (low frequency, LF recipes). There are also recipes that take advantage of both RF generators to yield films with lower stress esp. silicon nitride films.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 2:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing
55Register!
 
Training: Form2 3D Printer Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
3:00 pm - 3:30 pm
44Register!
 
Training: Helix Laser Cutter Training - G06
Trainer: Sandra Nakasone
Prereq 1: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. Prereq 2: You must complete the EH&S online training called "Enclosed Laser Instrument Safety" and email the certificate of completion to Sandra Nakasone (snakasone@cns.fas.harvard.edu). You can access the online training here: https://www.ehs.harvard.edu/training
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
44Register!
 
Training: Introduction to Thin Film Deposition Processes - Training area, outside CNS G-07 Cleanroom
Trainer: Mac Hathaway
Introduction to Thin Film Deposition processes and techniques, with an emphasis on process control and overall integration into your process flow. This is a PREREQUISITE for all deposition process training.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:30 am
1010Register!
 
Training: LPCVD and APCVD Training (CVD 5,6,7,9,10,11) - Dry Processing Bay in cleanroom
Trainer: Mughees Khan
Introduction to Thin Film Growth and Processing is required before you can sign up for this training:

This is a general training for all of the LPCVD and APCVD furnaces. These Tystar furnaces can accommodate anything from a single 1cm substrate up to 50 6" wafers.
The various furnaces encompass the following processes:
- Anneals of non-metal containing samples from 250 to 1100C under O2, N2, and H2/He
- Anneals of metal containing samples from 250 to 1100C under N2 and H2/He
- Low stress and stoichiometric silicon nitride
- Amorphous and polycrystalline silicon (doped with P or B or undoped)
- SiO2 from TEOS (conformal, additive SiO2 process)
- SiO2 from oxidation of silicon using H2O or O2
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
10:00 am - 11:30 am
Prerequisite: Introduction to Thin Film Growth and Processing
44Register!
 
Training: Makerbot 3D Printer Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 3:00 pm
44Register!
 
Training: RIE-10 - SPTS Rapier DRIE - LISE G07, CNS Cleanroom at the tool
Trainer: Ling Xie
You have to finish NF-Training "Dry Etching Intro" first and then take this training!

SPTS RIE-10, a state-of-the-art deep silicon etching system, is furnished with dual plasma sources and dual gas inlets. The tool is characterized with high etch rate 6-10 µm/min; high aspect ratio 50:1; good selectivity > 50:1 to resist and >100:1 to silicon oxide; and a good uniformity < 5% cross 6” wafers. Its fixed RF matching technology reduces the step-process time to 1 second, which leads to a controllable side wall roughness < 6nm for nanoscale features. Major features include:

1. Primary rf power up to 3,000W
2. Secondary rf power up to 3,000W
3. Substrate power up to 300W
4. Chuck temperatures from -15°C to +40°C
5. Handling 6" or smaller samples
6. Claritas End Point Detector

Applications
1. Si etch only
2. High aspect ratio etch: 5 – 50
3. Deep etch: 5um through Si wafer etch
4. Broad feature sizes: from nano- to mm- scales in lateral dimension
5. Side wall roughness (scallop depth): 6nm – 700nm
6. Only resists and SiO2 or Si3N4 allowed as etching mask
7. Handling 6" or smaller samples
8. Absolutely no-metal mask or metal stop layers

Available Processes
1. Micro Pillars
2. Nano Pillars
3. Micro Trenches
4. Nano Trenches
5. Via etch
6. Through wafer via etch
7. Wafer thinning
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:00 pm - 4:00 pm
Meet in LISE 311 from 1pm - 2pm.
44Register!
 
Training: Spinner training - SC-5 Spinner
Trainer: Malcolm Tse
The training covers the use and programming of the spinner. This training is required for all lithography processes (EBL, MLA150, uPG501, mask aligners, etc).
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 2:30 pm
44Register!
 
Wednesday, May 13th, 2020
Training: Contact Angle Measurement Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
11:30 am - 12:00 pm
44Register!
 
Training: DOE-1 - ULVAC Deep Oxide Etcher training - In front of the tool inside cleanroom.
Trainer: Kenlin Huang
DOE-1 - ULVAC Deep Oxide Etcher training
at 3:30 pm
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
3:30 pm - 4:30 pm
kenlinhuang@cns.fas.harvard.edu
44Register!
 
Training: Freeze Dryer/Lyophilizer Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 1:30 pm
44Register!
 
Training: Introduction to Dry Etching - LISE 311
Trainer: Ling Xie
This class teaches basic working principles of dry etching technologies, especially focusing on reactive ion etch (RIE) and ion beam etching (IBE). Dry etching capabilities at CNS Cleanroom will be introduced and etching system selection for your etching project will be discussed.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:00 am
1212Register!
 
Training: Planetary Ball Mill Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
1:30 pm - 2:00 pm
44Register!
 
Training: RIE-11 Plasma Therm Diamond RIE - LISE G07 CNS Cleanroom at the tool
Trainer: Ling Xie
1. Introduction
The RIE-11 PT Versaline RIE is an Inductive Coupled Plasma Etching System with a maximum ICP source power of 1,200W and a maximum substrate bias power of 600W. The system is configured to handle 4 wafers and equipped with mechanical clamping and backside helium cooling features. Its substrate temperature can be controlled from 10C to180C. In addition, temperatures of three other components inside the chamber can also be controlled from 20C to 180C, including Lid, Ceramic Spool, and Metal Liner. Setting these components at elevated temperatures before processing will reduce by-product coating speed on chamber walls and stabilize chamber conditions for the first couple of runs after the tool was at a stand-by state for a long time.

2. Application
Only Diamond is allowed to be etched in this RIE and all other materials are forbidden.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 3:00 pm
44Register!
 
Training: RIE-13 - Oxford PlasmaPro 100 Cobra 300 training - In front of the tool inside cleanroom.
Trainer: Kenlin Huang
RIE-13 - Oxford PlasmaPro 100 Cobra 300 training
at 2:30 pm
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:30 pm - 3:30 pm
kenlinhuang@cns.fas.harvard.edu
55Register!
 
Training: SP-3 AJA 3-gun sputtering system training - CNS cleanroom (G-07) Dry Bay
Trainer: Mughees Khan
The system has one RF source and two DC sources (DC power supply is switchable between the two sources). SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with 1 RF and 1 DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their schedule. After 3 uses (with no problems) users are given 24/7 access.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 2:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing
33Register!
 
Training: Wetbench + Chemical Safety Training - OUTSIDE CLEANROOM ENTRANCE - G-07 LISE
Trainer: Mac Hathaway
Training on proper behavior, rules and techniques for wet chemical processing on the CNS wetbenches.
Requires cleanroom access, AND a cleanroom suit ALREADY HANGING UP. Will generally be followed by cleanroom tour and demonstration at 1:30 PM.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 12:30 pm
88Register!
 
Thursday, May 14th, 2020
Training: Discussions for Nano/Micro fabrication questions - LISE G52
Trainer: Ling Xie
TimeMax AttendeesAvailableCNS Users ONLY
3:00 pm - 3:30 pm
11Register!
 
Training: Synergy H1m Plate Reader Training - G05
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
11:00 am - 12:00 pm
44Register!
 
Training: XeF2-1 - Xactix e2 XeF2 Etch System - LISE G07 CNS Cleanroom
Trainer: Ling Xie
XeF2 etch is mainly for isotopically etching silicon. It is widely used for releasing MEMS structures, such as switches, cantilevers, bridges, mirrors, membranes, channels, and thermal isolation cavities. Its merits include highly selective etch, no stiction problems as existed with wet etch, and long under cuts. XeF2 also etches Ge, Mo and SiGe and transitional metals W, Ti, Ta, TiN and TaN under certain conditions such as high temperatures, but wont etch Al, Ni, Cr, Pt, Ga, MgO, ZnO, AlN, GaAs, resist, and PDMS.

The Xactix e2TM System installed in CNS Cleanroom is manufactured by SPTS, an Orbotech Company, its main features include:
Table Top System
PC based control software manages recipes, logs data and manages multiple users with password protection
Open load system to handle multiple types of substrates (wafers, chips, dicing frames, packages) without special handling substrates
Expansion chamber-based design for precise, repeatable pulse pressures, and ease of mixing XeF2 with other gasses.
Transparent process chamber lid and shower head over full wafer allows visual inspection of the entire wafer.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:00 pm - 3:00 pm
44Register!
 
Training: Zetasizer Nano ZS DLS Training - G05
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
44Register!
 
Friday, May 15th, 2020
Training: JAWoollam Spectroscopic Ellipsometer training - LISE-G07, in the main cleanroom
Trainer: Jiangdong Deng
this training will cover the basic principle and operation procedure of JAWoollam Spectroscopic Ellipsometer system for thin film optical measurement.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 3:30 pm
44Register!
 
Monday, May 18th, 2020
Training: G05 Cell Culture and Cryo-Prep Room Orientation - Meet outside of G05
Trainer: Sandra Nakasone
This safety orientation is mandatory for access to our biomaterials, cryo-prep, and cell culture BL2 laboratory (LISE G05). In order to gain access users must attend this orientation, complete at least one training for equipment inside G05, and take the "Laboratory Biosafety" online training from the Harvard EH&S website (https://www.ehs.harvard.edu/training). Email Sandra Nakasone (snakasone@cns.fas.harvard.edu) the certificate of completion once you are done. LONG PANTS and CLOSED-TOE SHOES MANDATORY.
TimeMax AttendeesAvailableCNS Users ONLY
10:30 am - 11:00 am
LONG PANTS and CLOSED-TOE SHOES MANDATORY. Long hair must be tied up.
66Register!
 
Training: G06 Nanotechnology and Rapid Prototyping Room Orientation - Meet outside of G06
Trainer: Sandra Nakasone
This safety orientation is mandatory for access to our chemical nanotechnology and rapid prototyping room (LISE G06). In order to gain access users must complete this safety orientation and at least one training for equipment inside G06. LONG PANTS AND CLOSED-TOE SHOES ARE MANDATORY.
TimeMax AttendeesAvailableCNS Users ONLY
11:00 am - 11:30 am
LONG PANTS and CLOSED-TOE SHOES are MANDATORY. Long hair must be tied up.
66Register!
 
Training: RIE-09 Anatech Plasma O2 stripper - In front of the tool inside cleanroom.
Trainer: Kenlin Huang
RIE-09 Anatech Plasma O2 stripper
at 3:30 pm on Monday
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
3:30 pm - 4:00 pm
kenlinhuang@cns.fas.harvard.edu
55Register!
 
Tuesday, May 19th, 2020
Training: FIB-4 FEI Helios - Basic Training - B15F
Trainer: Stephan Kraemer
Introduction to basic concepts of Focused Ion Beam microscopy and the operation of the FEI Helios FIB. With help of a cross section analysis all relevant techniques of material deposition, cutting and high-resolution imaging will be demonstrated. These techniques are the necessary building blocks to perform more advanced tasks such as TEM sample preparation or 3D serial sectioning.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 5:00 pm
Prior SEM training recommended
44Register!
 
Training: Form2 3D Printer Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
3:00 pm - 3:30 pm
44Register!
 
Training: Heidelberg uPG501 - Metrology bay in the cleanroom
Trainer: Guixiong Zhong
Training on the Heidelberg uPG501 direct-write lithography system. This tool can be used to expose positive and negative photoresist without the need for a photomask; it can also be used to write photomasks. The tool has 2 micron or better feature resolution, 1 micron alignment accuracy. The prerequisites for this training are the wet bench training, spinner/developing training, and the Introduction to Lithography class.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
3:00 pm - 4:00 pm
44Register!
 
Training: Helix Laser Cutter Training - G06
Trainer: Sandra Nakasone
Prereq 1: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. Prereq 2: You must complete the EH&S online training called "Enclosed Laser Instrument Safety" and email the certificate of completion to Sandra Nakasone (snakasone@cns.fas.harvard.edu). You can access the online training here: https://www.ehs.harvard.edu/training
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
44Register!
 
Training: Introduction to Thin Film Deposition Processes - Training area, outside CNS G-07 Cleanroom
Trainer: Mac Hathaway
Introduction to Thin Film Deposition processes and techniques, with an emphasis on process control and overall integration into your process flow. This is a PREREQUISITE for all deposition process training.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:30 am
1010Register!
 
Training: Makerbot 3D Printer Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 3:00 pm
44Register!
 
Training: MLA150 Maskless Aligner - Metrology bay in the cleanroom
Trainer: Guixiong Zhong
Training on the Heidelberg MLA150 Maskless Aligner. This tool can be used to expose positive and negative photoresist without the need for a photomask. The tool has 1 micron or better feature resolution, 0.5 micron alignment accuracy. The prerequisites for this training are the wet bench training, and Spinner/developing training.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:00 pm - 3:00 pm
44Register!
 
Training: RIE-7 - Unaxis Shuttleline ICP RIE - in front of the tool inside cleanroom.
Trainer: Kenlin Huang
RIE-7 - Unaxis Shuttleline ICP RIE
3:30 pm
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
3:30 pm - 4:30 pm
kenlinhuang@cns.fas.harvard.edu
44Register!
 
Training: RIE-8 STS ICP RIE Training - LISE G07 CNS Cleanroom at the tool
Trainer: Ling Xie
The STS MPX/LPX RIE system is an Inductively Coupled Plasma Reactor that is used for Reactive Ion Etch. Using the ICP technology, this etch system is characterized with high plasma density, low operating pressure, high etch rate, excellent etch uniformity and low energy ion damage. Equipped with a chiller, the MPX/LPX system allows the substrate temperature to be controlled from 5 to 30C.

Applications

The STS ICP RIE will be restricted to etch silicon-based materials, which include Si, SiO2, and Si3N4.

Features
ICP assembly upper electrode powered up to 1,500 W
RF biased lower electrode powered up to 300 W and chilled to 4 30C
Single wafer loadlock up to 6 wafer
Available gases: SF6, CHF3, CH4, H2, Cl2, HBr, BCl3, Ar, N2, O2, and N2
Windows 2000 software control PC
Internet remote control capability
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 3:00 pm
44Register!
 
Training: Spinner training - SC-5 Spinner
Trainer: Malcolm Tse
The training covers the use and programming of the spinner. This training is required for all lithography processes (EBL, MLA150, uPG501, mask aligners, etc).
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 2:30 pm
44Register!
 
Wednesday, May 20th, 2020
Training: AS200 i-line Stepper - Photolithography bay in the cleanroom
Trainer: Guixiong Zhong
Basic training to use the stepper.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:30 pm - 4:00 pm
44Register!
 
Training: Contact Angle Measurement Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
11:30 am - 12:00 pm
44Register!
 
Training: Freeze Dryer/Lyophilizer Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 1:30 pm
44Register!
 
Training: Planetary Ball Mill Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
1:30 pm - 2:00 pm
44Register!
 
Training: SP-3 AJA 3-gun sputtering system training - CNS cleanroom (G-07) Dry Bay
Trainer: Mughees Khan
The system has one RF source and two DC sources (DC power supply is switchable between the two sources). SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with 1 RF and 1 DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their schedule. After 3 uses (with no problems) users are given 24/7 access.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 2:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing
33Register!
 
Thursday, May 21st, 2020
Training: Discussions for Nano/Micro fabrication questions - LISE G52
Trainer: Ling Xie
TimeMax AttendeesAvailableCNS Users ONLY
3:00 pm - 3:30 pm
11Register!
 
Training: Sharon TE-3, 4, and 5 thermal evaporator training - LISE G07 (CNS Cleanroom), PVD Bay
Trainer: Malcolm Tse
Training on TE-3, 4 and 5 for thermal evaporation of metals is covered. We meet at the system in the CNS cleanroom PVD bay. Training takes about 2 hours. Venting, loading a sample, pumping and evaporation are performed and explained. For these TE systems, users supply their own deposition materials and boats (sources). CNS supplies the materials for training. After this training you will have access to all 3 systems, which are collectively capable of depositing: Ti, Cr, Cu, Ag, Au, Al, etc.
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 3:30 pm
44Register!
 
Training: Synergy H1m Plate Reader Training - G05
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
11:00 am - 12:00 pm
44Register!
 
Training: Zetasizer Nano ZS DLS Training - G05
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
44Register!
 
Monday, May 25th, 2020
Training: Soft Materials Cleanroom (SMCR) Orientation - Meet outside the cleanroom in the ground floor couches
Trainer: Sandra Nakasone
This orientation is required for access to the Soft Materials Cleanroom (SMCR). The SMCR is a cleanroom devoted to Soft Lithography with a focus on rapid prototyping of microfluidic devices using PDMS elastomer.

LONG PANTS & CLOSED-TOE SHOES ARE MANDATORY. Long hair must be tied up. Quiz to follow.
TimeMax AttendeesAvailableCNS Users ONLY
10:30 am - 12:00 pm
Long pants and closed-toe shoes are MANDATORY. Long hair must be tied up. Quiz to follow.
66Register!
 
Tuesday, May 26th, 2020
Training: ALD-1 and ALD-4 Training - ALD Oxide Deposition - Starts in CNS Cleanroom Gowning Area
Trainer: Mac Hathaway
Training for the Savannah ALD-1 and ALD-4 systems - Used for Al2O3, HfO2, TiO2, SiO2, ZrO2, and ZnO, as well as Pt and mixed oxides.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 3:00 pm
55Register!
 
Training: CVD-14 Oxford ICP-CVD - Low Temp - Cleanroom PVD Bay
Trainer: Mughees Khan
Training session for the Oxford ICP-CVD system.

This system is capable of SiO2 and SiNx growth from RT to 350C. Optimized recipes at 80C. a:Si growth at 200C (optimal), full range also available.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:30 pm - 3:00 pm
Prerequisite: Introduction to Thin Film Growth and Processing
55Register!
 
Training: CVD-3 Training: STS PECVD Training Session - Dry processing bay in the cleanroom
Trainer: Mughees Khan
Introduction to Thin Film Growth and Processing is required before you can sign up for this training:

This training will provide users with the tools necessary to grow high quality SiO2, SiNx, and a:Si films at temperatures from ~200 to 350C. These films can also be doped with B or P.
This tool is equipped with two RF generators, one at 13.56MHz (High frequency, HF recipes) and 380 kHz (low frequency, LF recipes). There are also recipes that take advantage of both RF generators to yield films with lower stress esp. silicon nitride films.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 2:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing
55Register!
 
Training: Form2 3D Printer Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
3:00 pm - 3:30 pm
44Register!
 
Training: Helix Laser Cutter Training - G06
Trainer: Sandra Nakasone
Prereq 1: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located. Prereq 2: You must complete the EH&S online training called "Enclosed Laser Instrument Safety" and email the certificate of completion to Sandra Nakasone (snakasone@cns.fas.harvard.edu). You can access the online training here: https://www.ehs.harvard.edu/training
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
44Register!
 
Training: Introduction to Thin Film Deposition Processes - Training area, outside CNS G-07 Cleanroom
Trainer: Mac Hathaway
Introduction to Thin Film Deposition processes and techniques, with an emphasis on process control and overall integration into your process flow. This is a PREREQUISITE for all deposition process training.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:30 am
1010Register!
 
Training: LPCVD and APCVD Training (CVD 5,6,7,9,10,11) - Dry Processing Bay in cleanroom
Trainer: Mughees Khan
Introduction to Thin Film Growth and Processing is required before you can sign up for this training:

This is a general training for all of the LPCVD and APCVD furnaces. These Tystar furnaces can accommodate anything from a single 1cm substrate up to 50 6" wafers.
The various furnaces encompass the following processes:
- Anneals of non-metal containing samples from 250 to 1100C under O2, N2, and H2/He
- Anneals of metal containing samples from 250 to 1100C under N2 and H2/He
- Low stress and stoichiometric silicon nitride
- Amorphous and polycrystalline silicon (doped with P or B or undoped)
- SiO2 from TEOS (conformal, additive SiO2 process)
- SiO2 from oxidation of silicon using H2O or O2
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
10:00 am - 11:30 am
Prerequisite: Introduction to Thin Film Growth and Processing
44Register!
 
Training: Makerbot 3D Printer Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 3:00 pm
44Register!
 
Training: RIE-10 - SPTS Rapier DRIE - LISE G07, CNS Cleanroom at the tool
Trainer: Ling Xie
You have to finish NF-Training "Dry Etching Intro" first and then take this training!

SPTS RIE-10, a state-of-the-art deep silicon etching system, is furnished with dual plasma sources and dual gas inlets. The tool is characterized with high etch rate 6-10 µm/min; high aspect ratio 50:1; good selectivity > 50:1 to resist and >100:1 to silicon oxide; and a good uniformity < 5% cross 6” wafers. Its fixed RF matching technology reduces the step-process time to 1 second, which leads to a controllable side wall roughness < 6nm for nanoscale features. Major features include:

1. Primary rf power up to 3,000W
2. Secondary rf power up to 3,000W
3. Substrate power up to 300W
4. Chuck temperatures from -15°C to +40°C
5. Handling 6" or smaller samples
6. Claritas End Point Detector

Applications
1. Si etch only
2. High aspect ratio etch: 5 – 50
3. Deep etch: 5um through Si wafer etch
4. Broad feature sizes: from nano- to mm- scales in lateral dimension
5. Side wall roughness (scallop depth): 6nm – 700nm
6. Only resists and SiO2 or Si3N4 allowed as etching mask
7. Handling 6" or smaller samples
8. Absolutely no-metal mask or metal stop layers

Available Processes
1. Micro Pillars
2. Nano Pillars
3. Micro Trenches
4. Nano Trenches
5. Via etch
6. Through wafer via etch
7. Wafer thinning
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:00 pm - 4:00 pm
Meet in LISE 311 from 1pm - 2pm.
44Register!
 
Training: Spinner training - SC-5 Spinner
Trainer: Malcolm Tse
The training covers the use and programming of the spinner. This training is required for all lithography processes (EBL, MLA150, uPG501, mask aligners, etc).
TimeMax AttendeesAvailableCNS Users ONLY
2:00 pm - 2:30 pm
44Register!
 
Wednesday, May 27th, 2020
Training: Contact Angle Measurement Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
11:30 am - 12:00 pm
44Register!
 
Training: DOE-1 - ULVAC Deep Oxide Etcher training - In front of the tool inside cleanroom.
Trainer: Kenlin Huang
DOE-1 - ULVAC Deep Oxide Etcher training
at 3:30 pm
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
3:30 pm - 4:30 pm
kenlinhuang@cns.fas.harvard.edu
44Register!
 
Training: Freeze Dryer/Lyophilizer Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 1:30 pm
44Register!
 
Training: Introduction to Dry Etching - LISE 311
Trainer: Ling Xie
This class teaches basic working principles of dry etching technologies, especially focusing on reactive ion etch (RIE) and ion beam etching (IBE). Dry etching capabilities at CNS Cleanroom will be introduced and etching system selection for your etching project will be discussed.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 11:00 am
1212Register!
 
Training: Introduction to Lithography - LISE room 319
Trainer: Guixiong Zhong
The class describes the basic working principles of lithography techniques. It also gives an overview of tools that are available in CNS. This is a prerequisite for all lithography process trainings.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
1010Register!
 
Training: Planetary Ball Mill Training - G06
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G06 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
1:30 pm - 2:00 pm
44Register!
 
Training: RIE-11 Plasma Therm Diamond RIE - LISE G07 CNS Cleanroom at the tool
Trainer: Ling Xie
1. Introduction
The RIE-11 PT Versaline RIE is an Inductive Coupled Plasma Etching System with a maximum ICP source power of 1,200W and a maximum substrate bias power of 600W. The system is configured to handle 4 wafers and equipped with mechanical clamping and backside helium cooling features. Its substrate temperature can be controlled from 10C to180C. In addition, temperatures of three other components inside the chamber can also be controlled from 20C to 180C, including Lid, Ceramic Spool, and Metal Liner. Setting these components at elevated temperatures before processing will reduce by-product coating speed on chamber walls and stabilize chamber conditions for the first couple of runs after the tool was at a stand-by state for a long time.

2. Application
Only Diamond is allowed to be etched in this RIE and all other materials are forbidden.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 3:00 pm
44Register!
 
Training: RIE-13 - Oxford PlasmaPro 100 Cobra 300 training - In front of the tool inside cleanroom.
Trainer: Kenlin Huang
RIE-13 - Oxford PlasmaPro 100 Cobra 300 training
at 2:30 pm
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:30 pm - 3:30 pm
kenlinhuang@cns.fas.harvard.edu
55Register!
 
Training: SP-3 AJA 3-gun sputtering system training - CNS cleanroom (G-07) Dry Bay
Trainer: Mughees Khan
The system has one RF source and two DC sources (DC power supply is switchable between the two sources). SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with 1 RF and 1 DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their schedule. After 3 uses (with no problems) users are given 24/7 access.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 2:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing
33Register!
 
Training: Wetbench + Chemical Safety Training - OUTSIDE CLEANROOM ENTRANCE - G-07 LISE
Trainer: Mac Hathaway
Training on proper behavior, rules and techniques for wet chemical processing on the CNS wetbenches.
Requires cleanroom access, AND a cleanroom suit ALREADY HANGING UP. Will generally be followed by cleanroom tour and demonstration at 1:30 PM.
TimeMax AttendeesAvailableCNS Users ONLY
10:00 am - 12:30 pm
88Register!
 
Thursday, May 28th, 2020
Training: Discussions for Nano/Micro fabrication questions - LISE G52
Trainer: Ling Xie
TimeMax AttendeesAvailableCNS Users ONLY
3:00 pm - 3:30 pm
11Register!
 
Training: Synergy H1m Plate Reader Training - G05
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
11:00 am - 12:00 pm
44Register!
 
Training: XeF2-1 - Xactix e2 XeF2 Etch System - LISE G07 CNS Cleanroom
Trainer: Ling Xie
XeF2 etch is mainly for isotopically etching silicon. It is widely used for releasing MEMS structures, such as switches, cantilevers, bridges, mirrors, membranes, channels, and thermal isolation cavities. Its merits include highly selective etch, no stiction problems as existed with wet etch, and long under cuts. XeF2 also etches Ge, Mo and SiGe and transitional metals W, Ti, Ta, TiN and TaN under certain conditions such as high temperatures, but wont etch Al, Ni, Cr, Pt, Ga, MgO, ZnO, AlN, GaAs, resist, and PDMS.

The Xactix e2TM System installed in CNS Cleanroom is manufactured by SPTS, an Orbotech Company, its main features include:
Table Top System
PC based control software manages recipes, logs data and manages multiple users with password protection
Open load system to handle multiple types of substrates (wafers, chips, dicing frames, packages) without special handling substrates
Expansion chamber-based design for precise, repeatable pulse pressures, and ease of mixing XeF2 with other gasses.
Transparent process chamber lid and shower head over full wafer allows visual inspection of the entire wafer.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
2:00 pm - 3:00 pm
44Register!
 
Training: Zetasizer Nano ZS DLS Training - G05
Trainer: Sandra Nakasone
Prereq: You must have taken the "LISE G05 room orientation" given every other Monday by Sandra Nakasone. This training is mandatory, it will allow you to get into the room where this tool is located.
TimeMax AttendeesAvailableCNS Users ONLY
1:00 pm - 2:00 pm
44Register!
 
Friday, May 29th, 2020
Training: JAWoollam Spectroscopic Ellipsometer training - LISE-G07, in the main cleanroom
Trainer: Jiangdong Deng
this training will cover the basic principle and operation procedure of JAWoollam Spectroscopic Ellipsometer system for thin film optical measurement.
TimeMax AttendeesAvailableLISE Cleanroom Users ONLY
1:30 pm - 3:30 pm
44Register!
 

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