Bok joined CNS in January 2022 as a photolithography engineer. He has expertise in photolithography and 3D printing. Before joining CNS, he worked in the Lewis group at Harvard for 15 years, focusing on ink synthesis and 3D printing for applications in printed electronics, 3D micro-architectures, and batteries.

JD is the lead for Nanofabrication facility and Scanning Probe Microscope group at the CNS. Dr. Deng received his first doctorate in physics from Nankai University in China, then the second Ph. D degree in Electrical Engineering from Virginia Tech. (VT). After working as a project manager in a nanotechnology industry for 3 years, he joined CNS in 2004 as principal scientist. His current research interests include various nanofabrication technologies, especially advanced lithography and process integration, photonic/ electronic sensor structures, MEMs/NEMs device, and Scanning Probe Microscopy (SPM)-based nano-characterization technologies.

Danial joined CNS staff as Cleanroom Equipment Engineer in 2023. He holds bachelor's and master's degrees in mechanical engineering and a graduate certificate in business. He previously worked at CNS as a visiting fellow. Danial developed and implemented new platforms for stacking of 2D materials at CNS.

Dr. Haojie Ji joined CNS in November 2024 as a Sr. Photonics Integration Engineer. He has expertise in photonics, nanofabrication, and optics. At the Nanofabrication Facility, Haojie specializes in Photonics Wire Bonding and Backend Packaging tools, supporting user training and advancing process development.

Equipment Engineer. 30 years experience in semiconductor equipment support, maintenance and manufacturing. Areas of expertise are Etch, PECVD, PVD. Education in computers, electronics and electrical construction.

Yuan Lu is in charge of all the e-beam lithography. Training, up-keep, and operating of these four e-beam tools: Elionix F-125 –125 kV, 4nm minimum feature size and up to 8 inch sample size; Elionix 7000 -- 100kV, 10nm minimum feature size and up to 8 inch sample size; Raith 150 -- 30 kV, 30nm minimum feature size and up to 4 inch sample size; and Jeol 7000F -- 30 kV, 30nm minimum feature size and with mechanical stage.

Ed is an engineer in the Nanofabrication Group (cleanroom). His focus is on Physical Vapor Deposition (PVD) systems and processes, including thermal and electron beam evaporation as well as sputtering. He earned his bachelor’s degree in Mechanical Engineering at Northeastern University. Prior to CNS, Ed has worked as a mechanic, machinist, draftsman and various other jobs. In his spare time he rides motorcycles and meddles about in his garage machine shop.

Steve has a long history of semiconductor equipment engineering starting in the late 70’s as a mechanical assembler for Plasma- Therm and progressing to field service for equipment manufacturers to supporting 24/7 semiconductor fabs. Steve’s expertise is in vacuum equipment, thermal processing, wet chemical systems, and gas handling equipment. Steve manages all equipment moves and installations in the Nanofab and shares equipment responsibility with Dave LeFleur. In his free time, Steve does extensive research on catching striped bass in Boston harbor, repairing old furniture, and supporting his children through college and into the workforce.

Photolithography Engineer

Ling is a Principal Scientist specialized in nanofabrication to construct nanostructures, e.g., nanotubes, Si nanowires, and ultra-narrow (~10nm) smooth trenches in Si. Her current focus is on Reactive Ion Etch (RIE). She has collaborated with faculty groups to etch specific shapes in diamond, Si, and III-V materials. Ling received her PhD in Materials Science and Engineering and worked with Kodak on CCD image sensors and Lucent on 3D optical switches before joined CNS. She has experiences in thin film deposition and characterization. In her free time, she enjoys reading and serving her community.

Yumian Zhu joined Harvard CNS in December 2024 as an Equipment Engineer. He focusses on Physical Vapor Deposition and Reactive Ion Etch (PVD/RIE) tools for preventive maintenance, troubleshooting and process. Prior to joining CNS, he had experience maintaining and installing equipment in the 4/5 nm process area.