2D material stacking system is designed for chip scale mechanical stacking of 2D material via polymer-based stamps. Multilayer heterostructures as well as twisted samples can be made using this system. This set up has one of highest resolution micro-manipulators available (20nm). In addition, utilization of highly accurate memory positions enables users to save time during stacking.

Key Features

·       Sample stage rotation: Maximum allowable rotation with 0.003accuracy.

·       Sample stage XY range:

·       Micro-manipulator travel range in XYZ direction: with 20nm resolution

·       Standard substrate size: SiO₂ chips. Up to chips can be fitted under the stage. Sample height up to fits on the stage.

·       Temperature range: