This mask alignment and exposure system has a table-top configuration and offers Near UV (365nm (I line) and 400nm (H line)) exposure capabilities. It is a contact aligner with precision x, y, z and substrate rotation controls. It has a dual-field high magnification microscope for alignment. We provide two circular vacuum chucks capable of processing 3”/4” and 6”/8” wafers with Wedge Compensation (Planarizing) feature. The aligner has two mask holders for 5”x5” and 9”x9” sized masks, ideal for 3”/4” and 6”/8” wafers respectively. The minimum feature size that can be achieved on this system is about 2 micrometers. However, the practical limit will ultimately depend on the mask resolution, the photoresist type, thickness, uniformity, and the level of contact between the photoresist layer and the mask.