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| Training: CNS Safety Orientation - Online at the Harvard Training Portal | | Trainer: Jim Reynolds | This training is required as part of the CNS User enrollment process (step 3 for HU Users, step 7 for non-HU Users).
Please note that Non-HU Users, unless they already have a HUID and HU Key, will need to wait until after completion of step 6 of the enrollment process to obtain their HU Key in order to take the CNS Safety Orientation. HU Users and those Non-HU Users who already have a HU Key can take this orientation at any point in the enrollment process.
How to take the CNS Safety Orientation:
As of May 13, 2024, the CNS Safety Orientation (formerly known as the CNS Safety Training) has moved to the online Harvard Training Portal (HTP) at the URL: https://trainingportalinfo.harvard.edu/
You can navigate directly to the CNS Safety Orientation via the URL: https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/leclassview/dowbt-0000273303
Alternatively, you can also access the orientation by logging in to the HTP home page. Just put ‘CNS’ in the search bar in the upper right hand corner. All CNS online training options will result. Select the CNS Safety Orientation and complete that training.
The orientation will last for about an hour. Once done with the orientation, get a copy of the completion certificate available in the HTP and send it to info@cns.fas.harvard.edu. | | | | Training: Zeiss SEM Part 1: Online training - Harvard Training Portal | | Trainer: Tim Cavanaugh | The SEM Part 1 training is available in an online format. You must pass this online training before taking the hands-on SEM training for our field emission Zeiss SEMs (FESEMs). This includes SEM-8, SEM-12, SEM-13, and SEM-14. There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000007001
PLEASE NOTE THAT THIS TRAINING IS ONLY FOR FULLY ENROLLED CNS USERS. IF YOU ARE LOOKING FOR THE FREE CNS IMAGING GROUP MASTERCLASS WEBINARS, PLEASE SEE FURTHER BELOW
Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
| | | | Training: 2D-Stacker-01 training - | | Trainer: Danial Haei | | This training covers general operation of 2D-Stacker-01. Standard PC stacking process will be covered. Users are expected to bring their own stamps as described in SOP. Please contact danial_haie@fas.harvard.edu to schedule. | | | | Training: HAR-053 sputter coater training (online) - Harvard Training Portal | | Trainer: Jules Gardener | This training is for the EMS sputter coater located in the CNS Imaging sample preparation room (LISE B15A). This tool is optimized for coating SEM samples with a thin conductive layer. This coater cannot be used for coating thick (>20nm) films. Pt/Pd and Au coatings are available.
Sputter coater training is available in an online format for these tools. You must pass this online training, and have completed the B15A room safety training (in-person training), before access to the sputter coaters can be granted. Once you have completed these requirements, you will have access to the sputter coater. There is no sign-up required for our online trainings and these can be taken by CNS users at any time. You can access the sputter coater training course at https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/leclassview/dowbt000000000004421
Please copy this URL into your browser to take the training. We recommend using Chrome, Safari or Internet Explorer.
Any CNS User with a HU Key is eligible to take this training | | | | Training: Introduction to TEM using the JEOL F200 SEC - SEC LL2.301-04 150 Western Ave Allston Ma | | Trainer: Adam Graham | In this training you will learn to use the JEOL F200 in TEM mode for basic imaging. More advanced techniques included based on experience level.
This is an individual training which will be schedule upon sign up. Group training can be arranged if multiple members from the same group require training. Individual training is 3 hours group training maybe longer based on number of trainees.
Prerequisite: registered CNS User, and online CNS Introductory TEM Training (CNS) found on the training portal.
Email AGraham@cns.fas.harvard.edu or scheduling. | | | | Training: Online TEM training course - Harvard Training Portal | | Trainer: Jules Gardener | This is a new online training which is required as the first step of TEM training for the JEOL 2100, JEOL F200 and Hitachi 7800 instruments. This training will provide an introduction to TEM concepts and background about our TEMs. You must pass the assessment at the end of this online course before attending an in-person TEM training on the JEOL 2100 or Hitachi 7800 instruments. There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000010142
Any CNS User with a HU Key is eligible to take this training. | | | | Training: RTP-3 AccuThermo Rapid Thermal Processor training - LISE G07 Cleanroom PVD bay (last bay in cleanroom) | | Trainer: Danial Haei | | This Training covers operation and standard baseline process for RTP-3 AccuThermo Rapid Thermal Processor at CNS. Please contact Danial_haie@fas.harvard.edu to schedule. | | | | Training: SEC - AFM Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Bruker JPK NanoWizard 4 XP atomic force microscope (SEC-SPM-13), including mechanical and fluorescence-correlated measurements. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - DLS/Zetasizer Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Malvern Zetasizer Pro for dynamic light scattering and zeta potential measurements. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - DMA Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Mettler Toledo DMA 1 dynamic mechanical analyzer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - DSC Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the TA Discover DSC 250 differential scanning calorimeter. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - Electronic Characterization Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Keithley 4200A and Signatone probe station for electronic device characterization. Capacitor, resistor, transistor, and photovoltaic measurements, among others, are available. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - FTIR Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Nicolet iS50 infrared spectrometer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - Nanoindenter Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Bruker Hysitron TS 77 nanoindenter. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - NMR Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Magritek Spinsolve 80 nuclear magnetic resonance spectrometer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - Optical Profilometer Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Bruker ContourX optical profilometer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - Raman Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Horiba LabRAM Soleil Raman microscope. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - Rheometer Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the TA HR 20 rheometer, including shear, compression, tension, UV curing, and dielectric measurements. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - Tensiometer Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Droplet Lab Tensiometer for surface tension and contact angle measurements. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - TGA Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the TA Discovery TGA 550 thermogravimetric analyzer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - UV-Vis/Fluorescence Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Horiba Duetta UV-vis absorbance/fluorescence (photoluminescence) spectrometer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC FESEM Zeiss Gemini 360 FESEM - SEC LL2.301-03 150 Western Ave Allston Ma | | Trainer: Adam Graham | This training will go over the hands-on portion of the FESEM and will set up your account. If you already have access to the SEMS in Cambridge, I can add your account here please email AGraham@cns.fas.harvard.edu
This is an individual training; group training can be arranged if members from same group require training. individual training is 2 hours group longer based on amount of trainees
CNS Prerequisite: registered CNS User, and online CNS Online SEM Training Module (CNS) found on the training portal.
Email AGraham@cns.fas.harvard.edu or scheduling | | |
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| Training: SEC - DSC Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the TA Discover DSC 250 differential scanning calorimeter. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 3:00 pm
| 2 | 2 | Register! | | | | Training: SEC - Raman Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Horiba LabRAM Soleil Raman microscope. | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 4:00 pm
| 2 | FULL | Register! | | |
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| Training: EE-5 Cooling Stage Training - We meet in the cleanroom, right at the EE-5 system | | Trainer: Ed Macomber | Please read the training description all the way through before signing up.
This training is for the use of the EE-5 Cooling stage only; you need to have the basic EE-5 training and access on the tool prior to signing up for this training. The cooling stage is useful for depositions on PMMA and other resists that can be problematic due to heat building up during the deposition, causing cracking and other problems. We will go through the steps to load a sample on the upper cooling stage, the steps in the recipe set-up, and unloading the sample, including how to leave the system when finished using the cooling stage.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 1:30 pm
(Please review the document links in the email confirmation) | 3 | 2 | Register! | | | | Training: IBE-01 - INTLVAC Nanoquest Ion Beam Etching System - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | IBE-01 - INTLVAC Nanoquest Ion Beam Etching System
training at 3 pm | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:00 pm - 4:00 pm
617-4951738 | 6 | 1 | Register! | | | | Training: Introduction to Dry Etch - Zoom Meeting ID 99096815765, Password: 315648. | | Trainer: Ling Xie | This introduction class is a prerequisite for any RIE tool trainings.
It is one hour online class with Zoom: Meeting ID 99096815765, Password: 315648. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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11:00 am - 12:00 pm
| 12 | 10 | Register! | | | | Training: Ling Xie's office hour for RIE or general fabrication related issues - online Zoom ID 990 9681 5765, Password 315648 | | Trainer: Ling Xie | | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 3:30 pm
| 1 | 1 | Register! | | | | Training: NF-Training Litho. Intro. - Online by Zoom | | Trainer: Bok Yeop Ahn | This is an online training by Zoom, covering CNS lithography tools, policies, and basics of photolithography, e-beam lithography, and 3D laser lithography. Users should take this class before using any tools, including wet benches, spin coaters, and photo- or e-beam lithography tools.
The Zoom link will be sent to attendees on the training date. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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9:30 am - 10:30 am
Online by Zoom | 20 | 18 | Register! | | | | Training: OL-10/11/12 Heidelberg MLA Maskless Aligner Training Part-1 Basic Operation - Inside cleanroom at OL-10 | | Trainer: Haojie Ji | | Part-1, group training. Training covers OL-10, OL-11 and OL-12. One more certificate session needed for full access. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 4:30 pm
| 3 | 2 | Register! | | | | Training: RIE-17 - Plasma Therm VERSALINE Etching System - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | RIE-17 - Plasma Therm VERSALINE Etching System tool training at 2 pm.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
617-495-1738 | 6 | 6 | Register! | | | | Training: SEM-10, Hitachi SU8230 SEM - At the tool in the cleanroom | | Trainer: Bok Yeop Ahn | This is a training session for HITACHI SU8230 SEM in cleanroom at CNS. Listed below, please complete the prerequisites trainings before coming to this SEM-10 tool training.
- LISE Cleanroom Orientation
- CNS Online SEM Training Module (Online course): https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/leclassview/dowbt-00008486
The training starts at the tool in the photolithography bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
| 3 | 3 | Register! | | | | Training: Zeiss Gemini 560 SEM Training - LISE B15i | | Trainer: Tim Cavanaugh | | This is a training session on the Zeiss Gemini 560 FESEM for users who have not previously used Zeiss SEM tools at CNS. The Gemini 560 offers the capability for ultra high resolution imaging at low beam energy. This will be an in-depth training session covering all aspects of the hardware and software and the entire imaging process. Please attend this training for access to SEM-13 and/or SEM-14. Users should complete the pre-requisite Part 1 Online training prior to registering for this event. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 4:00 pm
| 4 | 2 | Register! | | |
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| Training: Cypher S/ES and MFP3d BiO Atomic Force Microscopy (AFM) Training (SPM-2 & 6) - LISE B58 | | Trainer: Jason Tresback | | This training event will focus on the basic imaging and operation of the Cypher S/ES and/or MFP3D BiO AFM’s available at CNS (SPM- 2 and 6). Starting from the basic principles of AFM, users will also learn about cantilever selection and installation, different imaging modes, image quality improvement, and data processing and analysis methods. The Cypher AFM (SPM-6) is suitable for small samples (up to 15mm) and has a small scan range (30x30x5um). AFM probes are provided for training; however, users must supply their own probes during independent use. Full independent tool access requires completion of part-1 basic imaging and operation demonstrated by staff, followed by part-2 individual user assisted session that serves as a qualification for independent use on another day. We will meet in the hallway outside LISE B58 | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 4:30 pm
| 3 | 2 | Register! | | | | Training: Electrical Property Measurement of Devices and Thin films Inside Nanofabrication Cleanroom - Inside Nanofabrication Cleanroom LISE-G07 (cleanroom-metrology bay) | | Trainer: Jason Tresback | | This Metrology for Nanofabrication training event will focus on the fundamental measurement tools for electrical property measurements and device characterization inside the Nanofabrication Cleanroom. The most common test is an I-V curve using Semiconductor Parameter Analyzer w/ Signatone 4-Pt Probe Station (Agilent b1500 & Signatone 4PP) (PB-1 & CE-4). Up to 5 probe arms are available to characterize thin films and devices. Sheet resistance (Rs) mapping (4PP Sheet Resistance Mapper) (MET-39) can be used to characterize thickness uniformity of conductive films and dopant uniformity of s/c wafers | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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12:00 pm - 1:00 pm
| 3 | 2 | Register! | | | | Training: Metrology for Nanofabrication (Stylus Profilometer, Reflectometer, and Ellipsometer) - Inside Nanofabrication Cleanroom LISE-G07 (cleanroom-metrology bay) | | Trainer: Jason Tresback | | The Metrology for Nanofabrication training event will focus on fundamental measurement tools for thin film characterization including contact/stylus surface Profilometer (Dektak XT) (PL-8 & 11), multi-wavelength scanning Ellipsometer (FS-150XY) (ES-3), and Reflectometer (F50-UVX) (MET-35). Full independent access to these tools listed above will be provided after the training, however the amount of time spent on each tool will vary based on participants. We meet inside the Cleanroom gowning area or within the Metrology Bay inside the CNS cleanroom (G07). | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:30 am - 12:00 pm
| 3 | FULL | Register! | | | | Training: NF-06 Wet Bench and Chemical Safety Training - Location: G07 in the gowning room | | Trainer: Bok Yeop Ahn | This training covers general operations of all wet benches including spin coating, developing, acid, and wet processing benches as well as chemical safety policies in the cleanroom. All users must complete this training before using any wet benches in the cleanroom. Listed below please complete the prerequisite trainings before coming to this wet bench and chemical safety training.
- LISE Cleanroom Orientation
- NF-Training Litho. Intro.
Let’s meet in the Gouging Room at 1pm. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 2:00 pm
| 4 | 3 | Register! | | | | Training: OL-4 - SUSS MA6 Mask Aligner - At the tool in the photo bay | | Trainer: Bok Yeop Ahn | This is a training session for MA6 Mask Aligner in the cleanroom. Listed below please complete the prerequisites before getting this training.
- LISE Cleanroom Orientation
- NF-Training Litho. Intro.
- NF-06 Wet Bench and Chemical Safety Training
The training starts at the tool in the photolithography bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:00 pm - 4:00 pm
| 4 | 4 | Register! | | | | Training: RIE 11 PlasmaTherm Diamond Etcher Training - LISE G07 CNS Cleanroom at Wet-etch Bay | | Trainer: Ling Xie | RIE-11 Plasma-Therm Diamond Etcher
1. Introduction
The RIE-11 PT Versaline RIE is an Inductive Coupled Plasma Etching System with a maximum ICP source power of 1,200 W and a maximum substrate bias power of 600 W. The system is configured to handle 4” wafers and equipped with mechanical clamping and backside helium cooling features. Its substrate temperature can be controlled from 10°C to180°C. In addition, temperatures of three other components inside the chamber can also be controlled from 20°C to 180°C, including Lid, Ceramic Spool, and Metal Liner. Setting these components at elevated temperatures before processing will reduce by-product coating speed on chamber walls and stabilize chamber conditions for the first couple of runs after the tool was at a stand-by state for a long time.
2. Application
This RIE is only applied to diamond etch and all other materials are forbidden.
3. Contacts
For etching process development and training, please contact Ling Xie; for issues related to equipment, please contact Steve Paolini and David LaFleur.
Ling Xie: 6-9069 lxie@cns.fas.harvard.edu;
David LaFleur: 5-5024 dlafleur@cns.fas.harvard.edu
| | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 2:00 pm
| 4 | 3 | Register! | | | | Training: RIE 16 Sentech Diamond Etcher Training - LISE G07 CNS Cleanroom at Wet-etch Bay | | Trainer: Ling Xie | Sentech SI 500 ICP Plasma Etcher
Sentech SI 500 is featured with a planar inductively coupled plasma source PTSA 200. The PTSA source is a unique feature of SENTECH high end plasma process systems. The PTSA source generates homogeneous plasma with high ion density (up to 5*1011 cm-3 in argon plasma) and low ion energy distribution. It features high coupling efficiency and very good ignition behavior for processing of a large variety of materials and structures. Due to the low ion energy distribution, low damage etching and nano structuring can be performed at low pressures.
• PTSA 200 ICP Source:
o RF power range: 100 W – 2000 W.
o Process pressure range: 0.2 Pa – 100 Pa
o Plasma density: up to 5*1011 cm3
o Electron temperature: ~2 eV
o Minimum ion energy: 10 eV (Ar plasma)
• Substrate electrode:
o RF power range: 20 W - 600 W, switched with pre-selection and control of forward power or bias voltage.
o Wafer carrier diameter: 150 mm, maximum sample height 9 mm.
o Electrode temperature range: -20 C - +350 C.
• Software controlled distance between PTSA source and substrate electrode from 80 mm to 120 mm (without spacer).
• Available gases and maximum flow rate:
o O2: 198 sccm
o Ar: 145 sccm
o Cl2: 86 sccm
• Reactor body heating up to 60 C.
• Etch material: diamond only.
For training, please contact Ling Xie, lxie@cns.fas.harvard.edu;
For hardware related issues, please contact David LaFleur, dlafleur@cns.fas.harvard.edu.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:30 pm
| 4 | 2 | Register! | | | | Training: SC-5 - Cleanroom Headway Spinner Training - Negative station in the photo bay | | Trainer: Bok Yeop Ahn | This training session covers the standard operation procedure (SOP) for spin coaters in the cleanroom. Listed below please complete the prerequisites before coming to the spin coater training.
- LISE Cleanroom Orientation
- NF-Training Litho. Intro.
- NF-06 Wet Bench and Chemical Safety Training
The training starts at the negative resist coating bench in the photolithography bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: Thermo Scientific XPS Training - LISE G27 | | Trainer: Hao-Yu (Greg) Lin | | Spring 2026 | | Time | Max Attendees | Available | CNS Users ONLY |
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1:30 pm - 3:30 pm
| 4 | 4 | Register! | | | | Training: WB-2 EVG 501 Wafer Bonder Training - Inside cleanroom at WB-2 | | Trainer: Haojie Ji | | One group training session for full tool access. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:30 am - 11:30 am
| 3 | 2 | Register! | | |
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| Training: CNS orientation G07 LISE access - G07 | | Trainer: John Tsakirgis | | To understand safety and operational protocols | | Time | Max Attendees | Available | CNS Users ONLY |
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9:00 am - 10:30 am
please meet in front of G07 | 10 | 8 | Register! | | | | Training: DOE-1 - ULVAC Deep Oxide Etcher - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | | DOE-1 - ULVAC Deep Oxide Etcher tool training at 3:30 pm | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:30 pm - 4:30 pm
617-495-1738 | 5 | 4 | Register! | | | | Training: Introduction to Thin Film Processing - Rm G28 | | Trainer: Mughees Khan | Many kinds of thin films are used to fabricate discrete devices and ICs, including thermal oxides, dielectric layers, polycrystalline silicon, and metal films. This is an introductory session about Thin Film Processing, and it will provide users a basic understanding about this area of micro/nanofabrication along with available tools and capabilities at CNS.
Prerequisite for ALL Thin Film Equipment trainings (HT Anneals + PVD + CVD/ALD) | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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9:00 am - 11:00 am
| 10 | 8 | Register! | | | | Training: RIE-12 - Matrix Plasma Asher - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | | RIE-12 - Matrix Plasma Asher tool training at 3:00 pm. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:00 pm - 3:30 pm
617-495-1738 | 6 | 5 | Register! | | | | Training: RIE-19 and RIE-14- Anatech SCE-106 Barrel Plasma System/Samco PC-300 Plasma Cleaning System - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | | Tool training for two tools:RIE-19 and RIE-14- Anatech SCE-106 Barrel Plasma System/Samco PC-300 Plasma Cleaning System | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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4:30 pm - 5:00 pm
617-495-1738 | 7 | 7 | Register! | | |
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| Training: SP-7 AJA UHV Sputter System Training - G-27 | | Trainer: Yumian Zhu | - PLEASE READ THE WHOLE TRAINING DESCRIPTION BEFORE SIGNING UP –
If you need to deposit a film thicker than 1000nm, please contact the staff before signing up.
SP-7 is a Hybrid PVD system includes Sputtering and E-beam system. This training is for the sputtering part. SP-7 is dedicated to the superconductive material deposition and application. No outgassing, organic substance, such as photoresist, PDMs, etc allow in the system. Venting chamber is not allowed in this tool. CNS will provide Nb, NbN, NbTi, MoRe, Aluminum targets. The system has two RF source, one 2” gun maximum power 300W, 30o to the substrate; one 3” gun maximum power 600W, vertical to the substrate. The substrate holder can accommodate 4” and 6” sample carrier. But the substrate heater is only suitable for 4” carrier. Do not apply heater function when you are using the 6” carrier. If user needs help, please contact the CNS staffs.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:30 pm
(check document links in confirmation email) | 4 | 4 | Register! | | |
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| Training: AB-2 RAC Clean Wet Process Station - Acid bench in the cleanroom | | Trainer: Bok Yeop Ahn | This training covers the standard operation procedure for the RCA cleaning at the acid wet benches. Listed below please complete the prerequisites before coming to this training session.
- LISE Cleanroom Orientation
- NF-06 Wet Bench and Chemical Safety Training
This training starts at the acid benches in the cleanroom. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 2:00 pm
| 3 | 3 | Register! | | | | Training: ALD-3 PdR ALD System Training - PVD Bay (last bay in cleanroom); small red and white instrument on the far wall | | Trainer: Mughees Khan | | This training provides users the protocols needed to operate the ALD-3 benchtop thermal ALD system. This system is primarily used for depositing Al2O3, SiO2 and Pt thin films on 4" substrates or 3D objects up to 8mm in height. The tool is capable of 40C deposition of Al2O3 and down to 100C for SiO2 and 125C for Pt. Both the SiO2 and Pt processes utilize Ozone as the counter reactant. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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9:00 am - 10:00 am
Prerequisite: Introduction to Thin Film Growth and Processing | 2 | 2 | Register! | | | | Training: FIB 4 Helios Dual-Beam FIBSEM Training - LISE B15F | | Trainer: Austin Akey | | Basic introductory training on the FEI Helios 660 DB FIB/SEM. Covers basic instrument operation for cross-section milling and imaging. Advanced applications upon request. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 5:00 pm
| 3 | 2 | Register! | | | | Training: Ling Xie's office hour for RIE or general fabrication related issues - online Zoom ID 990 9681 5765, Password 315648 | | Trainer: Ling Xie | | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 3:30 pm
| 1 | 1 | Register! | | | | Training: LPCVD and APCVD Training (CVD 5,6,7,9,10,11) - Cleanroom Dry Processing Bay | | Trainer: Mughees Khan | | Introduction to Thin Film Growth and Processing is required before you can sign up for this training. Users will learn about LPCVD (CVD6-SiNx, CVD7-Poly, CVD11-TEOS) and APCVD (CVD10-ThOx, CVD9-Metal Anneal, CVD5-Non-Metal Anneal) capabilities and associated protocols at CNS. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:00 am - 12:00 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 2 | 1 | Register! | | | | Training: OL-10/11/12 Heidelberg MLA Maskless Aligner Training Part-1 Basic Operation - Inside cleanroom at OL-10 | | Trainer: Haojie Ji | | Part-1, group training. Training covers OL-10, OL-11 and OL-12. One more certificate session needed for full access. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 4:30 pm
| 3 | 3 | Register! | | | | Training: RIE 8 STS ICP RIE Training - LISE G07 CNS Cleanroom at Dry Process Bay | | Trainer: Ling Xie | It is required to take the "Introduction to Dry Etching" before this training.
The RIE 8 is used to etch silicon, silicon oxide, silicon nitride, silicon carbide, and 2D materials.
Chamber Pre-Cleaning and Conditioning are Required: Before etching any samples, users must run the �O2-Clean� recipe for 20 minutes and the recipe to be used for 5-10 minutes.
The STS MPX/LPX RIE system is an Inductively Coupled Plasma (ICP) etching system. Using the ICP technology, this RIE is characterized with high plasma density, low operating pressure, high etch rate, excellent etch uniformity, and low energy ion damage. Available etching gases on this system include SF6, C4F8, O2, H2, Ar, Cl2, BCl3, and HBr. The maximum coil and platen powers are 1200W and 250W, respectively. Equipped with a chiller, the MPX/LPX system allows the substrate temperature to be controlled from 15�C to 30�C. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 2:30 pm
| 4 | 3 | Register! | | | | Training: SEM-10, Hitachi SU8230 SEM - At the tool in the cleanroom | | Trainer: Bok Yeop Ahn | This is a training session for HITACHI SU8230 SEM in cleanroom at CNS. Listed below, please complete the prerequisites trainings before coming to this SEM-10 tool training.
- LISE Cleanroom Orientation
- CNS Online SEM Training Module (Online course): https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/leclassview/dowbt-00008486
The training starts at the tool in the photolithography bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
| 3 | 3 | Register! | | | | Training: Thermal ALD Training (ALD 1 & ALD 4) - CNS Cleanroom - Wet Processing Bay | | Trainer: Mughees Khan | | The Cambridge Nanotech’s Savannah thermal ALD tools are the most common thermal ALD systems in university cleanrooms. ALD1 & ALD4 can hold substrates of different sizes up to 200mm and are equipped with heated precursor lines. Depositions can take place from 100C to 250C with rates in the range of 1-5 Å per minute, but high-aspect-ratio fill is achievable. These systems are used for depositing the following films: Al2O3, HfO2, TiO2, SiOx (cvd-like process w/ trace amounts of Al), ZnO, AZO, ZrO2 | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 2:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 3 | 2 | Register! | | | | Training: uXRF Training - Atlas XRF (X-Ray Fluorescence Spectrometer) - B15E - Meet outside Imaging Suite (on the sofas) | | Trainer: Mac Hathaway | | Training for the mapping XRF/uXRF Atlas system from iXRF. Users will learn the basics of X-Ray Fluorescence Spectroscopy and the use of the mapping XRF. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:30 pm - 3:00 pm
| 3 | 3 | Register! | | | | Training: Woollam RC2 Spectroscopic Ellipsometer Training (ES-4) - Inside Nanofabrication Cleanroom LISE-G07 (cleanroom-metrology bay) | | Trainer: Jason Tresback | | This training event will cover the basic operation of RC2 spectroscopic ellipsometer to characterize transparent thin films. We begin with sample mounting and alignment, single point measurements, model fitting, and mapping with the option to use a small spot size (125um). The system has a wavelength range of 200-2500nm. We will meet inside the Nanofabrication cleanroom along the windows | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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11:00 am - 12:00 pm
| 3 | 3 | Register! | | | | Training: XeF2 Etcher Training - | | Trainer: Ling Xie | | Etch Si with a high selectivity to SiO2, Si3N4, Resist. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:30 pm - 3:30 pm
| 4 | 4 | Register! | | |
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| Training: RIE-13 - Oxford PlasmaPro 100 Cobra 300 - In front of the tool inside cleanroom | | Trainer: Kenlin Huang | | RIE-13 - Oxford PlasmaPro 100 Cobra 300 training at 3pm. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:00 pm - 4:00 pm
617-495-1738 | 5 | 5 | Register! | | | | Training: CVD-14 Oxford ICP-CVD - Low Temp - CNS cleanroom - Dry processing bay at CVD-14 | | Trainer: Mughees Khan | | Introduction to Thin Film Growth and Processing is required before you can sign up for training. This training will enable users to grow high quality SiO2, SiNx, and a-Si films. No doping or active cooling is available on this tool. All baseline processes are at 80C with the exception of a-Si, which runs at 200C. Full temperature range is from -20C to 400C. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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11:00 am - 12:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 3 | 1 | Register! | | | | Training: CVD-3 STS PECVD - CNS Cleanroom - Dry processing bay | | Trainer: Mughees Khan | This training will provide users the necessary protocol to deposit high quality SiO2, SiNx, and a:Si films at temperatures from ~200 to 350C. a-Si films can also be doped with B or P.
This tool is equipped with two RF generators, one at 13.56MHz (High frequency, HF recipes) and 380 kHz (low frequency, LF recipes). There are also recipes that take advantage of both RF generators to yield films with lower stress esp. silicon nitride films. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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9:00 am - 11:00 am
Prerequisite: Introduction to Thin Film Growth and Processing | 3 | 2 | Register! | | | | Training: Electrical Property Measurement of Devices and Thin films Inside Nanofabrication Cleanroom - Inside Nanofabrication Cleanroom LISE-G07 (cleanroom-metrology bay) | | Trainer: Jason Tresback | | This Metrology for Nanofabrication training event will focus on the fundamental measurement tools for electrical property measurements and device characterization inside the Nanofabrication Cleanroom. The most common test is an I-V curve using Semiconductor Parameter Analyzer w/ Signatone 4-Pt Probe Station (Agilent b1500 & Signatone 4PP) (PB-1 & CE-4). Up to 5 probe arms are available to characterize thin films and devices. Sheet resistance (Rs) mapping (4PP Sheet Resistance Mapper) (MET-39) can be used to characterize thickness uniformity of conductive films and dopant uniformity of s/c wafers | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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12:00 pm - 1:00 pm
| 3 | 3 | Register! | | | | Training: Jupiter XR Atomic Force Microscopy (AFM) Training (SPM-12) Inside the Nanofabrication Cleanroom - Inside Nanofabrication Cleanroom LISE-G07 (cleanroom-metrology bay) | | Trainer: Jason Tresback | | This training event will focus on the basic imaging and operation of the Jupiter XR AFM available inside the Nanofabrication Cleanroom (SPM-12). Starting from the basic principles of AFM, users will also learn about cantilever selection and installation, different imaging modes, image quality improvement, and data processing and analysis methods. The Jupiter AFM (SPM-12) is for large samples up to 200mm and large scan range (100x100x12um). AFM probes are provided for training; however, users must supply their own probes during independent use. Full independent tool access requires completion of part-1 basic imaging and operation demonstrated by staff, followed by part-2 individual user assisted session that serves as a qualification for independent use on another day. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:00 pm - 4:30 pm
| 3 | FULL | Register! | | | | Training: Metrology for Nanofabrication (Stylus Profilometer, Reflectometer, and Ellipsometer) - Inside Nanofabrication Cleanroom LISE-G07 (cleanroom-metrology bay) | | Trainer: Jason Tresback | | The Metrology for Nanofabrication training event will focus on fundamental measurement tools for thin film characterization including contact/stylus surface Profilometer (Dektak XT) (PL-8 & 11), multi-wavelength scanning Ellipsometer (FS-150XY) (ES-3), and Reflectometer (F50-UVX) (MET-35). Full independent access to these tools listed above will be provided after the training, however the amount of time spent on each tool will vary based on participants. We meet inside the Cleanroom gowning area or within the Metrology Bay inside the CNS cleanroom (G07). | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:30 am - 12:00 pm
| 3 | 3 | Register! | | | | Training: NF-06 Wet Bench and Chemical Safety Training - Location: G07 in the gowning room | | Trainer: Bok Yeop Ahn | This training covers general operations of all wet benches including spin coating, developing, acid, and wet processing benches as well as chemical safety policies in the cleanroom. All users must complete this training before using any wet benches in the cleanroom. Listed below please complete the prerequisite trainings before coming to this wet bench and chemical safety training.
- LISE Cleanroom Orientation
- NF-Training Litho. Intro.
Let’s meet in the Gouging Room at 1pm. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: Nikon Micro-CT Training - LISE G27 | | Trainer: Hao-Yu (Greg) Lin | | Spring 2026 | | Time | Max Attendees | Available | CNS Users ONLY |
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1:30 pm - 3:30 pm
| 4 | 3 | Register! | | | | Training: OL-4 - SUSS MA6 Mask Aligner - At the tool in the photo bay | | Trainer: Bok Yeop Ahn | This is a training session for MA6 Mask Aligner in the cleanroom. Listed below please complete the prerequisites before getting this training.
- LISE Cleanroom Orientation
- NF-Training Litho. Intro.
- NF-06 Wet Bench and Chemical Safety Training
The training starts at the tool in the photolithography bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:00 pm - 4:00 pm
| 4 | 4 | Register! | | | | Training: Optical Profiler Training (PL-6) - Inside Nanofabrication Cleanroom LISE-G07 (cleanroom-metrology bay) | | Trainer: Jason Tresback | | This training event will cover basic operation of the Optical Profiler (CCI HD) (PL-6) which uses white light interferometry (WLI) to measure roughness, topography, and step-heights with sub-nm vertical resolution and 1-3um lateral resolution. This is a rapid, non-contact, and non-destructive technique to analyze small area (80x80 um) and large area (100x100 mm). Limitations include thin, transparent films and dissimilar materials. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
| 3 | 3 | Register! | | | | Training: RIE 10 Rapier DRIE Training - The first hour training is online, Zoom ID 990 9681 5765, passcode 315648, held outside the cleanroom and the rest of time is inside the cleanroom at the tool. | | Trainer: Ling Xie | It is required to take the "Introduction to Dry Etching" before this training.
The first hour training is online, Zoom ID 990 9681 5765, passcode 315648.
The SPTS Rapier system is for deep silicon etch only, it is configured with dual plasma sources, dual gas inlets, electro-static clamping chuck, AMS chiller to control the chuck temperature from -15�C to + 40�C, and Claritas end-point detector.
Specifications
� Etch rate: 1.0 � 10 �m/min
� Aspect ratio: 5 � 50
� Etch depth: 5�m � several hundreds of microns
� Feature size: nm � mm scales in lateral dimension
� Sider wall roughness (scallop depth): 6nm � 700nm
� Sample size ≤ 6�
� Etch mask: only resists and SiO2 allowed
The first hour training is online, Zoom ID 990 9681 5765, passcode 315648. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 3:30 pm
| 4 | 4 | Register! | | | | Training: SC-5 - Cleanroom Headway Spinner Training - Negative station in the photo bay | | Trainer: Bok Yeop Ahn | This training session covers the standard operation procedure (SOP) for spin coaters in the cleanroom. Listed below please complete the prerequisites before coming to the spin coater training.
- LISE Cleanroom Orientation
- NF-Training Litho. Intro.
- NF-06 Wet Bench and Chemical Safety Training
The training starts at the negative resist coating bench in the photolithography bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: Sharon TE-3, 4, and 5 Thermal Evaporator Training - LISE G07 (CNS Cleanroom), PVD Bay | | Trainer: Ed Macomber | Please read the whole training description all the way through
For films thicker than 0.5um, contact CNS staff
This is a training for TE-3, 4 and 5 for thermal evaporation of metals. We meet promptly at the system in the CNS cleanroom PVD bay. To attend this training, you need to be able to show up at the time indicated and stay for the whole training. Plan on about 1.5 hours for this training. Venting, loading a sample, pumping and evaporation are performed and explained. For these TE systems, users supply their own deposition materials and boats (sources). CNS supplies the materials for training. After this training you will have access to all 3 systems, which are collectively capable of depositing: Ti, Cr, Cu, Ag, Au, Al, Ni, etc. Check the links in the confirmation email for important attachments including the S.O.P. Please review the SOP before the training.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 2:30 pm
(Please review document links in email confirmation) | 3 | 3 | Register! | | | | Training: SP-3 AJA sputtering system training for 3-gun system - CNS cleanroom (G 07) Dry Bay | | Trainer: Yumian Zhu | Please read the training description all the way through.
If you need to deposit a film thicker than 500nm, please contact the staff before signing up.
This training is for standard operating procedure of SP-3 sputtering system. The system has one RF source and two DC sources (DC power supply is switchable between the two sources).The substrate holder can accommodate up to a 4” diameter wafer. SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with one RF and one DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their own schedule. After 3 uses (with no problems) users are given 24/7 access.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 4:00 pm
(check document links in confirmation email) | 3 | 3 | Register! | | | | Training: SW-6 PELCO LatticeAX 420 Sample Cleaving System Training - LISE-G27 | | Trainer: Haojie Ji | | One group training session for full tool access. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:30 am - 11:30 am
| 3 | 3 | Register! | | | | Training: WB-3/4 Wedge and Ball Wire Bonders Training Part-1 Basic Operation - LISE-G27 | | Trainer: Haojie Ji | | Part-1, group training. Introduce WB-3 Al wedge bond and WB-4 Au ball bond. One more certificate session needed for full access. | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 4:30 pm
| 3 | 3 | Register! | | |
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| Training: ALD-2 GEMStar ALD Training - Wet Processing Bay - CNS cleanroom | | Trainer: Mughees Khan | | This training introduces users protocols needed to operate ALD-2. This system is primarily used for depositing conducting metal nitride and potentially pure metal films with good uniformity, conformality, and material purity. Deposition rates are slow, in the range of 1-3 � per minute, but extremely high-aspect-ratio fill (40:1) is easily achievable. Currently, only WNx is available. In addition, Al2O3 can also be deposited on this tool. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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9:00 am - 10:00 am
Prerequisite: Introduction to Thin Film Growth and Processing | 2 | 2 | Register! | | | | Training: CNS orientation G07 LISE access - G07 | | Trainer: John Tsakirgis | | To understand safety and operational protocols | | Time | Max Attendees | Available | CNS Users ONLY |
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9:00 am - 10:30 am
please meet in front of G07 | 10 | 10 | Register! | | | | Training: SW-5 Disco Dicing Saw Training Part-1 Basic Operation - LISE-G06 | | Trainer: Haojie Ji | Part-1, group training. One more certificate session needed for full access.
User will also need to take G06 room safety orientation to have room access. | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 4:30 pm
| 3 | 1 | Register! | | | | Training: Zeiss Gemini 360 SEM Training - LISE B15i | | Trainer: Tim Cavanaugh | | | Time | Max Attendees | Available | CNS Users ONLY |
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10:00 am - 1:00 pm
| 4 | 4 | Register! | | |
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| Training: B15A Sample Prep Training - LISE B15A | | Trainer: Cathleen Hallinan | | The sample prep room training will go over general equipment, consumables provided and safety orientation for the lab. | | Time | Max Attendees | Available | CNS Users ONLY |
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11:00 am - 12:00 pm
meet by the couches on the basement level | 6 | 6 | Register! | | | | Training: SP-7 AJA E-Beam System Training - G-27 | | Trainer: Yumian Zhu | - PLEASE READ THE WHOLE TRAINING DESCRIPTION BEFORE SIGNING UP –
If you need to deposit a film thicker than 500nm, please contact the staff before signing up.
SP-7 is a Hybrid PVD system includes Sputtering and Ebeam system. This training is for the E-beam part. SP-7 is dedicated to the superconductive material deposition and application. No outgassing, organic substance, such as photoresist, PDMs, etc… allow in the system. The system has 6 pockets that can carry 6 different materials. Currently the system can use aluminum, titanium, niobium. Venting chamber is not allowed in this tool. CNS will provide the materials. The tool has two size of sample carrier, 4” and 6”. But the substrate heater is only suitable for 4” carrier. Do not apply heater function when you are using the 6” carrier. If user needs help, please contact the CNS staffs.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:30 pm
(check document links in confirmation email) | 4 | 3 | Register! | | |
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| Training: Introduction to Dry Etch - Zoom Meeting ID 99096815765, Password: 315648. | | Trainer: Ling Xie | This introduction class is a prerequisite for any RIE tool trainings.
It is one hour online class with Zoom: Meeting ID 99096815765, Password: 315648. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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11:00 am - 12:00 pm
| 12 | 12 | Register! | | | | Training: Ling Xie's office hour for RIE or general fabrication related issues - online Zoom ID 990 9681 5765, Password 315648 | | Trainer: Ling Xie | | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 3:30 pm
| 1 | 1 | Register! | | | | Training: NF-Training Litho. Intro. - Online by Zoom | | Trainer: Bok Yeop Ahn | This is an online training by Zoom, covering CNS lithography tools, policies, and basics of photolithography, e-beam lithography, and 3D laser lithography. Users should take this class before using any tools, including wet benches, spin coaters, and photo- or e-beam lithography tools.
The Zoom link will be sent to attendees on the training date. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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9:30 am - 10:30 am
Online by Zoom | 20 | 20 | Register! | | | | Training: OL-10/11/12 Heidelberg MLA Maskless Aligner Training Part-1 Basic Operation - Inside cleanroom at OL-10 | | Trainer: Haojie Ji | | Part-1, group training. Training covers OL-10, OL-11 and OL-12. One more certificate session needed for full access. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 4:30 pm
| 3 | 3 | Register! | | | | Training: RIE-17 - Plasma Therm VERSALINE Etching System - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | RIE-17 - Plasma Therm VERSALINE Etching System tool training at 2 pm.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
617-495-1738 | 6 | 6 | Register! | | | | Training: SEM-10, Hitachi SU8230 SEM - At the tool in the cleanroom | | Trainer: Bok Yeop Ahn | This is a training session for HITACHI SU8230 SEM in cleanroom at CNS. Listed below, please complete the prerequisites trainings before coming to this SEM-10 tool training.
- LISE Cleanroom Orientation
- CNS Online SEM Training Module (Online course): https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/leclassview/dowbt-00008486
The training starts at the tool in the photolithography bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
| 3 | 3 | Register! | | |
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| Training: Cypher S/ES and MFP3d BiO Atomic Force Microscopy (AFM) Training (SPM-2 & 6) - LISE B58 | | Trainer: Jason Tresback | | This training event will focus on the basic imaging and operation of the Cypher S/ES and/or MFP3D BiO AFM’s available at CNS (SPM- 2 and 6). Starting from the basic principles of AFM, users will also learn about cantilever selection and installation, different imaging modes, image quality improvement, and data processing and analysis methods. The Cypher AFM (SPM-6) is suitable for small samples (up to 15mm) and has a small scan range (30x30x5um). AFM probes are provided for training; however, users must supply their own probes during independent use. Full independent tool access requires completion of part-1 basic imaging and operation demonstrated by staff, followed by part-2 individual user assisted session that serves as a qualification for independent use on another day. We will meet in the hallway outside LISE B58 | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 4:30 pm
| 3 | 2 | Register! | | | | Training: Denton E-beam Evaporator (EE-4) training - LISE G07 (cleanroom); PVD Bay | | Trainer: Yumian Zhu | Please read the training description all the way through.
For depositions thicker than 0.5 micron, contact CNS staff before signing up for the training.
In this training, the use of the Denton EE-4 e-beam system for thin film metal deposition is covered by going through a standard deposition procedure from beginning to end. EE-4 is fully automated and can deposit the following materials: Ag, Ti, Cr, Pd. For Au, Pt, user need to bring their own materials and crucible. CNS staff will provide the training on how to install/remove their Au, Pt crucible from the tool. Please be aware that these listed materials are all that can be done in EE-4 at this time; the materials do not change. Thickness accuracy: a recent (10/2024) measurement showed a deposited (on the controller) thickness of 800Å to yield actual (measured with reflectometry) 785Å and 769Å on two samples using planetary substrate holder and 105% tooling factor. Denton states uniformity over a 4” wafer for this system can be expected to be within 5%. This system can accommodate up to (1) 6” wafer or (3) 4” wafers. There is no substrate cooling.
We use a test sample for a quick deposition, which is all that's required for the training. Plan on ~1 hr for this training. We meet promptly right at the machine in the LISE CR PVD Bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
(check document links in confirmation email) | 4 | 3 | Register! | | | | Training: EL-6 and EL-7 training - EL-7 room | | Trainer: Yuan Lu | | EL-6 and EL-7 training | | Time | Max Attendees | Available | CNS Users ONLY |
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11:00 am - 2:00 pm
| 6 | 6 | Register! | | | | Training: Electrical Property Measurement of Devices and Thin films Inside Nanofabrication Cleanroom - Inside Nanofabrication Cleanroom LISE-G07 (cleanroom-metrology bay) | | Trainer: Jason Tresback | | This Metrology for Nanofabrication training event will focus on the fundamental measurement tools for electrical property measurements and device characterization inside the Nanofabrication Cleanroom. The most common test is an I-V curve using Semiconductor Parameter Analyzer w/ Signatone 4-Pt Probe Station (Agilent b1500 & Signatone 4PP) (PB-1 & CE-4). Up to 5 probe arms are available to characterize thin films and devices. Sheet resistance (Rs) mapping (4PP Sheet Resistance Mapper) (MET-39) can be used to characterize thickness uniformity of conductive films and dopant uniformity of s/c wafers | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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12:00 pm - 1:00 pm
| 3 | 3 | Register! | | | | Training: FCB-2 Finetech Sigma Flip Chip Bonder Training Part-1 Basic Operation - LISE-G27 | | Trainer: Haojie Ji | | Part-1, group training. One more certificate session needed for full access. | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 4:30 pm
| 3 | 2 | Register! | | | | Training: Metrology for Nanofabrication (Stylus Profilometer, Reflectometer, and Ellipsometer) - Inside Nanofabrication Cleanroom LISE-G07 (cleanroom-metrology bay) | | Trainer: Jason Tresback | | The Metrology for Nanofabrication training event will focus on fundamental measurement tools for thin film characterization including contact/stylus surface Profilometer (Dektak XT) (PL-8 & 11), multi-wavelength scanning Ellipsometer (FS-150XY) (ES-3), and Reflectometer (F50-UVX) (MET-35). Full independent access to these tools listed above will be provided after the training, however the amount of time spent on each tool will vary based on participants. We meet inside the Cleanroom gowning area or within the Metrology Bay inside the CNS cleanroom (G07). | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:30 am - 12:00 pm
| 3 | 3 | Register! | | | | Training: NF-06 Wet Bench and Chemical Safety Training - Location: G07 in the gowning room | | Trainer: Bok Yeop Ahn | This training covers general operations of all wet benches including spin coating, developing, acid, and wet processing benches as well as chemical safety policies in the cleanroom. All users must complete this training before using any wet benches in the cleanroom. Listed below please complete the prerequisite trainings before coming to this wet bench and chemical safety training.
- LISE Cleanroom Orientation
- NF-Training Litho. Intro.
Let’s meet in the Gouging Room at 1pm. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: OL-4 - SUSS MA6 Mask Aligner - At the tool in the photo bay | | Trainer: Bok Yeop Ahn | This is a training session for MA6 Mask Aligner in the cleanroom. Listed below please complete the prerequisites before getting this training.
- LISE Cleanroom Orientation
- NF-Training Litho. Intro.
- NF-06 Wet Bench and Chemical Safety Training
The training starts at the tool in the photolithography bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:00 pm - 4:00 pm
| 4 | 4 | Register! | | | | Training: RIE 11 PlasmaTherm Diamond Etcher Training - LISE G07 CNS Cleanroom at Wet-etch Bay | | Trainer: Ling Xie | RIE-11 Plasma-Therm Diamond Etcher
1. Introduction
The RIE-11 PT Versaline RIE is an Inductive Coupled Plasma Etching System with a maximum ICP source power of 1,200 W and a maximum substrate bias power of 600 W. The system is configured to handle 4” wafers and equipped with mechanical clamping and backside helium cooling features. Its substrate temperature can be controlled from 10°C to180°C. In addition, temperatures of three other components inside the chamber can also be controlled from 20°C to 180°C, including Lid, Ceramic Spool, and Metal Liner. Setting these components at elevated temperatures before processing will reduce by-product coating speed on chamber walls and stabilize chamber conditions for the first couple of runs after the tool was at a stand-by state for a long time.
2. Application
This RIE is only applied to diamond etch and all other materials are forbidden.
3. Contacts
For etching process development and training, please contact Ling Xie; for issues related to equipment, please contact Steve Paolini and David LaFleur.
Ling Xie: 6-9069 lxie@cns.fas.harvard.edu;
David LaFleur: 5-5024 dlafleur@cns.fas.harvard.edu
| | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: RIE 16 Sentech Diamond Etcher Training - LISE G07 CNS Cleanroom at Wet-etch Bay | | Trainer: Ling Xie | Sentech SI 500 ICP Plasma Etcher
Sentech SI 500 is featured with a planar inductively coupled plasma source PTSA 200. The PTSA source is a unique feature of SENTECH high end plasma process systems. The PTSA source generates homogeneous plasma with high ion density (up to 5*1011 cm-3 in argon plasma) and low ion energy distribution. It features high coupling efficiency and very good ignition behavior for processing of a large variety of materials and structures. Due to the low ion energy distribution, low damage etching and nano structuring can be performed at low pressures.
• PTSA 200 ICP Source:
o RF power range: 100 W – 2000 W.
o Process pressure range: 0.2 Pa – 100 Pa
o Plasma density: up to 5*1011 cm3
o Electron temperature: ~2 eV
o Minimum ion energy: 10 eV (Ar plasma)
• Substrate electrode:
o RF power range: 20 W - 600 W, switched with pre-selection and control of forward power or bias voltage.
o Wafer carrier diameter: 150 mm, maximum sample height 9 mm.
o Electrode temperature range: -20 C - +350 C.
• Software controlled distance between PTSA source and substrate electrode from 80 mm to 120 mm (without spacer).
• Available gases and maximum flow rate:
o O2: 198 sccm
o Ar: 145 sccm
o Cl2: 86 sccm
• Reactor body heating up to 60 C.
• Etch material: diamond only.
For training, please contact Ling Xie, lxie@cns.fas.harvard.edu;
For hardware related issues, please contact David LaFleur, dlafleur@cns.fas.harvard.edu.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:30 pm
| 4 | 4 | Register! | | | | Training: SC-5 - Cleanroom Headway Spinner Training - Negative station in the photo bay | | Trainer: Bok Yeop Ahn | This training session covers the standard operation procedure (SOP) for spin coaters in the cleanroom. Listed below please complete the prerequisites before coming to the spin coater training.
- LISE Cleanroom Orientation
- NF-Training Litho. Intro.
- NF-06 Wet Bench and Chemical Safety Training
The training starts at the negative resist coating bench in the photolithography bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: Sharon EE-3 e-beam evaporator training - We meet in the cleanroom PVD bay (last bay inside of LISE G07) | | Trainer: Ed Macomber | Please read the training description all the way through:
For depositions thicker than 0.5 micron, contact CNS staff.
E-beam evaporation in EE-3 is covered; EE-3 can deposit 19 different materials (metals). All materials are user supplied for EE-3 (pellets and crucible liners). We will cover venting, loading the sample, pumping down (vacuum system) and the actual deposition. Plan on ~1.5 hr for this training. This is a manually operated deposition system and will likely take most users a few times using it to become comfortable with the machine. We meet in the cleanroom PVD bay (last bay inside LISE G07).
Once you sign up, you will receive the training confirmation email which will contain links to documents including the SOP. Please be sure to review the SOP BEFORE the training.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:00 pm - 2:30 pm
(Please review document links in email confirmation) | 3 | 3 | Register! | | | | Training: Thermo Scientific XPS Training - LISE G27 | | Trainer: Hao-Yu (Greg) Lin | | Spring 2026 | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
1:30 pm - 3:30 pm
| 4 | 4 | Register! | | | | Training: WB-2 EVG 501 Wafer Bonder Training - Inside cleanroom at WB-2 | | Trainer: Haojie Ji | | One group training session for full tool access. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
10:30 am - 11:30 am
| 3 | 3 | Register! | | |
|
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| Training: CNS orientation G07 LISE access - G07 | | Trainer: John Tsakirgis | | To understand safety and operational protocols | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
9:00 am - 10:30 am
please meet in front of G07 | 10 | 10 | Register! | | | | Training: DOE-1 - ULVAC Deep Oxide Etcher - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | | DOE-1 - ULVAC Deep Oxide Etcher tool training at 3:30 pm | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
3:30 pm - 4:30 pm
617-495-1738 | 5 | 5 | Register! | | | | Training: EE-5 PVD System E-beam Evaporator Training - Dry Bay in cleanroom | | Trainer: Yumian Zhu | - PLEASE READ THE WHOLE TRAINING DESCRIPTION BEFORE SIGNING UP –
E-beam deposition for <500nm. If you need to deposit materials more than 500nm thick, please contact CNS staff before signing up for the training. EE-5 is an automated pumping and deposition e-beam system. Pd, Ni, Ti, and Cr are the only materials in EE-5. For Au, Pt, user need to bring their own materials and crucible. CNS staff will provide the training on how to install/remove their Au, Pt crucible from the tool. Cr is limited to 25nm in EE-5 (adhesive layer only). Materials are supplied by CNS. The system accommodates a substrate up to a (1) 6” wafer. Precision GLADS stage for tilting and rotating the substrate. Uniformity is about 5% over a 6” wafer, on a flat deposition, according to the vendor.
There is no cooling on the GLADS sample stage.
Training takes about one hour. You need to be able to show up on time and stay for the whole training. Please read through the SOP (linked in the confirmation email) before the training, it makes things go a lot smoother.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
(check document links in confirmation email) | 3 | 2 | Register! | | | | Training: Introduction to Thin Film Processing - Rm G28 | | Trainer: Mughees Khan | Many kinds of thin films are used to fabricate discrete devices and ICs, including thermal oxides, dielectric layers, polycrystalline silicon, and metal films. This is an introductory session about Thin Film Processing, and it will provide users a basic understanding about this area of micro/nanofabrication along with available tools and capabilities at CNS.
Prerequisite for ALL Thin Film Equipment trainings (HT Anneals + PVD + CVD/ALD) | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
9:00 am - 11:00 am
| 10 | 10 | Register! | | | | Training: RIE-19 and RIE-14- Anatech SCE-106 Barrel Plasma System/Samco PC-300 Plasma Cleaning System - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | | Tool training for two tools:RIE-19 and RIE-14- Anatech SCE-106 Barrel Plasma System/Samco PC-300 Plasma Cleaning System | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
4:30 pm - 5:00 pm
617-495-1738 | 7 | 6 | Register! | | |
|
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| Training: B15A Sample Prep Training - LISE B15A | | Trainer: Cathleen Hallinan | | The sample prep room training will go over general equipment, consumables provided and safety orientation for the lab. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
11:00 am - 12:00 pm
meet by the couches on the basement level | 6 | 6 | Register! | | | | Training: SP-7 AJA UHV Sputter System Training - G-27 | | Trainer: Yumian Zhu | - PLEASE READ THE WHOLE TRAINING DESCRIPTION BEFORE SIGNING UP –
If you need to deposit a film thicker than 1000nm, please contact the staff before signing up.
SP-7 is a Hybrid PVD system includes Sputtering and E-beam system. This training is for the sputtering part. SP-7 is dedicated to the superconductive material deposition and application. No outgassing, organic substance, such as photoresist, PDMs, etc allow in the system. Venting chamber is not allowed in this tool. CNS will provide Nb, NbN, NbTi, MoRe, Aluminum targets. The system has two RF source, one 2” gun maximum power 300W, 30o to the substrate; one 3” gun maximum power 600W, vertical to the substrate. The substrate holder can accommodate 4” and 6” sample carrier. But the substrate heater is only suitable for 4” carrier. Do not apply heater function when you are using the 6” carrier. If user needs help, please contact the CNS staffs.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:30 pm
(check document links in confirmation email) | 4 | 4 | Register! | | |
|
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| Training: AB-2 RAC Clean Wet Process Station - Acid bench in the cleanroom | | Trainer: Bok Yeop Ahn | This training covers the standard operation procedure for the RCA cleaning at the acid wet benches. Listed below please complete the prerequisites before coming to this training session.
- LISE Cleanroom Orientation
- NF-06 Wet Bench and Chemical Safety Training
This training starts at the acid benches in the cleanroom. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:00 pm - 2:00 pm
| 3 | 3 | Register! | | | | Training: ALD-3 PdR ALD System Training - PVD Bay (last bay in cleanroom); small red and white instrument on the far wall | | Trainer: Mughees Khan | | This training provides users the protocols needed to operate the ALD-3 benchtop thermal ALD system. This system is primarily used for depositing Al2O3, SiO2 and Pt thin films on 4" substrates or 3D objects up to 8mm in height. The tool is capable of 40C deposition of Al2O3 and down to 100C for SiO2 and 125C for Pt. Both the SiO2 and Pt processes utilize Ozone as the counter reactant. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
9:00 am - 10:00 am
Prerequisite: Introduction to Thin Film Growth and Processing | 2 | 2 | Register! | | | | Training: FIB 4 Helios Dual-Beam FIBSEM Training - LISE B15F | | Trainer: Austin Akey | | Basic introductory training on the FEI Helios 660 DB FIB/SEM. Covers basic instrument operation for cross-section milling and imaging. Advanced applications upon request. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
1:00 pm - 5:00 pm
| 3 | 3 | Register! | | | | Training: Ling Xie's office hour for RIE or general fabrication related issues - online Zoom ID 990 9681 5765, Password 315648 | | Trainer: Ling Xie | | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
3:00 pm - 3:30 pm
| 1 | 1 | Register! | | | | Training: LPCVD and APCVD Training (CVD 5,6,7,9,10,11) - Cleanroom Dry Processing Bay | | Trainer: Mughees Khan | | Introduction to Thin Film Growth and Processing is required before you can sign up for this training. Users will learn about LPCVD (CVD6-SiNx, CVD7-Poly, CVD11-TEOS) and APCVD (CVD10-ThOx, CVD9-Metal Anneal, CVD5-Non-Metal Anneal) capabilities and associated protocols at CNS. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
10:00 am - 12:00 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 2 | 2 | Register! | | | | Training: OL-10/11/12 Heidelberg MLA Maskless Aligner Training Part-1 Basic Operation - Inside cleanroom at OL-10 | | Trainer: Haojie Ji | | Part-1, group training. Training covers OL-10, OL-11 and OL-12. One more certificate session needed for full access. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 4:30 pm
| 3 | 3 | Register! | | | | Training: RIE 8 STS ICP RIE Training - LISE G07 CNS Cleanroom at Dry Process Bay | | Trainer: Ling Xie | It is required to take the "Introduction to Dry Etching" before this training.
The RIE 8 is used to etch silicon, silicon oxide, silicon nitride, silicon carbide, and 2D materials.
Chamber Pre-Cleaning and Conditioning are Required: Before etching any samples, users must run the �O2-Clean� recipe for 20 minutes and the recipe to be used for 5-10 minutes.
The STS MPX/LPX RIE system is an Inductively Coupled Plasma (ICP) etching system. Using the ICP technology, this RIE is characterized with high plasma density, low operating pressure, high etch rate, excellent etch uniformity, and low energy ion damage. Available etching gases on this system include SF6, C4F8, O2, H2, Ar, Cl2, BCl3, and HBr. The maximum coil and platen powers are 1200W and 250W, respectively. Equipped with a chiller, the MPX/LPX system allows the substrate temperature to be controlled from 15�C to 30�C. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:00 pm - 2:30 pm
| 4 | 3 | Register! | | | | Training: SEM-10, Hitachi SU8230 SEM - At the tool in the cleanroom | | Trainer: Bok Yeop Ahn | This is a training session for HITACHI SU8230 SEM in cleanroom at CNS. Listed below, please complete the prerequisites trainings before coming to this SEM-10 tool training.
- LISE Cleanroom Orientation
- CNS Online SEM Training Module (Online course): https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/leclassview/dowbt-00008486
The training starts at the tool in the photolithography bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
| 3 | 3 | Register! | | | | Training: Thermal ALD Training (ALD 1 & ALD 4) - CNS Cleanroom - Wet Processing Bay | | Trainer: Mughees Khan | | The Cambridge Nanotech’s Savannah thermal ALD tools are the most common thermal ALD systems in university cleanrooms. ALD1 & ALD4 can hold substrates of different sizes up to 200mm and are equipped with heated precursor lines. Depositions can take place from 100C to 250C with rates in the range of 1-5 Å per minute, but high-aspect-ratio fill is achievable. These systems are used for depositing the following films: Al2O3, HfO2, TiO2, SiOx (cvd-like process w/ trace amounts of Al), ZnO, AZO, ZrO2 | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:00 pm - 2:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 3 | 3 | Register! | | | | Training: uXRF Training - Atlas XRF (X-Ray Fluorescence Spectrometer) - B15E - Meet outside Imaging Suite (on the sofas) | | Trainer: Mac Hathaway | | Training for the mapping XRF/uXRF Atlas system from iXRF. Users will learn the basics of X-Ray Fluorescence Spectroscopy and the use of the mapping XRF. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
1:30 pm - 3:00 pm
| 3 | 3 | Register! | | | | Training: Woollam RC2 Spectroscopic Ellipsometer Training (ES-4) - Inside Nanofabrication Cleanroom LISE-G07 (cleanroom-metrology bay) | | Trainer: Jason Tresback | | This training event will cover the basic operation of RC2 spectroscopic ellipsometer to characterize transparent thin films. We begin with sample mounting and alignment, single point measurements, model fitting, and mapping with the option to use a small spot size (125um). The system has a wavelength range of 200-2500nm. We will meet inside the Nanofabrication cleanroom along the windows | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
| 3 | 3 | Register! | | |
|
|
| Training: RIE-13 - Oxford PlasmaPro 100 Cobra 300 - In front of the tool inside cleanroom | | Trainer: Kenlin Huang | | RIE-13 - Oxford PlasmaPro 100 Cobra 300 training at 3pm. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
3:00 pm - 4:00 pm
617-495-1738 | 5 | 5 | Register! | | | | Training: CVD-14 Oxford ICP-CVD - Low Temp - CNS cleanroom - Dry processing bay at CVD-14 | | Trainer: Mughees Khan | | Introduction to Thin Film Growth and Processing is required before you can sign up for training. This training will enable users to grow high quality SiO2, SiNx, and a-Si films. No doping or active cooling is available on this tool. All baseline processes are at 80C with the exception of a-Si, which runs at 200C. Full temperature range is from -20C to 400C. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
11:00 am - 12:30 pm
Prerequisite: Introduction to Thin Film Growth and Processing | 3 | 3 | Register! | | | | Training: CVD-3 STS PECVD - CNS Cleanroom - Dry processing bay | | Trainer: Mughees Khan | This training will provide users the necessary protocol to deposit high quality SiO2, SiNx, and a:Si films at temperatures from ~200 to 350C. a-Si films can also be doped with B or P.
This tool is equipped with two RF generators, one at 13.56MHz (High frequency, HF recipes) and 380 kHz (low frequency, LF recipes). There are also recipes that take advantage of both RF generators to yield films with lower stress esp. silicon nitride films. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
9:00 am - 11:00 am
Prerequisite: Introduction to Thin Film Growth and Processing | 3 | 3 | Register! | | | | Training: Electrical Property Measurement of Devices and Thin films Inside Nanofabrication Cleanroom - Inside Nanofabrication Cleanroom LISE-G07 (cleanroom-metrology bay) | | Trainer: Jason Tresback | | This Metrology for Nanofabrication training event will focus on the fundamental measurement tools for electrical property measurements and device characterization inside the Nanofabrication Cleanroom. The most common test is an I-V curve using Semiconductor Parameter Analyzer w/ Signatone 4-Pt Probe Station (Agilent b1500 & Signatone 4PP) (PB-1 & CE-4). Up to 5 probe arms are available to characterize thin films and devices. Sheet resistance (Rs) mapping (4PP Sheet Resistance Mapper) (MET-39) can be used to characterize thickness uniformity of conductive films and dopant uniformity of s/c wafers | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
12:00 pm - 1:00 pm
| 3 | 3 | Register! | | | | Training: Jupiter XR Atomic Force Microscopy (AFM) Training (SPM-12) Inside the Nanofabrication Cleanroom - Inside Nanofabrication Cleanroom LISE-G07 (cleanroom-metrology bay) | | Trainer: Jason Tresback | | This training event will focus on the basic imaging and operation of the Jupiter XR AFM available inside the Nanofabrication Cleanroom (SPM-12). Starting from the basic principles of AFM, users will also learn about cantilever selection and installation, different imaging modes, image quality improvement, and data processing and analysis methods. The Jupiter AFM (SPM-12) is for large samples up to 200mm and large scan range (100x100x12um). AFM probes are provided for training; however, users must supply their own probes during independent use. Full independent tool access requires completion of part-1 basic imaging and operation demonstrated by staff, followed by part-2 individual user assisted session that serves as a qualification for independent use on another day. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
3:00 pm - 4:30 pm
| 3 | 3 | Register! | | | | Training: Metrology for Nanofabrication (Stylus Profilometer, Reflectometer, and Ellipsometer) - Inside Nanofabrication Cleanroom LISE-G07 (cleanroom-metrology bay) | | Trainer: Jason Tresback | | The Metrology for Nanofabrication training event will focus on fundamental measurement tools for thin film characterization including contact/stylus surface Profilometer (Dektak XT) (PL-8 & 11), multi-wavelength scanning Ellipsometer (FS-150XY) (ES-3), and Reflectometer (F50-UVX) (MET-35). Full independent access to these tools listed above will be provided after the training, however the amount of time spent on each tool will vary based on participants. We meet inside the Cleanroom gowning area or within the Metrology Bay inside the CNS cleanroom (G07). | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
10:30 am - 12:00 pm
| 3 | 3 | Register! | | | | Training: NF-06 Wet Bench and Chemical Safety Training - Location: G07 in the gowning room | | Trainer: Bok Yeop Ahn | This training covers general operations of all wet benches including spin coating, developing, acid, and wet processing benches as well as chemical safety policies in the cleanroom. All users must complete this training before using any wet benches in the cleanroom. Listed below please complete the prerequisite trainings before coming to this wet bench and chemical safety training.
- LISE Cleanroom Orientation
- NF-Training Litho. Intro.
Let’s meet in the Gouging Room at 1pm. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:00 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: Nikon Micro-CT Training - LISE G27 | | Trainer: Hao-Yu (Greg) Lin | | Spring 2026 | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
1:30 pm - 3:30 pm
| 4 | 4 | Register! | | | | Training: OL-4 - SUSS MA6 Mask Aligner - At the tool in the photo bay | | Trainer: Bok Yeop Ahn | This is a training session for MA6 Mask Aligner in the cleanroom. Listed below please complete the prerequisites before getting this training.
- LISE Cleanroom Orientation
- NF-Training Litho. Intro.
- NF-06 Wet Bench and Chemical Safety Training
The training starts at the tool in the photolithography bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
3:00 pm - 4:00 pm
| 4 | 4 | Register! | | | | Training: Optical Profiler Training (PL-6) - Inside Nanofabrication Cleanroom LISE-G07 (cleanroom-metrology bay) | | Trainer: Jason Tresback | | This training event will cover basic operation of the Optical Profiler (CCI HD) (PL-6) which uses white light interferometry (WLI) to measure roughness, topography, and step-heights with sub-nm vertical resolution and 1-3um lateral resolution. This is a rapid, non-contact, and non-destructive technique to analyze small area (80x80 um) and large area (100x100 mm). Limitations include thin transparent films and dissimilar materials. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
| 3 | 3 | Register! | | | | Training: RIE 10 Rapier DRIE Training - The first hour training is online, Zoom ID 990 9681 5765, passcode 315648, held outside the cleanroom and the rest of time is inside the cleanroom at the tool. | | Trainer: Ling Xie | It is required to take the "Introduction to Dry Etching" before this training.
The first hour training is online, Zoom ID 990 9681 5765, passcode 315648.
The SPTS Rapier system is for deep silicon etch only, it is configured with dual plasma sources, dual gas inlets, electro-static clamping chuck, AMS chiller to control the chuck temperature from -15�C to + 40�C, and Claritas end-point detector.
Specifications
� Etch rate: 1.0 � 10 �m/min
� Aspect ratio: 5 � 50
� Etch depth: 5�m � several hundreds of microns
� Feature size: nm � mm scales in lateral dimension
� Sider wall roughness (scallop depth): 6nm � 700nm
� Sample size ≤ 6�
� Etch mask: only resists and SiO2 allowed
The first hour training is online, Zoom ID 990 9681 5765, passcode 315648. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:00 pm - 3:30 pm
| 4 | 4 | Register! | | | | Training: SC-5 - Cleanroom Headway Spinner Training - Negative station in the photo bay | | Trainer: Bok Yeop Ahn | This training session covers the standard operation procedure (SOP) for spin coaters in the cleanroom. Listed below please complete the prerequisites before coming to the spin coater training.
- LISE Cleanroom Orientation
- NF-Training Litho. Intro.
- NF-06 Wet Bench and Chemical Safety Training
The training starts at the negative resist coating bench in the photolithography bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: SP-3 AJA sputtering system training for 3-gun system - CNS cleanroom (G 07) Dry Bay | | Trainer: Yumian Zhu | Please read the training description all the way through.
If you need to deposit a film thicker than 500nm, please contact the staff before signing up.
This training is for standard operating procedure of SP-3 sputtering system. The system has one RF source and two DC sources (DC power supply is switchable between the two sources).The substrate holder can accommodate up to a 4” diameter wafer. SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with one RF and one DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their own schedule. After 3 uses (with no problems) users are given 24/7 access.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 4:00 pm
(check document links in confirmation email) | 3 | 3 | Register! | | | | Training: SW-6 PELCO LatticeAX 420 Sample Cleaving System Training - LISE-G27 | | Trainer: Haojie Ji | | One group training session for full tool access. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
10:30 am - 11:30 am
| 3 | 3 | Register! | | | | Training: WB-3/4 Wedge and Ball Wire Bonders Training Part-1 Basic Operation - LISE-G27 | | Trainer: Haojie Ji | | Part-1, group training. Introduce WB-3 Al wedge bond and WB-4 Au ball bond. One more certificate session needed for full access. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
2:00 pm - 4:30 pm
| 3 | 3 | Register! | | |
|
|
| Training: ALD-2 GEMStar ALD Training - Wet Processing Bay - CNS cleanroom | | Trainer: Mughees Khan | | This training introduces users protocols needed to operate ALD-2. This system is primarily used for depositing conducting metal nitride and potentially pure metal films with good uniformity, conformality, and material purity. Deposition rates are slow, in the range of 1-3 � per minute, but extremely high-aspect-ratio fill (40:1) is easily achievable. Currently, only WNx is available. In addition, Al2O3 can also be deposited on this tool. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
9:00 am - 10:00 am
Prerequisite: Introduction to Thin Film Growth and Processing | 2 | 2 | Register! | | | | Training: CNS orientation G07 LISE access - G07 | | Trainer: John Tsakirgis | | To understand safety and operational protocols | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
9:00 am - 10:30 am
please meet in front of G07 | 10 | 10 | Register! | | | | Training: SW-5 Disco Dicing Saw Training Part-1 Basic Operation - LISE-G06 | | Trainer: Haojie Ji | Part-1, group training. One more certificate session needed for full access.
User will also need to take G06 room safety orientation to have room access. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
3:00 pm - 4:30 pm
| 3 | 3 | Register! | | |
|
|
| Training: B15A Sample Prep Training - LISE B15A | | Trainer: Cathleen Hallinan | | The sample prep room training will go over general equipment, consumables provided and safety orientation for the lab. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
11:00 am - 12:00 pm
meet by the couches on the basement level | 6 | 6 | Register! | | | | Training: SP-7 AJA E-Beam System Training - G-27 | | Trainer: Yumian Zhu | - PLEASE READ THE WHOLE TRAINING DESCRIPTION BEFORE SIGNING UP –
If you need to deposit a film thicker than 500nm, please contact the staff before signing up.
SP-7 is a Hybrid PVD system includes Sputtering and Ebeam system. This training is for the E-beam part. SP-7 is dedicated to the superconductive material deposition and application. No outgassing, organic substance, such as photoresist, PDMs, etc… allow in the system. The system has 6 pockets that can carry 6 different materials. Currently the system can use aluminum, titanium, niobium. Venting chamber is not allowed in this tool. CNS will provide the materials. The tool has two size of sample carrier, 4” and 6”. But the substrate heater is only suitable for 4” carrier. Do not apply heater function when you are using the 6” carrier. If user needs help, please contact the CNS staffs.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:30 pm
(check document links in confirmation email) | 4 | 4 | Register! | | |
|
|
| Training: Introduction to Dry Etch - Zoom Meeting ID 99096815765, Password: 315648. | | Trainer: Ling Xie | This introduction class is a prerequisite for any RIE tool trainings.
It is one hour online class with Zoom: Meeting ID 99096815765, Password: 315648. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
11:00 am - 12:00 pm
| 12 | 12 | Register! | | | | Training: Ling Xie's office hour for RIE or general fabrication related issues - online Zoom ID 990 9681 5765, Password 315648 | | Trainer: Ling Xie | | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
3:00 pm - 3:30 pm
| 1 | 1 | Register! | | | | Training: NF-Training Litho. Intro. - Online by Zoom | | Trainer: Bok Yeop Ahn | This is an online training by Zoom, covering CNS lithography tools, policies, and basics of photolithography, e-beam lithography, and 3D laser lithography. Users should take this class before using any tools, including wet benches, spin coaters, and photo- or e-beam lithography tools.
The Zoom link will be sent to attendees on the training date. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
9:30 am - 10:30 am
Online by Zoom | 20 | 20 | Register! | | | | Training: OL-10/11/12 Heidelberg MLA Maskless Aligner Training Part-1 Basic Operation - Inside cleanroom at OL-10 | | Trainer: Haojie Ji | | Part-1, group training. Training covers OL-10, OL-11 and OL-12. One more certificate session needed for full access. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 4:30 pm
| 3 | 3 | Register! | | | | Training: RIE-17 - Plasma Therm VERSALINE Etching System - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | RIE-17 - Plasma Therm VERSALINE Etching System tool training at 2 pm.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
617-495-1738 | 6 | 6 | Register! | | | | Training: SEM-10, Hitachi SU8230 SEM - At the tool in the cleanroom | | Trainer: Bok Yeop Ahn | This is a training session for HITACHI SU8230 SEM in cleanroom at CNS. Listed below, please complete the prerequisites trainings before coming to this SEM-10 tool training.
- LISE Cleanroom Orientation
- CNS Online SEM Training Module (Online course): https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/leclassview/dowbt-00008486
The training starts at the tool in the photolithography bay. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
| 3 | 3 | Register! | | |
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