MLA150 Maskless Aligner is a high performance direct exposure system specifically designed for easy operation and high-speed exposures. It offers all the capabilities of a traditional Mask Aligner for single layer and multi-layer applications and even overcomes some of the limitations of photomask based exposure technologies. The MLA will eliminate the need for photomasks and shorten your development cycle significantly. 

Key features: 

* Support for all standard input formats (dxf, gdsii, cif, gerber) 

* One chuck for all substrate from 5mm*5mm to 150mm*150mm 

* No need for edge-bead removal or edge compensation 

* High precision topside and backside alignment 

* Distortion compensation 

* Simple alignment on thick resist and small substrates 

* Alignment accuracy less than 500nm 

* Min. feature size of 1um 

* Expose time for 50mm*50mm, approx. 4 mins 

* Non-contact exposure 

* High Aspect Ratio exposures in thick resist 

* Automatic labeling and serialization 

* Compatible to g-, h- and i-line resists

Click here to view this tool in the CNS virtual reality model.