Equipment Engineer. 30 years experience in semiconductor equipment support, maintenance and manufacturing. Areas of expertise are Etch, PECVD, PVD. Education in computers, electronics and electrical construction.

Ed is an engineer in the Nanofabrication Group (cleanroom). His focus is on Physical Vapor Deposition (PVD) systems and processes, including thermal and electron beam evaporation as well as sputtering. He earned his bachelor’s degree in Mechanical Engineering at Northeastern University. Prior to CNS, Ed has worked as a mechanic, machinist, draftsman and various other jobs. In his spare time he rides motorcycles and meddles about in his garage machine shop.

Guixiong joined CNS in January 2013 as a senior process engineer. He has expertise in device fabrication, materials synthesis and characterization, and MEMS process integration. At CNS, his responsibilities include photolithography, back end packaging, and process development. He offers trainings on the i-line Stepper, Nanoscribe 3D Lithography System, Maskless Aligner MLA150, uPG501 Laser Direct Writer, Wire Bonder, Flip Chip Bonder, and the Scriber/Cleaver LSD100.

JD is the lead for Nanofabrication facility and Scanning Probe Microscope group at the CNS. Dr. Deng received his first doctorate in physics from Nankai University in China, then the second Ph. D degree in Electrical Engineering from Virginia Tech. (VT). After working as a project manager in a nanotechnology industry for 3 years, he joined CNS in 2004 as principal scientist. His current research interests include various nanofabrication technologies, especially advanced lithography and process integration, photonic/ electronic sensor structures, MEMs/NEMs device, and Scanning Probe Microscopy (SPM)-based nano-characterization technologies.

Ling is a Principal Scientist specialized in nanofabrication to construct nanostructures, e.g., nanotubes, Si nanowires, and ultra-narrow (~10nm) smooth trenches in Si. Her current focus is on Reactive Ion Etch (RIE). She has collaborated with faculty groups to etch specific shapes in diamond, Si, and III-V materials. Ling received her PhD in Materials Science and Engineering and worked with Kodak on CCD image sensors and Lucent on 3D optical switches before joined CNS. She has experiences in thin film deposition and characterization. In her free time, she enjoys reading and serving her community.

Mac is the primary ALD Process Engineer, and maintains various ancillary process, access, and safety systems at CNS.

Philippe de Rouffignac is a Principal Scientist in charge of Chemical Vapor Deposition and Atomic Layer Deposition in the nanofabrication group at the CNS. Dr. de Rouffignac earned his bachelor's degree in chemistry from the University of Texas - Austin and his PhD in chemistry from Harvard University. In his doctorate work he performed developed novel ALD processes for many lanthanide series oxides as well as device applications for a catalytic ALD silica process. During his graduate studies, he served as a resident tutor in Dunster House where he enjoyed advising undergraduate students and working with the culinary team to run the Master’s Open Houses. Prior to his current position, he was a Principal Engineer at Arradiance Systems developing novel ALD processes and tools and prior to that was a Senior Process Engineer for Novellus systems working on HDP-CVD applications. In his spare time he enjoys cooking, traveling, golf, basketball and playing with his children.

Steve has a long history of semiconductor equipment engineering starting in the late 70’s as a mechanical assembler for Plasma- Therm and progressing to field service for equipment manufacturers to supporting 24/7 semiconductor fabs. Steve’s expertise is in vacuum equipment, thermal processing, wet chemical systems, and gas handling equipment. Steve manages all equipment moves and installations in the Nanofab and shares equipment responsibility with Dave LeFleur. In his free time, Steve does extensive research on catching striped bass in Boston harbor, repairing old furniture, and supporting his children through college and into the workforce.

Yuan Lu is in charge of all the e-beam lithography. Training, up-keep, and operating of these four e-beam tools: Elionix F-125 –125 kV, 4nm minimum feature size and up to 8 inch sample size; Elionix 7000 -- 100kV, 10nm minimum feature size and up to 8 inch sample size; Raith 150 -- 30 kV, 30nm minimum feature size and up to 4 inch sample size; and Jeol 7000F -- 30 kV, 30nm minimum feature size and with mechanical stage.