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| Training: CNS NICE TRAINING LISTING - NICE System | | Trainer: Jim Reynolds | Tools and trainings that can now be found on the new NICE system (https://nice.rc.fas.harvard.edu/nice/):
Imaging:
SEM-13 Zeiss Gemini 360 FE-SEM
SEM-14 Zeiss Gemini 560 FE-SEM
SEM-11 JEOL 7900F SEM
NanoMaterials:
XRA-002 Micro-CT System
XRA-008 Thermo Scientific K-AlphaPlus XPS
XRA-009 Thermo Scientific Nexsa XPS
XRA-013 Micro-XRF System
XRA-014 Bruker D6 Phaser XRD
Nanofabrication:
Intro to Thin Film Processing
All ALD Systems (ALDs1-4)
CVD-3 STS PECVD
CVD-14 Oxford ICP-CVD Low Temp
LPCVD and APCVD Training (CVDs-5-6-7-9-10-11)
Diamond PECVD
SP-7 AJA UHV Sputter System | | | | Training: CNS Safety Orientation - Online at the Harvard Training Portal | | Trainer: Jim Reynolds | This training is required as part of the CNS User enrollment process (step 3 for HU Users, step 7 for non-HU Users).
Please note that Non-HU Users, unless they already have a HUID and HU Key, will need to wait until after completion of step 6 of the enrollment process to obtain their HU Key in order to take the CNS Safety Orientation. HU Users and those Non-HU Users who already have a HU Key can take this orientation at any point in the enrollment process.
How to take the CNS Safety Orientation:
As of May 13, 2024, the CNS Safety Orientation (formerly known as the CNS Safety Training) has moved to the online Harvard Training Portal (HTP) at the URL: https://trainingportalinfo.harvard.edu/
You can navigate directly to the CNS Safety Orientation via the URL: https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/leclassview/dowbt-0000273303
Alternatively, you can also access the orientation by logging in to the HTP home page. Just put ‘CNS’ in the search bar in the upper right hand corner. All CNS online training options will result. Select the CNS Safety Orientation and complete that training.
The orientation will last for about an hour. Once done with the orientation, get a copy of the completion certificate available in the HTP and send it to info@cns.fas.harvard.edu. | | | | Training: Zeiss SEM Part 1: Online training - Harvard Training Portal | | Trainer: Tim Cavanaugh | The SEM Part 1 training is available in an online format. You must pass this online training before taking the hands-on SEM training for our field emission Zeiss SEMs (FESEMs). This includes SEM-8, SEM-12, SEM-13, and SEM-14. There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000007001
PLEASE NOTE THAT THIS TRAINING IS ONLY FOR FULLY ENROLLED CNS USERS. IF YOU ARE LOOKING FOR THE FREE CNS IMAGING GROUP MASTERCLASS WEBINARS, PLEASE SEE FURTHER BELOW
Please note that this training requires a Harvard Key. If you are an external user and do not have a Harvard Key, please contact info@cns.fas.harvard.edu for details.
| | | | Training: 2D-Stacker-01 training - | | Trainer: Danial Haei | | This training covers general operation of 2D-Stacker-01. Standard PC stacking process will be covered. Users are expected to bring their own stamps as described in SOP. Please contact danial_haie@fas.harvard.edu to schedule. | | | | Training: HAR-053 sputter coater training (online) - Harvard Training Portal | | Trainer: Jules Gardener | This training is for the EMS sputter coater located in the CNS Imaging sample preparation room (LISE B15A). This tool is optimized for coating SEM samples with a thin conductive layer. This coater cannot be used for coating thick (>20nm) films. Pt/Pd and Au coatings are available.
Sputter coater training is available in an online format for these tools. You must pass this online training, and have completed the B15A room safety training (in-person training), before access to the sputter coaters can be granted. Once you have completed these requirements, you will have access to the sputter coater. There is no sign-up required for our online trainings and these can be taken by CNS users at any time. You can access the sputter coater training course at https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/leclassview/dowbt000000000004421
Please copy this URL into your browser to take the training. We recommend using Chrome, Safari or Internet Explorer.
Any CNS User with a HU Key is eligible to take this training | | | | Training: Introduction to TEM using the JEOL F200 SEC - SEC LL2.301-04 150 Western Ave Allston Ma | | Trainer: Adam Graham | In this training you will learn to use the JEOL F200 in TEM mode for basic imaging. More advanced techniques included based on experience level.
This is an individual training which will be schedule upon sign up. Group training can be arranged if multiple members from the same group require training. Individual training is 3 hours group training maybe longer based on number of trainees.
Prerequisite: registered CNS User, and online CNS Introductory TEM Training (CNS) found on the training portal.
Email AGraham@cns.fas.harvard.edu or scheduling. | | | | Training: Online TEM training course - Harvard Training Portal | | Trainer: Jules Gardener | This is a new online training which is required as the first step of TEM training for the JEOL 2100, JEOL F200 and Hitachi 7800 instruments. This training will provide an introduction to TEM concepts and background about our TEMs. You must pass the assessment at the end of this online course before attending an in-person TEM training on the JEOL 2100 or Hitachi 7800 instruments. There is no sign-up required for the online training; you can access the training course from this link:
https://trainingportal.harvard.edu/Saba/Web_spf/NA1PRD0068/common/ledetail/cours000000000010142
Any CNS User with a HU Key is eligible to take this training. | | | | Training: RTP-3 AccuThermo Rapid Thermal Processor training - LISE G07 Cleanroom PVD bay (last bay in cleanroom) | | Trainer: Danial Haei | | This Training covers operation and standard baseline process for RTP-3 AccuThermo Rapid Thermal Processor at CNS. Please contact Danial_haie@fas.harvard.edu to schedule. | | | | Training: SEC - AFM Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Bruker JPK NanoWizard 4 XP atomic force microscope (SEC-SPM-13), including mechanical and fluorescence-correlated measurements. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - DLS/Zetasizer Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Malvern Zetasizer Pro for dynamic light scattering and zeta potential measurements. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - DMA Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Mettler Toledo DMA 1 dynamic mechanical analyzer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - DSC Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the TA Discover DSC 250 differential scanning calorimeter. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - Electronic Characterization Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Keithley 4200A and Signatone probe station for electronic device characterization. Capacitor, resistor, transistor, and photovoltaic measurements, among others, are available. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - FTIR Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Nicolet iS50 infrared spectrometer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - Nanoindenter Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Bruker Hysitron TS 77 nanoindenter. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - NMR Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Magritek Spinsolve 80 nuclear magnetic resonance spectrometer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - Optical Profilometer Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Bruker ContourX optical profilometer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - Raman Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Horiba LabRAM Soleil Raman microscope. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - Rheometer Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the TA HR 20 rheometer, including shear, compression, tension, UV curing, and dielectric measurements. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - Tensiometer Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Droplet Lab Tensiometer for surface tension and contact angle measurements. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - TGA Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the TA Discovery TGA 550 thermogravimetric analyzer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC - UV-Vis/Fluorescence Training - SEC LL2.226 | | Trainer: Nicholas Colella | | Training on the Horiba Duetta UV-vis absorbance/fluorescence (photoluminescence) spectrometer. Email colella@fas.harvard.edu to schedule. | | | | Training: SEC FESEM Zeiss Gemini 360 FESEM - SEC LL2.301-03 150 Western Ave Allston Ma | | Trainer: Adam Graham | This training will go over the hands-on portion of the FESEM and will set up your account. If you already have access to the SEMS in Cambridge, I can add your account here please email AGraham@cns.fas.harvard.edu
This is an individual training; group training can be arranged if members from same group require training. individual training is 2 hours group longer based on amount of trainees
CNS Prerequisite: registered CNS User, and online CNS Online SEM Training Module (CNS) found on the training portal.
Email AGraham@cns.fas.harvard.edu or scheduling | | |
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| Training: IBE-01 - INTLVAC Nanoquest Ion Beam Etching System - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | IBE-01 - INTLVAC Nanoquest Ion Beam Etching System
training at 3 pm | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
3:00 pm - 4:00 pm
617-4951738 | 6 | 6 | Register! | | | | Training: Ling Xie's office hour for RIE or general fabrication related issues - online Zoom ID 990 9681 5765, Password 315648 | | Trainer: Ling Xie | | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
3:00 pm - 3:30 pm
| 1 | 1 | Register! | | | | Training: RIE-17 - Plasma Therm VERSALINE Etching System - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | RIE-17 - Plasma Therm VERSALINE Etching System tool training at 2 pm.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
617-495-1738 | 6 | 6 | Register! | | |
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| Training: Denton E-beam Evaporator (EE-4) training - LISE G07 (cleanroom); PVD Bay | | Trainer: Yumian Zhu | Please read the training description all the way through.
For depositions thicker than 0.5 micron, contact CNS staff before signing up for the training.
In this training, the use of the Denton EE-4 e-beam system for thin film metal deposition is covered by going through a standard deposition procedure from beginning to end. EE-4 is fully automated and can deposit the following materials: Ag, Ti, Cr, Pd. For Au, Pt, user need to bring their own materials and crucible. CNS staff will provide the training on how to install/remove their Au, Pt crucible from the tool. Please be aware that these listed materials are all that can be done in EE-4 at this time; the materials do not change. Thickness accuracy: a recent (10/2024) measurement showed a deposited (on the controller) thickness of 800Å to yield actual (measured with reflectometry) 785Å and 769Å on two samples using planetary substrate holder and 105% tooling factor. Denton states uniformity over a 4” wafer for this system can be expected to be within 5%. This system can accommodate up to (1) 6” wafer or (3) 4” wafers. There is no substrate cooling.
We use a test sample for a quick deposition, which is all that's required for the training. Plan on ~1 hr for this training. We meet promptly right at the machine in the LISE CR PVD Bay.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
(check document links in confirmation email) | 4 | 4 | Register! | | | | Training: FCB-2 Finetech Sigma Flip Chip Bonder Training Part-1 Basic Operation - LISE-G27 | | Trainer: Haojie Ji | | Part-1, group training. One more certificate session needed for full access. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
2:00 pm - 4:30 pm
| 3 | 3 | Register! | | | | Training: RIE 11 PlasmaTherm Diamond Etcher - CNS Cleanroom at RIE 11 | | Trainer: Ling Xie | 1. Introduction
The Versaline RIE is an Inductive Coupled Plasma Etching System with a maximum ICP source power of 1,200W and a maximum substrate bias power of 600W. The system is configured to handle 4” wafers and equipped with mechanical clamping and backside helium heat-conducting features. Its substrate temperature can be controlled from 10°C to180°C. In addition, temperatures of three other components inside the chamber can also be controlled from room temperature to 120°C, including Lid, Ceramic Spool, and Metal Liner. Setting these components at elevated temperatures before processing will reduce by-product coating speed on chamber walls and stabilize chamber conditions for the first couple of runs after the tool was at a stand-by state for a long time.
2. Application
Only Diamond can be etched in this RIE and all other materials are forbidden.
3. Chamber Pre-Conditioning Requirements
Users have to run recipe “O2 Chamber Cleaning” for 30min or other plasma clean recipes and then run the etching recipe to be followed for 5-10min for chamber seasoning. A 4” Sapphire wafer or an aluminum coated Sapphire wafer must be loaded for the chamber cleaning or seasoning.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
1:00 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: RIE 16 Sentech SI 500 Diamond Etcher - CNS Cleanroom at RIE 16 | | Trainer: Ling Xie | It is required to take the "Introduction to Dry Etching" before this training.
Sentech SI 500 is featured with a planar inductively coupled plasma source PTSA 200. The PTSA source is a unique feature of SENTECH high end plasma process systems. The PTSA source generates homogeneous plasma with high ion density (up to 5*1011 cm-3 in argon plasma) and low ion energy distribution. It features high coupling efficiency and very good ignition behavior for processing of a large variety of materials and structures. Due to the low ion energy distribution, low damage etching and nano structuring can be performed at low pressures.
• PTSA 200 ICP Source:
o RF power range: 100 W – 2000 W.
o Process pressure range: 0.2 Pa – 100 Pa
o Plasma density: up to 5*1011 cm3
o Electron temperature: ~2 eV
o Minimum ion energy: 10 eV (Ar plasma)
• Substrate electrode:
o RF power range: 20 W - 600 W, switched with pre-selection and control of forward power or bias voltage.
o Wafer carrier diameter: 150 mm, maximum sample height 9 mm.
o Electrode temperature range: -20 C - +350 C.
• Software controlled distance between PTSA source and substrate electrode from 80 mm to 120 mm (without spacer).
• Available gases and maximum flow rate:
o O2: 198 sccm
o Ar: 145 sccm
o Cl2: 86 sccm
• Reactor body heating up to 60 C.
• Etch material: diamond only.
For training, please contact Ling Xie, lxie@cns.fas.harvard.edu;
For hardware related issues, please contact David LaFleur, dlafleur@cns.fas.harvard.edu. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: WB-2 EVG 501 Wafer Bonder Training - Inside cleanroom at WB-2 | | Trainer: Haojie Ji | | One group training session for full tool access. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:30 am - 11:30 am
| 3 | 3 | Register! | | |
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| Training: DOE-1 - ULVAC Deep Oxide Etcher - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | | DOE-1 - ULVAC Deep Oxide Etcher tool training at 3:30 pm | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:30 pm - 4:30 pm
617-495-1738 | 5 | 5 | Register! | | | | Training: EE-5 PVD System E-beam Evaporator Training - Dry Bay in cleanroom | | Trainer: Yumian Zhu | - PLEASE READ THE WHOLE TRAINING DESCRIPTION BEFORE SIGNING UP –
E-beam deposition for <500nm. If you need to deposit materials more than 500nm thick, please contact CNS staff before signing up for the training. EE-5 is an automated pumping and deposition e-beam system. Pd, Ni, Ti, and Cr are the only materials in EE-5. For Au, Pt, user need to bring their own materials and crucible. CNS staff will provide the training on how to install/remove their Au, Pt crucible from the tool. Cr is limited to 25nm in EE-5 (adhesive layer only). Materials are supplied by CNS. The system accommodates a substrate up to a (1) 6” wafer. Precision GLADS stage for tilting and rotating the substrate. Uniformity is about 5% over a 6” wafer, on a flat deposition, according to the vendor.
There is no cooling on the GLADS sample stage.
Training takes about one hour. You need to be able to show up on time and stay for the whole training. Please read through the SOP (linked in the confirmation email) before the training, it makes things go a lot smoother.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
(check document links in confirmation email) | 3 | 3 | Register! | | | | Training: RIE-12 - Matrix Plasma Asher - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | | RIE-12 - Matrix Plasma Asher tool training at 3:00 pm. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:00 pm - 3:30 pm
617-495-1738 | 6 | 6 | Register! | | | | Training: RIE-19 and RIE-14- Anatech SCE-106 Barrel Plasma System/Samco PC-300 Plasma Cleaning System - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | | Tool training for two tools:RIE-19 and RIE-14- Anatech SCE-106 Barrel Plasma System/Samco PC-300 Plasma Cleaning System | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
4:30 pm - 5:00 pm
617-495-1738 | 7 | 7 | Register! | | |
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| Training: SP-7 AJA UHV Sputter System Training - G-27 | | Trainer: Yumian Zhu | - PLEASE READ THE WHOLE TRAINING DESCRIPTION BEFORE SIGNING UP –
If you need to deposit a film thicker than 1000nm, please contact the staff before signing up.
SP-7 is a Hybrid PVD system includes Sputtering and E-beam system. This training is for the sputtering part. SP-7 is dedicated to the superconductive material deposition and application. No outgassing, organic substance, such as photoresist, PDMs, etc allow in the system. Venting chamber is not allowed in this tool. CNS will provide Nb, NbN, NbTi, MoRe, Aluminum targets. The system has two RF source, one 2” gun maximum power 300W, 30o to the substrate; one 3” gun maximum power 600W, vertical to the substrate. The substrate holder can accommodate 4” sample carrier. If user needs help, please contact the CNS staffs.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:30 pm
(check document links in confirmation email) | 4 | 4 | Register! | | |
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| Training: FIB 4 Helios Dual-Beam FIBSEM Training - LISE B15F | | Trainer: Austin Akey | | Basic introductory training on the FEI Helios 660 DB FIB/SEM. Covers basic instrument operation for cross-section milling and imaging. Advanced applications upon request. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 5:00 pm
| 3 | 3 | Register! | | | | Training: RIE 8 STS ICP RIE Training - CNS Cleanroom at RIE 8 | | Trainer: Ling Xie | It is required to take the "Introduction to Dry Etching" before this training.
The RIE 8 is used to etch silicon, silicon oxide, silicon nitride, silicon carbide, and 2D materials.
Chamber Pre-Cleaning and Conditioning are Required: Before etching any samples, users must run the O2-Clean recipe for 20 minutes and the recipe to be used for 5-10 minutes.
The STS MPX/LPX RIE system is an Inductively Coupled Plasma (ICP) etching system. Using the ICP technology, this RIE is characterized with high plasma density, low operating pressure, high etch rate, excellent etch uniformity, and low energy ion damage. Available etching gases on this system include SF6, C4F8, O2, H2, Ar, Cl2, BCl3, and HBr. The maximum coil and platen powers are 1200W and 250W, respectively. Equipped with a chiller, the MPX/LPX system allows the substrate temperature to be controlled from 15C to 30C. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 3:00 pm
| 4 | 4 | Register! | | |
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| Training: RIE 10 Rapier DRIE Training - The first hour training is online, Zoom ID 990 9681 5765, passcode 315648, held outside the cleanroom and the rest of time is inside the cleanroom at the tool. | | Trainer: Ling Xie | It is required to take the "Introduction to Dry Etching" before this training.
The first hour training is online, Zoom ID 990 9681 5765, passcode 315648.
The SPTS Rapier system is for deep silicon etch only, it is configured with dual plasma sources, dual gas inlets, electro-static clamping chuck, AMS chiller to control the chuck temperature from -15�C to + 40�C, and Claritas end-point detector.
Specifications
� Etch rate: 1.0 � 10 �m/min
� Aspect ratio: 5 � 50
� Etch depth: 5�m � several hundreds of microns
� Feature size: nm � mm scales in lateral dimension
� Sider wall roughness (scallop depth): 6nm � 700nm
� Sample size ≤ 6�
� Etch mask: only resists and SiO2 allowed
The first hour training is online, Zoom ID 990 9681 5765, passcode 315648. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 3:30 pm
From 1pm-2pm, it is on Zoom, 2pm-3:30pm, in Cleanroom | 4 | 4 | Register! | | | | Training: RIE-13 - Oxford PlasmaPro 100 Cobra 300 - In front of the tool inside cleanroom | | Trainer: Kenlin Huang | | RIE-13 - Oxford PlasmaPro 100 Cobra 300 training at 3pm. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:00 pm - 4:00 pm
617-495-1738 | 5 | 5 | Register! | | | | Training: SP-3 AJA sputtering system training for 3-gun system - CNS cleanroom (G 07) Dry Bay | | Trainer: Yumian Zhu | Please read the training description all the way through.
If you need to deposit a film thicker than 500nm, please contact the staff before signing up.
This training is for standard operating procedure of SP-3 sputtering system. The system has one RF source and two DC sources (DC power supply is switchable between the two sources).The substrate holder can accommodate up to a 4” diameter wafer. SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with one RF and one DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their own schedule. After 3 uses (with no problems) users are given 24/7 access.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 4:00 pm
(check document links in confirmation email) | 3 | 3 | Register! | | | | Training: SW-6 PELCO LatticeAX 420 Sample Cleaving System Training - LISE-G27 | | Trainer: Haojie Ji | | One group training session for full tool access. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
10:30 am - 11:30 am
| 3 | 3 | Register! | | | | Training: WB-3/4 Wedge and Ball Wire Bonders Training Part-1 Basic Operation - LISE-G27 | | Trainer: Haojie Ji | | Part-1, group training. Introduce WB-3 Al wedge bond and WB-4 Au ball bond. One more certificate session needed for full access. | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 4:30 pm
| 3 | 3 | Register! | | |
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| Training: SW-5 Disco Dicing Saw Training Part-1 Basic Operation - LISE-G06 | | Trainer: Haojie Ji | Part-1, group training. One more certificate session needed for full access.
User will also need to take G06 room safety orientation to have room access. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
3:00 pm - 4:30 pm
| 3 | 3 | Register! | | |
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| Training: SP-7 AJA E-Beam System Training - G-27 | | Trainer: Yumian Zhu | - PLEASE READ THE WHOLE TRAINING DESCRIPTION BEFORE SIGNING UP –
If you need to deposit a film thicker than 500nm, please contact the staff before signing up.
SP-7 is a Hybrid PVD system includes Sputtering and Ebeam system. This training is for the E-beam part. SP-7 is dedicated to the superconductive material deposition and application. No outgassing, organic substance, such as photoresist, PDMs, etc… allow in the system. The system has 6 pockets that can carry 6 different materials. Currently the system can use aluminum, titanium, niobium. Venting chamber is not allowed in this tool. CNS will provide the materials. The substrate holder can accommodate 4” sample carrier. If user needs help, please contact the CNS staffs.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:30 pm
(check document links in confirmation email) | 4 | 4 | Register! | | |
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| Training: RIE-17 - Plasma Therm VERSALINE Etching System - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | RIE-17 - Plasma Therm VERSALINE Etching System tool training at 2 pm.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
617-495-1738 | 6 | 6 | Register! | | |
|
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| Training: Denton E-beam Evaporator (EE-4) training - LISE G07 (cleanroom); PVD Bay | | Trainer: Yumian Zhu | Please read the training description all the way through.
For depositions thicker than 0.5 micron, contact CNS staff before signing up for the training.
In this training, the use of the Denton EE-4 e-beam system for thin film metal deposition is covered by going through a standard deposition procedure from beginning to end. EE-4 is fully automated and can deposit the following materials: Ag, Ti, Cr, Pd. For Au, Pt, user need to bring their own materials and crucible. CNS staff will provide the training on how to install/remove their Au, Pt crucible from the tool. Please be aware that these listed materials are all that can be done in EE-4 at this time; the materials do not change. Thickness accuracy: a recent (10/2024) measurement showed a deposited (on the controller) thickness of 800Å to yield actual (measured with reflectometry) 785Å and 769Å on two samples using planetary substrate holder and 105% tooling factor. Denton states uniformity over a 4” wafer for this system can be expected to be within 5%. This system can accommodate up to (1) 6” wafer or (3) 4” wafers. There is no substrate cooling.
We use a test sample for a quick deposition, which is all that's required for the training. Plan on ~1 hr for this training. We meet promptly right at the machine in the LISE CR PVD Bay.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
|---|
2:00 pm - 3:00 pm
(check document links in confirmation email) | 4 | 4 | Register! | | | | Training: FCB-2 Finetech Sigma Flip Chip Bonder Training Part-1 Basic Operation - LISE-G27 | | Trainer: Haojie Ji | | Part-1, group training. One more certificate session needed for full access. | | Time | Max Attendees | Available | CNS Users ONLY |
|---|
2:00 pm - 4:30 pm
| 3 | 3 | Register! | | | | Training: RIE 11 PlasmaTherm Diamond Etcher - CNS Cleanroom at RIE 11 | | Trainer: Ling Xie | 1. Introduction
The Versaline RIE is an Inductive Coupled Plasma Etching System with a maximum ICP source power of 1,200W and a maximum substrate bias power of 600W. The system is configured to handle 4” wafers and equipped with mechanical clamping and backside helium heat-conducting features. Its substrate temperature can be controlled from 10°C to180°C. In addition, temperatures of three other components inside the chamber can also be controlled from room temperature to 120°C, including Lid, Ceramic Spool, and Metal Liner. Setting these components at elevated temperatures before processing will reduce by-product coating speed on chamber walls and stabilize chamber conditions for the first couple of runs after the tool was at a stand-by state for a long time.
2. Application
Only Diamond can be etched in this RIE and all other materials are forbidden.
3. Chamber Pre-Conditioning Requirements
Users have to run recipe “O2 Chamber Cleaning” for 30min or other plasma clean recipes and then run the etching recipe to be followed for 5-10min for chamber seasoning. A 4” Sapphire wafer or an aluminum coated Sapphire wafer must be loaded for the chamber cleaning or seasoning.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 2:00 pm
| 4 | 4 | Register! | | | | Training: RIE 16 Sentech SI 500 Diamond Etcher - CNS Cleanroom at RIE 16 | | Trainer: Ling Xie | It is required to take the "Introduction to Dry Etching" before this training.
Sentech SI 500 is featured with a planar inductively coupled plasma source PTSA 200. The PTSA source is a unique feature of SENTECH high end plasma process systems. The PTSA source generates homogeneous plasma with high ion density (up to 5*1011 cm-3 in argon plasma) and low ion energy distribution. It features high coupling efficiency and very good ignition behavior for processing of a large variety of materials and structures. Due to the low ion energy distribution, low damage etching and nano structuring can be performed at low pressures.
• PTSA 200 ICP Source:
o RF power range: 100 W – 2000 W.
o Process pressure range: 0.2 Pa – 100 Pa
o Plasma density: up to 5*1011 cm3
o Electron temperature: ~2 eV
o Minimum ion energy: 10 eV (Ar plasma)
• Substrate electrode:
o RF power range: 20 W - 600 W, switched with pre-selection and control of forward power or bias voltage.
o Wafer carrier diameter: 150 mm, maximum sample height 9 mm.
o Electrode temperature range: -20 C - +350 C.
• Software controlled distance between PTSA source and substrate electrode from 80 mm to 120 mm (without spacer).
• Available gases and maximum flow rate:
o O2: 198 sccm
o Ar: 145 sccm
o Cl2: 86 sccm
• Reactor body heating up to 60 C.
• Etch material: diamond only.
For training, please contact Ling Xie, lxie@cns.fas.harvard.edu;
For hardware related issues, please contact David LaFleur, dlafleur@cns.fas.harvard.edu. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
| 4 | 4 | Register! | | | | Training: WB-2 EVG 501 Wafer Bonder Training - Inside cleanroom at WB-2 | | Trainer: Haojie Ji | | One group training session for full tool access. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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10:30 am - 11:30 am
| 3 | 3 | Register! | | |
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| Training: DOE-1 - ULVAC Deep Oxide Etcher - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | | DOE-1 - ULVAC Deep Oxide Etcher tool training at 3:30 pm | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:30 pm - 4:30 pm
617-495-1738 | 5 | 5 | Register! | | | | Training: EE-5 PVD System E-beam Evaporator Training - Dry Bay in cleanroom | | Trainer: Yumian Zhu | - PLEASE READ THE WHOLE TRAINING DESCRIPTION BEFORE SIGNING UP –
E-beam deposition for <500nm. If you need to deposit materials more than 500nm thick, please contact CNS staff before signing up for the training. EE-5 is an automated pumping and deposition e-beam system. Pd, Ni, Ti, and Cr are the only materials in EE-5. For Au, Pt, user need to bring their own materials and crucible. CNS staff will provide the training on how to install/remove their Au, Pt crucible from the tool. Cr is limited to 25nm in EE-5 (adhesive layer only). Materials are supplied by CNS. The system accommodates a substrate up to a (1) 6” wafer. Precision GLADS stage for tilting and rotating the substrate. Uniformity is about 5% over a 6” wafer, on a flat deposition, according to the vendor.
There is no cooling on the GLADS sample stage.
Training takes about one hour. You need to be able to show up on time and stay for the whole training. Please read through the SOP (linked in the confirmation email) before the training, it makes things go a lot smoother.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:00 pm
(check document links in confirmation email) | 3 | 3 | Register! | | | | Training: RIE-19 and RIE-14- Anatech SCE-106 Barrel Plasma System/Samco PC-300 Plasma Cleaning System - In front of the tool inside the cleanroom | | Trainer: Kenlin Huang | | Tool training for two tools:RIE-19 and RIE-14- Anatech SCE-106 Barrel Plasma System/Samco PC-300 Plasma Cleaning System | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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4:30 pm - 5:00 pm
617-495-1738 | 7 | 7 | Register! | | |
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| Training: SP-7 AJA UHV Sputter System Training - G-27 | | Trainer: Yumian Zhu | - PLEASE READ THE WHOLE TRAINING DESCRIPTION BEFORE SIGNING UP –
If you need to deposit a film thicker than 1000nm, please contact the staff before signing up.
SP-7 is a Hybrid PVD system includes Sputtering and E-beam system. This training is for the sputtering part. SP-7 is dedicated to the superconductive material deposition and application. No outgassing, organic substance, such as photoresist, PDMs, etc allow in the system. Venting chamber is not allowed in this tool. CNS will provide Nb, NbN, NbTi, MoRe, Aluminum targets. The system has two RF source, one 2” gun maximum power 300W, 30o to the substrate; one 3” gun maximum power 600W, vertical to the substrate. The substrate holder can accommodate 4” sample carrier. If user needs help, please contact the CNS staffs.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:30 pm
(check document links in confirmation email) | 4 | 4 | Register! | | |
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| Training: FIB 4 Helios Dual-Beam FIBSEM Training - LISE B15F | | Trainer: Austin Akey | | Basic introductory training on the FEI Helios 660 DB FIB/SEM. Covers basic instrument operation for cross-section milling and imaging. Advanced applications upon request. | | Time | Max Attendees | Available | CNS Users ONLY |
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1:00 pm - 5:00 pm
| 3 | 3 | Register! | | | | Training: RIE 8 STS ICP RIE Training - CNS Cleanroom at RIE 8 | | Trainer: Ling Xie | It is required to take the "Introduction to Dry Etching" before this training.
The RIE 8 is used to etch silicon, silicon oxide, silicon nitride, silicon carbide, and 2D materials.
Chamber Pre-Cleaning and Conditioning are Required: Before etching any samples, users must run the O2-Clean recipe for 20 minutes and the recipe to be used for 5-10 minutes.
The STS MPX/LPX RIE system is an Inductively Coupled Plasma (ICP) etching system. Using the ICP technology, this RIE is characterized with high plasma density, low operating pressure, high etch rate, excellent etch uniformity, and low energy ion damage. Available etching gases on this system include SF6, C4F8, O2, H2, Ar, Cl2, BCl3, and HBr. The maximum coil and platen powers are 1200W and 250W, respectively. Equipped with a chiller, the MPX/LPX system allows the substrate temperature to be controlled from 15C to 30C. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:30 pm - 3:00 pm
| 4 | 4 | Register! | | |
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| Training: RIE 10 Rapier DRIE Training - The first hour training is online, Zoom ID 990 9681 5765, passcode 315648, held outside the cleanroom and the rest of time is inside the cleanroom at the tool. | | Trainer: Ling Xie | It is required to take the "Introduction to Dry Etching" before this training.
The first hour training is online, Zoom ID 990 9681 5765, passcode 315648.
The SPTS Rapier system is for deep silicon etch only, it is configured with dual plasma sources, dual gas inlets, electro-static clamping chuck, AMS chiller to control the chuck temperature from -15�C to + 40�C, and Claritas end-point detector.
Specifications
� Etch rate: 1.0 � 10 �m/min
� Aspect ratio: 5 � 50
� Etch depth: 5�m � several hundreds of microns
� Feature size: nm � mm scales in lateral dimension
� Sider wall roughness (scallop depth): 6nm � 700nm
� Sample size ≤ 6�
� Etch mask: only resists and SiO2 allowed
The first hour training is online, Zoom ID 990 9681 5765, passcode 315648. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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1:00 pm - 3:30 pm
From 1pm-2pm, it is on Zoom, 2pm-3:30pm, in Cleanroom | 4 | 4 | Register! | | | | Training: RIE-13 - Oxford PlasmaPro 100 Cobra 300 - In front of the tool inside cleanroom | | Trainer: Kenlin Huang | | RIE-13 - Oxford PlasmaPro 100 Cobra 300 training at 3pm. | | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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3:00 pm - 4:00 pm
617-495-1738 | 5 | 5 | Register! | | | | Training: SP-3 AJA sputtering system training for 3-gun system - CNS cleanroom (G 07) Dry Bay | | Trainer: Yumian Zhu | Please read the training description all the way through.
If you need to deposit a film thicker than 500nm, please contact the staff before signing up.
This training is for standard operating procedure of SP-3 sputtering system. The system has one RF source and two DC sources (DC power supply is switchable between the two sources).The substrate holder can accommodate up to a 4” diameter wafer. SP-3 can deposit many different materials including conductive metals and oxide and nitride materials (Al, Cu, Si3N4, SiO2, etc.). No ferromagnetics (including Ni, Fe, Co) are allowed in SP-3. CNS does not supply Au or Pt for use in SP-3. The system has process O2 flow, process N2 flow, substrate heating to 850C, and can facilitate co-sputtering with one RF and one DC gun. After an additional one-to-one training for target changes, the user can then change targets on their own to fit their own schedule. After 3 uses (with no problems) users are given 24/7 access.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 4:00 pm
(check document links in confirmation email) | 3 | 3 | Register! | | | | Training: SW-6 PELCO LatticeAX 420 Sample Cleaving System Training - LISE-G27 | | Trainer: Haojie Ji | | One group training session for full tool access. | | Time | Max Attendees | Available | CNS Users ONLY |
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10:30 am - 11:30 am
| 3 | 3 | Register! | | | | Training: WB-3/4 Wedge and Ball Wire Bonders Training Part-1 Basic Operation - LISE-G27 | | Trainer: Haojie Ji | | Part-1, group training. Introduce WB-3 Al wedge bond and WB-4 Au ball bond. One more certificate session needed for full access. | | Time | Max Attendees | Available | CNS Users ONLY |
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2:00 pm - 4:30 pm
| 3 | 3 | Register! | | |
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| Training: SW-5 Disco Dicing Saw Training Part-1 Basic Operation - LISE-G06 | | Trainer: Haojie Ji | Part-1, group training. One more certificate session needed for full access.
User will also need to take G06 room safety orientation to have room access. | | Time | Max Attendees | Available | CNS Users ONLY |
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3:00 pm - 4:30 pm
| 3 | 3 | Register! | | |
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| Training: SP-7 AJA E-Beam System Training - G-27 | | Trainer: Yumian Zhu | - PLEASE READ THE WHOLE TRAINING DESCRIPTION BEFORE SIGNING UP –
If you need to deposit a film thicker than 500nm, please contact the staff before signing up.
SP-7 is a Hybrid PVD system includes Sputtering and Ebeam system. This training is for the E-beam part. SP-7 is dedicated to the superconductive material deposition and application. No outgassing, organic substance, such as photoresist, PDMs, etc… allow in the system. The system has 6 pockets that can carry 6 different materials. Currently the system can use aluminum, titanium, niobium. Venting chamber is not allowed in this tool. CNS will provide the materials. The substrate holder can accommodate 4” sample carrier. If user needs help, please contact the CNS staffs.
| | Time | Max Attendees | Available | LISE Cleanroom Users ONLY |
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2:00 pm - 3:30 pm
(check document links in confirmation email) | 4 | 4 | Register! | | |
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