1. Introduction 

EVG 620 mask aligner is a high-resolution photolithography tool capable of performing both topside and backside alignment. With the current setup the tool can process 6"wafers. The EVG 620 is the most automated mask aligner in the CNS cleanroom. It is capable of prepositioning the optical system (objectives) to a pre-assigned coordinate making future processing more convenient. With the help of 10X objectives for both top and bottom alignment you can get up too ~1.5 µm alignment accuracy. 

2. Application 

Major functions, features, and benefits: 

a) Topside(TSA) and Backside(BSA) alignment 

b) Achievable exposure resolution ~1 µm, alignment resolution ~ 1.5µm 

c) Only 6" wafer is allowed 

d) Able to perform soft, hard, low vacuum and vacuum contact, as well as proximity exposure 

e) Restricted to positive-tone photoresists.

Click here to view this tool in the CNS virtual reality model.