The Matrix 105 represents the industry standard in single-wafer photoresist removal and the mainstay of the highly successful plasma descum system for the semiconductor industry. The system reduces carbon-chain polymer resist in a non damaging environment. It's design incorporates close loop control of vital process parameters, which in turn eliminate device damage that could be both thermal and electrical. The Matrix is a plasma asher (oxygen plasma) using a single 600 watt RF generator. It has a heated chuck capable of 250 °C operating temperature. The system is process driven through menu commands and can be programmed for a maximum of 3 step processes plus over etch when using the spectrum endpoint detector. Each step can allow independent control of RF power, oxygen flow, pressure, and up / down movement of the wafer. The pic and place handler is set up to use 6"" wafers. Rates 1.2 - 2.5 µm/min on resist   ------------------------------------------------------------- The system is currently configured as a resist strip asher. By placing a baffle in the chamber, the system can be used as a down stream ozone etcher (descum). In order to use as a down stream etcher a request must be made to the staff to convert the system to this configuration. Rates: 20 - 1200 nm/min on resist .08 - .11nm/min on diamond

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