Events
News
17 Feb, 2026
2026 CNS Spring Seminar Series
LISE 303, 1-2pm
Feb 20th: Prof. Donhee Ham, Harvard University
Feb 27th: Tony Song, Loncar Group, Harvard University
Mar 6th: David Kirkwood, Axelis
Mar 13th: Jonathan Zuberman, Kim Group, Harvard University
Mar 27th: Patrick Forrester, Yacoby Group, Harvard University
Apr 3rd: Ted Letsou, Capasso Group, Harvard University
Apr 10th: Erick Ramosmurillo, Alkemie
Apr 24th: Guanhao Huang, Loncar Group, Harvard University
May 1st: Jae Hyeong Lee, 3D-Architech
May 8th: Jason Yu, Hekstra Group, Harvard University
May 15th: Aaron Day, Loncar & Munday Groups, Harvard University
Contacts: Ling Xie lxie@cns.fas.Harvard.edu, William Wilson wwilson@cns.fas.Harvard.edu
[+MORE]
03 Dec, 2025
CNS vendor talks by SPTS
Tue, Dec 9th 2025 Pierce Hall 209
AGENDA
- Topic 1 = SPTS/RIE 11:00am -12:30pm
- Lunch break = 12:30pm -1:30pm
- Topic 2 = SPTS/PECVD 1:30pm -3 :00pm
SPEAKER
Brian Yount
KLA Corporation, SPTS Division
(Speaker Bio will be updated shortly)
REGISTRATION LINK
https://cns1.rc.fas.harvard.edu/training-sign-up/?eid=49050
ABSTRACTS
Topic 1: Etch (ICP) Tue, Dec 9th 11:00-12:30pm
This presentation provides an in-depth overview of the Omega Inductively Coupled Plasma (ICP) Etch platform, tailored for advanced microfabrication research and development. The Omega ICP system supports a wide range of wafer sizes (75–200 mm) and is compatible with multiple process modules, including LPX, c2L, fxP, and Versalis cluster platforms. The platform’s modularity enables integration of etch, CVD, PVD, and other process technologies, making it highly adaptable for both R&D and high-volume manufacturing. Key features include robust electrostatic clamping, advanced endpoint detection methods (such as optical emission spectroscopy and white light interferometry), and precise temperature control for both cold and hot platen operations. The ICP module excels in etching a diverse array of materials—dielectrics, metals, III-V compounds (e.g., GaAs, InP, GaN), and organics—while supporting low-damage etch processes via HALO low-power biasing.
Application examples demonstrate high etch rates, excellent uniformity, and steep profile control for complex structures such as VCSEL stacks, LEDs, and MEMS devices. The system’s flexibility, process stability, and proven hardware reliability position Omega ICP as a leading solution for compound semiconductor etching and advanced device fabrication in academic and industrial settings.
Topic 2: Deposition (PECVD) Tue, Dec 9th 1:30-3:00pm
This presentation introduces the Delta PECVD platform, a versatile solution for advanced thin film deposition in microfabrication, as developed by SPTS Division. Delta PECVD supports a wide range of applications, including MEMS, sensors, power electronics, RF, photonics, quantum, and advanced packaging. The system’s modular single-wafer architecture enables precise control over film stress, uniformity, and repeatability, accommodating wafer sizes from 75 mm to 300 mm. Key innovations include active air-cooled platen temperature control (80°C–400°C), patented RPS NF₃ chamber cleaning for enhanced productivity, and edge-contact PECVD for backside deposition.
The platform offers a broad selection of dielectric films—such as SiO₂, SiN, SiON, α-Si, α-C, and TEOS—optimized for low-temperature processing and high-quality step coverage. Stress tuning via RF power modulation allows for both compressive and tensile states, essential for thin wafer and gap-fill applications. Case studies highlight low-temperature TEOS trench fill, TSV last liner deposition, and amorphous silicon and carbon films for MEMS and photonics. Delta PECVD demonstrates high throughput, robust electrical isolation, and stable film properties, positioning it as a leading technology for next-generation semiconductor manufacturing.
[+MORE]Recent Publications
-
Power Handling Modeling of Micro-and Nanoacoustic Resonators
0
-
High-Performance Solidly Mounted Bidimensional Mode Resonators (S2MRs) Operating Around 16 GHz
0
-
18 GHz Filters based on Cross-Sectional Lamé Mode Resonators (CLMRs)
1
-
Thin absorber AlInAsSb SACM APDs with photon-trapping gratings for eSWIR applications
Hannaneh Karimi, Qi Lin, Evan L. Simmons, Byron D. Aguilar, J. Andrew McArthur, Artem Talanov, Kubra Circir, A. Adam Dadey, Ellie Wang, Dekang Chen, Veronica Fisher, Tanner Pearson, Kyle J. Dorsey, Seth R. Bank, and Joe C. Campbell, "Thin absorber AlInAsSb SACM APDs with photon-trapping gratings for eSWIR applications," Optica 12, 1931-1935 (2025)
-
Modeling and Validation of Anisotropic Thin-Film Deposition on Cylindrical Substrates for Predictable Resistance Control in MEMS Fabrication
Res Sq [Preprint]. 2025 Dec 9:rs.3.rs-8253144. doi: 10.21203/rs.3.rs-8253144/v1. PMID: 41510225; PMCID: PMC12776485.
-
Enhanced Antibiotic Release and Mechanical Strength in UHMWPE Antibiotic Blends: The Role of Submicron Gentamicin Sulfate Particles
JBJS
-
Bat butt biology: sexual dimorphism is a major factor in determining bat pelvic shape
SICB 2026 Portland conference presentation
-
A tight spot: Roosting in recesses physically restricts bat evolution. Wed, January 07
conference presentation SICB portland 2026
-
Molecular Beam Epitaxy Growth of InAs1-xBix on GaSb for Topological Insulating States
MRS Fall Meeting, Boston 2025, Conference Presentation
-
When Smoke Enters the City: Challenges for HVAC Filters in Resilient Buildings
Shirman, T.; Zamani, H.; Liu, S. When Smoke Enters the City: Challenges for HVAC Filters in Resilient Buildings. Urban Sci. 2026, 10, 99. https://doi.org/10.3390/urbansci10020099
WILLIAM WILSONEXECUTIVE DIRECTOR
Directors Welcome
The Center for Nanoscale Systems (CNS) at Harvard University was created with a very clear vision: To provide a collaborative multi-disciplinary research environment to support of the creation and evolution of world-class nanoscience and technical expertise, for the Harvard research community as well as the larger community of external researchers both from academia and industry.
Our Core Values:
Facilitating leading-edge, multi-disciplinary, research a
[+MORE]
ROBERT WESTERVELTDIRECTOR