RIE-11
Plasma-Therm Diamond RIE
Nanofabrication Facility
MAKE
Plasma-Therm
MODEL
Versaline
LOCATION
LISE Cleanroom G07
Plasma-Therm Diamond RIE (RIE-11) PT RIE-11 is Plasma-Therm脙垄芒聜卢芒聞垄s Versaline Inductive Coupled Plasma (ICP) etching system, a product resulting from decades of technology evolution. Its 2 MHz ICP RF for efficient coupling of power to plasma makes etching results stable and repeatable. Well designed thermal management components control chamber temperatures at desired values from beginning to the end during processes. Major features include: 脙聜脗路 ICP RF up to 1,200 W 脙聜脗路 RF bias up to 600 W 脙聜脗路 Substrate temperatures from 10 脙聜脗掳C to 180 脙聜脗掳C 脙聜脗路 Lid, ceramic spool, and metal liner temperatures from 20 脙聜脗掳C to 180 脙聜脗掳C Applications Diamond etch only Available Processes 脙聜脗路 Thorough O2 plasma chamber cleaning processes for NV center applications 脙聜脗路 Nano-feature etch 脙聜脗路 Diamond thinning.
Click here to view this tool in the CNS virtual reality model.
For issues related to etching processes, please contact Ling Xie; for issues related to equipment, please contact Steve Paolini and David LaFleur. Please refer to the Nanofabrication Facility Use tab of the User Info section of the CNS website for the nanofab training flowchart.
Ling Xie
lxie@cns.fas.harvard.edu
primary contact
David LaFleur
dlafleur@cns.fas.harvard.edu