Equipment:

The SAMCO Model PC-300 is a parallel-plate plasma system for the cleaning of products such as plastic microelectronics package and for the surface modifications of organic films. Process chamber is available as standalone modules without load lock. The electrode temperature remains at room temperature and can not be adjusted.  An easy-to-use touch panel interface and 100 recipes storage allows for fully automatic process control. This system is configured as plasma etch (PE) mode using a 13.56 MHz, RF-generated plasma with 300 W maximum power. Only oxygen with maximum flow rat of 49 sccm is provided as the process gas at our facility.  Parameters that can be selected include the process O2 gas, O2 gas flow rate, pre-process base pressure, RF power, and processing time. Complete processing of the wafer is accomplished without additional operator interaction once the process recipes have been set up and the process has been initiated by the operator.

Applications:

The SAMCO Model PC-300 tool will be restricted for the purposes of surface cleaning, descum and film modification.

Processes:

In general, the O2 etch processes demonstrated excellent removal of organic contamination, descum and surface modification of organic films.

Click here to view this tool in the CNS virtual reality model.