The MJB4 Mask Aligner allows different type of contact exposures (vacuum, hard, soft proximity contact) for different size sample (up to 4 inch in diameter). The achievable adjustment accuracy X, Y and theta is below 1 µm. Masks and wafer/substrates to a total thickness of 9.00 mm can be processed. The MJB4 is equipped with 400 nm exposure optics and lamps that allow a sub-micro exposure in vacuum contact. 

*Positive and negative tone photoresists 

*Substrate sizes up to 4 inches in diameter 

*4 inch or 5 inch mask plates 

*Topside alignment only 

*Minimum alignment mark separation for binocular vision: 3.5 cm 

*Typical pattern resolution 1 µm

*Achievable alignment resolution 1 µm

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